[go: up one dir, main page]

Daugherty, 1994 - Google Patents

Cleaning and pelliclization

Daugherty, 1994

Document ID
5062154457528158058
Author
Daugherty S
Publication year
Publication venue
64-to 256-Megabit Reticle Generation: Technology Requirements and Approaches: A Critical Review

External Links

Snippet

The final step in the reticle manufacturing process takes place in the Cleaning and Pelliclization Area. Traditionally, this area covers reticle clean, pellicle mount, and particle inspection. Pellicles are used to protect the clean reticle: the pellicle membrane holds air …
Continue reading at www.spiedigitallibrary.org (other versions)

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/94Investigating contamination, e.g. dust
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece

Similar Documents

Publication Publication Date Title
KR101255923B1 (en) Methods and systems for detecting defects on a reticle
Turkot et al. EUV progress toward HVM readiness
US8064038B2 (en) Inspection apparatus, lithographic system provided with the inspection apparatus and a method for inspecting a sample
US7630053B2 (en) Method of manufacturing semiconductor device and liquid immersion lithography system
Miyai et al. Actinic patterned mask defect inspection for EUV lithography
US7130037B1 (en) Systems for inspecting wafers and reticles with increased resolution
Liang et al. EUV mask infrastructure readiness and gaps for TD and HVM
Bonam et al. EUV mask and wafer defectivity: strategy and evaluation for full die defect inspection
Goldfarb et al. Through-pellicle defect inspection of EUV masks using an ArF-based inspection tool
Weiss et al. Actinic review of EUV masks: first results from the AIMS EUV system integration
Kamo et al. Evaluation of extreme ultraviolet mask defect using blank inspection, patterned mask inspection, and wafer inspection
Daugherty Cleaning and pelliclization
Lawliss et al. Repairing native defects on EUV mask blanks
Jonckheere EUV mask defectivity–a process of increasing control toward HVM
Hirano et al. EUV patterned mask inspection performance of an advanced projection electron microscope (PEM) system for hp 16 nm and beyond
van de Kerkhof et al. Particle removal tool to repair particle defects on EUV reticles
Gallagher et al. Learning from native defects on EUV mask blanks
Woo et al. Through-pellicle imaging of extreme ultraviolet mask with extreme ultraviolet ptychography microscope
Broadbent Jr et al. 1X HP EUV reticle inspection with a 193nm inspection system
Kohyama et al. An update on the improvement in optimization of point-of-use filtration of metal oxide photoresists
Turley et al. Exploring EUV mask backside defectivity and control methods
Takai et al. Process capability of etched multilayer EUV mask
Cheong et al. EUV mask cleans comparison of frontside and dual-sided concurrent cleaning
Naka et al. Capability of particle inspection on patterned EUV mask using model EBEYE M
Harada et al. Development of actual EUV mask observation method for micro coherent EUV scatterometry microscope