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Stölmacker et al., 2019 - Google Patents

Electroplated gold microstuds for thermocompression bonding of UV LED chips

Stölmacker et al., 2019

Document ID
528518655609900982
Author
Stölmacker C
Ploch N
Thies A
Hochheim S
Rass J
Schnieder F
Mogilatenko A
Ruschel J
Kolbe T
Knigge S
Einfeldt S
Publication year
Publication venue
IEEE Transactions on Components, Packaging and Manufacturing Technology

External Links

Snippet

A bonding technology using electroplated Au microstuds for ultraviolet (UV) light-emitting diodes (LEDs) has been investigated. Au studs with diameter, height, and pitch of about 15, 8, and, respectively, were electroplated on standard UV LED chips on wafer level. The …
Continue reading at ieeexplore.ieee.org (other versions)

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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
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