TW200701817A - Method for producing polymeric capacitive ultrasonic transducer - Google Patents
Method for producing polymeric capacitive ultrasonic transducerInfo
- Publication number
- TW200701817A TW200701817A TW094120108A TW94120108A TW200701817A TW 200701817 A TW200701817 A TW 200701817A TW 094120108 A TW094120108 A TW 094120108A TW 94120108 A TW94120108 A TW 94120108A TW 200701817 A TW200701817 A TW 200701817A
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber part
- ultrasonic transducer
- conductor
- substrate
- capacitive ultrasonic
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004020 conductor Substances 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
- B81B7/0012—Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q70/00—General aspects of SPM probes, their manufacture or their related instrumentation, insofar as they are not specially adapted to a single SPM technique covered by group G01Q60/00
- G01Q70/16—Probe manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q90/00—Scanning-probe techniques or apparatus not otherwise provided for
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0102—Surface micromachining
- B81C2201/0105—Sacrificial layer
- B81C2201/0108—Sacrificial polymer, ashing of organics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/4908—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.
Landscapes
- Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Toxicology (AREA)
- General Physics & Mathematics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Signal Processing (AREA)
- Acoustics & Sound (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Micromachines (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094120108A TWI260940B (en) | 2005-06-17 | 2005-06-17 | Method for producing polymeric capacitive ultrasonic transducer |
US11/212,611 US7673375B2 (en) | 2005-06-17 | 2005-08-29 | Method of fabricating a polymer-based capacitive ultrasonic transducer |
GB0519271A GB2427321B (en) | 2005-06-17 | 2005-09-21 | Method of fabricating a polymer-based capacitive ultrasonic transducer |
KR1020050093337A KR100634994B1 (ko) | 2005-06-17 | 2005-10-05 | 고분자계 용량적 초음파 변환기의 제조 방법 |
FR0510463A FR2887242A1 (fr) | 2005-06-17 | 2005-10-13 | Procede pour fabriquer un transducteur ultrasonore capacitif a base de polymere |
DE102005051604A DE102005051604A1 (de) | 2005-05-17 | 2005-10-27 | Verfahren zum Herstellen eines Ultraschallwandlers |
JP2005322598A JP4142040B2 (ja) | 2005-06-17 | 2005-11-07 | 高分子基コンデンサー超音波エネルギー転換器の製造方法 |
US12/348,452 US20090126183A1 (en) | 2005-06-17 | 2009-01-05 | Method of fabricating a polymer-based capacitive ultrasonic transducer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094120108A TWI260940B (en) | 2005-06-17 | 2005-06-17 | Method for producing polymeric capacitive ultrasonic transducer |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI260940B TWI260940B (en) | 2006-08-21 |
TW200701817A true TW200701817A (en) | 2007-01-01 |
Family
ID=35249173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094120108A TWI260940B (en) | 2005-05-17 | 2005-06-17 | Method for producing polymeric capacitive ultrasonic transducer |
Country Status (7)
Country | Link |
---|---|
US (2) | US7673375B2 (zh) |
JP (1) | JP4142040B2 (zh) |
KR (1) | KR100634994B1 (zh) |
DE (1) | DE102005051604A1 (zh) |
FR (1) | FR2887242A1 (zh) |
GB (1) | GB2427321B (zh) |
TW (1) | TWI260940B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102538850A (zh) * | 2012-01-04 | 2012-07-04 | 无锡智超医疗器械有限公司 | 一种电容式微机电超声传感器及其制作方法 |
CN108918662A (zh) * | 2018-05-16 | 2018-11-30 | 西安交通大学 | 一种CMUTs流体密度传感器及其制备方法 |
TWI750862B (zh) * | 2020-10-23 | 2021-12-21 | 友達光電股份有限公司 | 電容式超音波換能器及其製造方法 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI268183B (en) | 2005-10-28 | 2006-12-11 | Ind Tech Res Inst | Capacitive ultrasonic transducer and method of fabricating the same |
US7764003B2 (en) * | 2006-04-04 | 2010-07-27 | Kolo Technologies, Inc. | Signal control in micromachined ultrasonic transducer |
US7721397B2 (en) * | 2007-02-07 | 2010-05-25 | Industrial Technology Research Institute | Method for fabricating capacitive ultrasonic transducers |
WO2008134909A1 (de) * | 2007-05-07 | 2008-11-13 | Baumer Electric Ag | Akustischer wandler |
GB2452941B (en) * | 2007-09-19 | 2012-04-11 | Wolfson Microelectronics Plc | Mems device and process |
US7856883B2 (en) * | 2008-03-24 | 2010-12-28 | Industrial Technology Research Institute | Capacitive ultrasonic sensors and display devices using the same |
GB2459866B (en) * | 2008-05-07 | 2011-08-31 | Wolfson Microelectronics Plc | Mems transducer |
US8402831B2 (en) * | 2009-03-05 | 2013-03-26 | The Board Of Trustees Of The Leland Standford Junior University | Monolithic integrated CMUTs fabricated by low-temperature wafer bonding |
JP5377066B2 (ja) | 2009-05-08 | 2013-12-25 | キヤノン株式会社 | 静電容量型機械電気変換素子及びその製法 |
US8428286B2 (en) * | 2009-11-30 | 2013-04-23 | Infineon Technologies Ag | MEMS microphone packaging and MEMS microphone module |
JP2011244425A (ja) * | 2010-04-23 | 2011-12-01 | Canon Inc | 電気機械変換装置及びその作製方法 |
EP2654196B1 (en) * | 2011-10-11 | 2017-06-14 | Sumitomo Riko Company Limited | Transducer |
FR2982414B1 (fr) * | 2011-11-09 | 2014-08-22 | Commissariat Energie Atomique | Procede ameliore de realisation d'un dispositif a cavite formee entre un element suspendu reposant sur des plots isolants semi-enterres dans un substrat et ce substrat |
US8586455B1 (en) * | 2012-05-15 | 2013-11-19 | International Business Machines Corporation | Preventing shorting of adjacent devices |
JP6071285B2 (ja) * | 2012-07-06 | 2017-02-01 | キヤノン株式会社 | 静電容量型トランスデューサ |
JP6057571B2 (ja) * | 2012-07-06 | 2017-01-11 | キヤノン株式会社 | 静電容量型トランスデューサ |
US9364862B2 (en) * | 2012-11-02 | 2016-06-14 | University Of Windsor | Ultrasonic sensor microarray and method of manufacturing same |
CN103217228B (zh) * | 2013-03-15 | 2015-04-29 | 西安交通大学 | 一种基于cmut的温度传感器及制备和应用方法 |
US20150109889A1 (en) * | 2013-10-17 | 2015-04-23 | Merry Electronics (Shenzhen) Co., Ltd. | Acoustic transducer with membrane supporting structure |
US20160337761A1 (en) * | 2014-01-13 | 2016-11-17 | Board Of Regents, The University Of Texas System | Surface micromachined microphone with broadband signal detection |
MY167930A (en) * | 2014-05-07 | 2018-10-04 | Mimos Berhad | An etch-free method for conductive electrode formation |
EP3729020B1 (en) * | 2017-12-19 | 2024-09-18 | The University of British Columbia | Layered structure and method for fabricating same |
US11219913B2 (en) * | 2019-03-20 | 2022-01-11 | William Allen Smith | Wheel guard to shield wheels from tire dressing |
DE102019203829B4 (de) * | 2019-03-20 | 2020-12-31 | Vitesco Technologies GmbH | Verfahren zum Herstellen einer Fluidsensorvorrichtung und Fluidsensorvorrichtung |
CN119533639A (zh) * | 2024-11-08 | 2025-02-28 | 合肥领航微系统集成有限公司 | 一种基于有机聚合物结构的超声波传感器及制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5287331A (en) * | 1992-10-26 | 1994-02-15 | Queen's University | Air coupled ultrasonic transducer |
FR2697675B1 (fr) | 1992-11-05 | 1995-01-06 | Suisse Electronique Microtech | Procédé de fabrication de transducteurs capacitifs intégrés. |
US5619476A (en) | 1994-10-21 | 1997-04-08 | The Board Of Trustees Of The Leland Stanford Jr. Univ. | Electrostatic ultrasonic transducer |
US6316796B1 (en) | 1995-05-24 | 2001-11-13 | Lucas Novasensor | Single crystal silicon sensor with high aspect ratio and curvilinear structures |
US5704105A (en) * | 1996-09-04 | 1998-01-06 | General Electric Company | Method of manufacturing multilayer array ultrasonic transducers |
US6295247B1 (en) | 1998-10-02 | 2001-09-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined rayleigh, lamb, and bulk wave capacitive ultrasonic transducers |
US6271620B1 (en) | 1999-05-20 | 2001-08-07 | Sen Corporation | Acoustic transducer and method of making the same |
US6246158B1 (en) | 1999-06-24 | 2001-06-12 | Sensant Corporation | Microfabricated transducers formed over other circuit components on an integrated circuit chip and methods for making the same |
US6430109B1 (en) | 1999-09-30 | 2002-08-06 | The Board Of Trustees Of The Leland Stanford Junior University | Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections |
US6867535B1 (en) * | 1999-11-05 | 2005-03-15 | Sensant Corporation | Method of and apparatus for wafer-scale packaging of surface microfabricated transducers |
US6249075B1 (en) | 1999-11-18 | 2001-06-19 | Lucent Technologies Inc. | Surface micro-machined acoustic transducers |
US6443901B1 (en) * | 2000-06-15 | 2002-09-03 | Koninklijke Philips Electronics N.V. | Capacitive micromachined ultrasonic transducers |
JP4104550B2 (ja) * | 2001-10-23 | 2008-06-18 | シンデル,ディヴィッド,ダヴリュ. | 超音波プリント回路基板トランスデューサ |
US7087023B2 (en) * | 2003-02-14 | 2006-08-08 | Sensant Corporation | Microfabricated ultrasonic transducers with bias polarity beam profile control and method of operating the same |
WO2005077012A2 (en) * | 2004-02-06 | 2005-08-25 | Georgia Tech Research Corporation | Cmut devices and fabrication methods |
US8008835B2 (en) * | 2004-02-27 | 2011-08-30 | Georgia Tech Research Corporation | Multiple element electrode cMUT devices and fabrication methods |
EP1725343A2 (en) * | 2004-03-11 | 2006-11-29 | Georgia Technology Research Corporation | Asymmetric membrane cmut devices and fabrication methods |
-
2005
- 2005-06-17 TW TW094120108A patent/TWI260940B/zh not_active IP Right Cessation
- 2005-08-29 US US11/212,611 patent/US7673375B2/en active Active
- 2005-09-21 GB GB0519271A patent/GB2427321B/en not_active Expired - Fee Related
- 2005-10-05 KR KR1020050093337A patent/KR100634994B1/ko not_active Expired - Fee Related
- 2005-10-13 FR FR0510463A patent/FR2887242A1/fr not_active Withdrawn
- 2005-10-27 DE DE102005051604A patent/DE102005051604A1/de not_active Ceased
- 2005-11-07 JP JP2005322598A patent/JP4142040B2/ja not_active Expired - Fee Related
-
2009
- 2009-01-05 US US12/348,452 patent/US20090126183A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102538850A (zh) * | 2012-01-04 | 2012-07-04 | 无锡智超医疗器械有限公司 | 一种电容式微机电超声传感器及其制作方法 |
CN108918662A (zh) * | 2018-05-16 | 2018-11-30 | 西安交通大学 | 一种CMUTs流体密度传感器及其制备方法 |
TWI750862B (zh) * | 2020-10-23 | 2021-12-21 | 友達光電股份有限公司 | 電容式超音波換能器及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
GB2427321A (en) | 2006-12-20 |
TWI260940B (en) | 2006-08-21 |
US7673375B2 (en) | 2010-03-09 |
GB0519271D0 (en) | 2005-10-26 |
JP4142040B2 (ja) | 2008-08-27 |
KR100634994B1 (ko) | 2006-10-16 |
US20070013266A1 (en) | 2007-01-18 |
FR2887242A1 (fr) | 2006-12-22 |
US20090126183A1 (en) | 2009-05-21 |
JP2006352823A (ja) | 2006-12-28 |
DE102005051604A1 (de) | 2006-11-23 |
GB2427321B (en) | 2007-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200701817A (en) | Method for producing polymeric capacitive ultrasonic transducer | |
WO2007080427A3 (en) | Method of making microneedles | |
TW200746630A (en) | Piezoelectric resonator and method for manufacturing thereof | |
TW200644046A (en) | Method for manufacturing a film bulk acoustic resonator | |
TW200603261A (en) | Method of forming a recessed structure employing a reverse tone process | |
MY163758A (en) | Pre-molded clip structure | |
WO2006025967A3 (en) | Semiconductor processing using energized hydrogen gas and in combination with wet cleaning | |
EP2040521A3 (en) | Method of manufacturing substrate | |
TW200739978A (en) | MEMS process and device | |
WO2007019188A3 (en) | Manufacture of photovoltaic devices | |
TW200703574A (en) | Capacitorless DRAM on bulk silicon | |
WO2008081935A1 (ja) | 弾性表面波装置およびその製造方法 | |
WO2009011315A1 (ja) | 防水通音膜、防水通音膜の製造方法およびそれを用いた電気製品 | |
TW200704582A (en) | Semiconductor composite device and method of manufacturing the same | |
WO2004109770A3 (en) | Through wafer via process and amplifier with through wafer via | |
WO2007017404A3 (de) | Anordnung zur hermetischen abdichtung von bauelementen und verfahren zu deren herstellung | |
WO2007044530A3 (en) | Methods and apparatus for epitaxial film formation | |
TW200729516A (en) | Semiconductor device and method for fabricating the same | |
TW200737589A (en) | Electronic device and antenna structure thereof | |
TW200700811A (en) | A display apparatus substrate and manufacturing method, and a display apparatus thereof | |
WO2009143354A3 (en) | Insulated film use in a mems device | |
TW200721915A (en) | Electrostatic chuck for vacuum processing apparatus, vacuum processing apparatus having the same, and method for manufacturing the same | |
TW200712613A (en) | Method for supporting a flexible substrate and method for manufacturing a flexible display | |
WO2009008973A3 (en) | Method for forming an acoustic mirror with reduced metal layer roughness and related structure | |
TW200631784A (en) | Primed substrate comprising conductive polymer layer and method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |