[go: up one dir, main page]

Barkshire et al., 1995 - Google Patents

Multi-spectral scanning Auger microscopy of tribological surfaces

Barkshire et al., 1995

Document ID
7168949001505918651
Author
Barkshire I
Prutton M
Smith G
Publication year
Publication venue
Applied surface science

External Links

Snippet

The novel surface analysis technique of multi-spectral Auger microscopy (MULSAM) has been used to study simultaneously and at high resolution the chemical and topographic variations across wear scars generated with model oil formulations. This is the first time this …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons by measuring secondary emission
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons by measuring secondary emission using electron or ion microprobe or incident electron or ion beam
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons by measuring secondary emission using electron or ion microprobe or incident electron or ion beam with incident electron beam
    • G01N23/2252—Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons by measuring secondary emission using electron or ion microprobe or incident electron or ion beam with incident electron beam and measuring excited X-rays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons by transmitting the radiation through the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/10—Different kinds of radiation or particles
    • G01N2223/102—Different kinds of radiation or particles beta or electrons
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by the preceding groups

Similar Documents

Publication Publication Date Title
Newbury et al. Elemental mapping of microstructures by scanning electron microscopy-energy dispersive X-ray spectrometry (SEM-EDS): extraordinary advances with the silicon drift detector (SDD)
US6320655B1 (en) Defect-position identifying method for semiconductor substrate
US6608305B1 (en) Selective deposition of a particle beam based on charging characteristics of a sample
Shao et al. Cepstral scanning transmission electron microscopy imaging of severe lattice distortions
Barkshire et al. Multi-spectral scanning Auger microscopy of tribological surfaces
JP6795010B2 (en) X-ray analysis method and X-ray analyzer
Nagoshi et al. Extraction of topographic and material contrasts on surfaces from SEM images obtained by energy filtering detection with low-energy primary electrons
Parish et al. Multivariate statistics applications in phase analysis of STEM-EDS spectrum images
Walton et al. Quantitative surface chemical‐state microscopy by x‐ray photoelectron spectroscopy
JP2023541112A (en) Computer-aided method for determining the elemental fraction, in particular the Li fraction, of identified elements with low atomic numbers and corresponding devices for processing the data
JP2018163153A (en) Method for analyzing powder shape, method for evaluating fluidity of powder, and method for evaluating fluidity of resin in which powder is dispersed
Barkshire et al. Automatic removal of substrate backscattering effects in Auger imaging and spectroscopy
Walther Recent improvements in quantification of energy‐dispersive X‐ray spectra and maps in electron microscopy of semiconductors
Smith et al. Further developments in quantitative X‐ray photoelectron spectromicroscopy: preliminary results from the study of germanium corrosion
Prutton et al. Quantitative surface chemical mapping with Auger and backscattered electron signals
Barr et al. Contrast formation in focused ion beam images of polycrystalline aluminum
US6720564B1 (en) Method and apparatus for fingerprint detection and analysis
Kothleitner et al. Elemental occurrence maps: a starting point for quantitative EELS spectrum image processing
Brodusch et al. Phase differentiation based on x-ray energy spectrum correlation with an energy dispersive spectrometer (EDS)
Haimovich et al. Estimating and measuring thickness of thin layers by Monte Carlo simulation and backscattered electron image analysis
Lafond et al. eCHORD orientation mapping of bio-inspired alumina down to 1 kV
Lomholdt et al. Interpretability of high-resolution transmission electron microscopy images
JP5304075B2 (en) Measuring method of iron-based powder coverage
Wang et al. Image quality of microns-thick specimens in the ultra-high voltage electron microscope
Moore et al. Scanning and transmission electron microscope investigation of preferential thinning during ion beam milling of an Al–Ag alloy containing γ precipitate plates and the subsequent effects on microanalysis