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Liu et al., 2024 - Google Patents

Improving the Manufacturability of Low-Temperature GaN Ohmic Contact by Blocking the Fluorine Ion Injection

Liu et al., 2024

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Document ID
6091960958969166642
Author
Liu T
Li X
Han Z
Zhai L
Wang J
You S
Zhang J
Zhang J
Cheng Z
Zhang Y
Li Q
Hao Y
Publication year
Publication venue
IEEE Journal of the Electron Devices Society

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Snippet

Stabilizing the CMOS-compatible low-temperature Au-free GaN Ohmic contact is a critical work that determines the performance and yield of GaN power HEMTs in mass production. The instability of this contact has been puzzling the industry and academia for years. In this …
Continue reading at ieeexplore.ieee.org (PDF) (other versions)

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    • H01L29/7787Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
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