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TW200701817A - Method for producing polymeric capacitive ultrasonic transducer - Google Patents

Method for producing polymeric capacitive ultrasonic transducer

Info

Publication number
TW200701817A
TW200701817A TW094120108A TW94120108A TW200701817A TW 200701817 A TW200701817 A TW 200701817A TW 094120108 A TW094120108 A TW 094120108A TW 94120108 A TW94120108 A TW 94120108A TW 200701817 A TW200701817 A TW 200701817A
Authority
TW
Taiwan
Prior art keywords
chamber part
ultrasonic transducer
conductor
substrate
capacitive ultrasonic
Prior art date
Application number
TW094120108A
Other languages
English (en)
Other versions
TWI260940B (en
Inventor
Ming-Wei Chang
Da-Chen Pang
Chao-Sheng Tseng
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW094120108A priority Critical patent/TWI260940B/zh
Priority to US11/212,611 priority patent/US7673375B2/en
Priority to GB0519271A priority patent/GB2427321B/en
Priority to KR1020050093337A priority patent/KR100634994B1/ko
Priority to FR0510463A priority patent/FR2887242A1/fr
Priority to DE102005051604A priority patent/DE102005051604A1/de
Priority to JP2005322598A priority patent/JP4142040B2/ja
Application granted granted Critical
Publication of TWI260940B publication Critical patent/TWI260940B/zh
Publication of TW200701817A publication Critical patent/TW200701817A/zh
Priority to US12/348,452 priority patent/US20090126183A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0012Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01QSCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q70/00General aspects of SPM probes, their manufacture or their related instrumentation, insofar as they are not specially adapted to a single SPM technique covered by group G01Q60/00
    • G01Q70/16Probe manufacture
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292Electrostatic transducers, e.g. electret-type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01QSCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q90/00Scanning-probe techniques or apparatus not otherwise provided for
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102Surface micromachining
    • B81C2201/0105Sacrificial layer
    • B81C2201/0108Sacrificial polymer, ashing of organics
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/43Electric condenser making
    • Y10T29/435Solid dielectric type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49005Acoustic transducer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/4908Acoustic transducer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49194Assembling elongated conductors, e.g., splicing, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
TW094120108A 2005-05-17 2005-06-17 Method for producing polymeric capacitive ultrasonic transducer TWI260940B (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
TW094120108A TWI260940B (en) 2005-06-17 2005-06-17 Method for producing polymeric capacitive ultrasonic transducer
US11/212,611 US7673375B2 (en) 2005-06-17 2005-08-29 Method of fabricating a polymer-based capacitive ultrasonic transducer
GB0519271A GB2427321B (en) 2005-06-17 2005-09-21 Method of fabricating a polymer-based capacitive ultrasonic transducer
KR1020050093337A KR100634994B1 (ko) 2005-06-17 2005-10-05 고분자계 용량적 초음파 변환기의 제조 방법
FR0510463A FR2887242A1 (fr) 2005-06-17 2005-10-13 Procede pour fabriquer un transducteur ultrasonore capacitif a base de polymere
DE102005051604A DE102005051604A1 (de) 2005-05-17 2005-10-27 Verfahren zum Herstellen eines Ultraschallwandlers
JP2005322598A JP4142040B2 (ja) 2005-06-17 2005-11-07 高分子基コンデンサー超音波エネルギー転換器の製造方法
US12/348,452 US20090126183A1 (en) 2005-06-17 2009-01-05 Method of fabricating a polymer-based capacitive ultrasonic transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094120108A TWI260940B (en) 2005-06-17 2005-06-17 Method for producing polymeric capacitive ultrasonic transducer

Publications (2)

Publication Number Publication Date
TWI260940B TWI260940B (en) 2006-08-21
TW200701817A true TW200701817A (en) 2007-01-01

Family

ID=35249173

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120108A TWI260940B (en) 2005-05-17 2005-06-17 Method for producing polymeric capacitive ultrasonic transducer

Country Status (7)

Country Link
US (2) US7673375B2 (zh)
JP (1) JP4142040B2 (zh)
KR (1) KR100634994B1 (zh)
DE (1) DE102005051604A1 (zh)
FR (1) FR2887242A1 (zh)
GB (1) GB2427321B (zh)
TW (1) TWI260940B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102538850A (zh) * 2012-01-04 2012-07-04 无锡智超医疗器械有限公司 一种电容式微机电超声传感器及其制作方法
CN108918662A (zh) * 2018-05-16 2018-11-30 西安交通大学 一种CMUTs流体密度传感器及其制备方法
TWI750862B (zh) * 2020-10-23 2021-12-21 友達光電股份有限公司 電容式超音波換能器及其製造方法

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* Cited by examiner, † Cited by third party
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TWI268183B (en) 2005-10-28 2006-12-11 Ind Tech Res Inst Capacitive ultrasonic transducer and method of fabricating the same
US7764003B2 (en) * 2006-04-04 2010-07-27 Kolo Technologies, Inc. Signal control in micromachined ultrasonic transducer
US7721397B2 (en) * 2007-02-07 2010-05-25 Industrial Technology Research Institute Method for fabricating capacitive ultrasonic transducers
WO2008134909A1 (de) * 2007-05-07 2008-11-13 Baumer Electric Ag Akustischer wandler
GB2452941B (en) * 2007-09-19 2012-04-11 Wolfson Microelectronics Plc Mems device and process
US7856883B2 (en) * 2008-03-24 2010-12-28 Industrial Technology Research Institute Capacitive ultrasonic sensors and display devices using the same
GB2459866B (en) * 2008-05-07 2011-08-31 Wolfson Microelectronics Plc Mems transducer
US8402831B2 (en) * 2009-03-05 2013-03-26 The Board Of Trustees Of The Leland Standford Junior University Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
JP5377066B2 (ja) 2009-05-08 2013-12-25 キヤノン株式会社 静電容量型機械電気変換素子及びその製法
US8428286B2 (en) * 2009-11-30 2013-04-23 Infineon Technologies Ag MEMS microphone packaging and MEMS microphone module
JP2011244425A (ja) * 2010-04-23 2011-12-01 Canon Inc 電気機械変換装置及びその作製方法
EP2654196B1 (en) * 2011-10-11 2017-06-14 Sumitomo Riko Company Limited Transducer
FR2982414B1 (fr) * 2011-11-09 2014-08-22 Commissariat Energie Atomique Procede ameliore de realisation d'un dispositif a cavite formee entre un element suspendu reposant sur des plots isolants semi-enterres dans un substrat et ce substrat
US8586455B1 (en) * 2012-05-15 2013-11-19 International Business Machines Corporation Preventing shorting of adjacent devices
JP6071285B2 (ja) * 2012-07-06 2017-02-01 キヤノン株式会社 静電容量型トランスデューサ
JP6057571B2 (ja) * 2012-07-06 2017-01-11 キヤノン株式会社 静電容量型トランスデューサ
US9364862B2 (en) * 2012-11-02 2016-06-14 University Of Windsor Ultrasonic sensor microarray and method of manufacturing same
CN103217228B (zh) * 2013-03-15 2015-04-29 西安交通大学 一种基于cmut的温度传感器及制备和应用方法
US20150109889A1 (en) * 2013-10-17 2015-04-23 Merry Electronics (Shenzhen) Co., Ltd. Acoustic transducer with membrane supporting structure
US20160337761A1 (en) * 2014-01-13 2016-11-17 Board Of Regents, The University Of Texas System Surface micromachined microphone with broadband signal detection
MY167930A (en) * 2014-05-07 2018-10-04 Mimos Berhad An etch-free method for conductive electrode formation
EP3729020B1 (en) * 2017-12-19 2024-09-18 The University of British Columbia Layered structure and method for fabricating same
US11219913B2 (en) * 2019-03-20 2022-01-11 William Allen Smith Wheel guard to shield wheels from tire dressing
DE102019203829B4 (de) * 2019-03-20 2020-12-31 Vitesco Technologies GmbH Verfahren zum Herstellen einer Fluidsensorvorrichtung und Fluidsensorvorrichtung
CN119533639A (zh) * 2024-11-08 2025-02-28 合肥领航微系统集成有限公司 一种基于有机聚合物结构的超声波传感器及制备方法

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US6295247B1 (en) 1998-10-02 2001-09-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined rayleigh, lamb, and bulk wave capacitive ultrasonic transducers
US6271620B1 (en) 1999-05-20 2001-08-07 Sen Corporation Acoustic transducer and method of making the same
US6246158B1 (en) 1999-06-24 2001-06-12 Sensant Corporation Microfabricated transducers formed over other circuit components on an integrated circuit chip and methods for making the same
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102538850A (zh) * 2012-01-04 2012-07-04 无锡智超医疗器械有限公司 一种电容式微机电超声传感器及其制作方法
CN108918662A (zh) * 2018-05-16 2018-11-30 西安交通大学 一种CMUTs流体密度传感器及其制备方法
TWI750862B (zh) * 2020-10-23 2021-12-21 友達光電股份有限公司 電容式超音波換能器及其製造方法

Also Published As

Publication number Publication date
GB2427321A (en) 2006-12-20
TWI260940B (en) 2006-08-21
US7673375B2 (en) 2010-03-09
GB0519271D0 (en) 2005-10-26
JP4142040B2 (ja) 2008-08-27
KR100634994B1 (ko) 2006-10-16
US20070013266A1 (en) 2007-01-18
FR2887242A1 (fr) 2006-12-22
US20090126183A1 (en) 2009-05-21
JP2006352823A (ja) 2006-12-28
DE102005051604A1 (de) 2006-11-23
GB2427321B (en) 2007-05-16

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees