[go: up one dir, main page]

Morrison, 2019 - Google Patents

Liquid-Cooling Trends In Data Centers

Morrison, 2019

Document ID
7378975062722238156
Author
Morrison F
Publication year
Publication venue
ASHRAE Journal

External Links

Snippet

Beaty et al discusses the liquid-cooling trends in data centers. ASHRAE has published thermal guidelines for datacom facilities that allow higher air temperatures in the conditioned space that can extend the hours of economization and hence increase the energy savings …
Continue reading at search.proquest.com (other versions)

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardized dimensions, e.g. 19-inch electronic racks
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/2059—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures

Similar Documents

Publication Publication Date Title
Capozzoli et al. Cooling systems in data centers: state of art and emerging technologies
Nadjahi et al. A review of thermal management and innovative cooling strategies for data center
CN108811472B (en) Liquid cooling server equipment, servers and liquid cooling devices
US8929080B2 (en) Immersion-cooling of selected electronic component(s) mounted to printed circuit board
US10948223B2 (en) Evaporative fluid-cooler with integrated mechanical cooling system
EP3295088B1 (en) Using liquid to air membrane energy exchanger for liquid cooling
US7024573B2 (en) Method and apparatus for cooling heat generating components
US9273906B2 (en) Modular pumping unit(s) facilitating cooling of electronic system(s)
US8964391B2 (en) Sectioned manifolds facilitating pumped immersion-cooling of electronic components
Li et al. Current status and future trends in data-center cooling technologies
US9363924B2 (en) Ground-based heat sink facilitating electronic system cooling
US9357682B2 (en) Cooling method with automated seasonal freeze protection
US9027360B2 (en) Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
US8955347B2 (en) Air-side economizer facilitating liquid-based cooling of an electronics rack
US8687364B2 (en) Directly connected heat exchanger tube section and coolant-cooled structure
US20110303394A1 (en) Liquid cooling system for a server
CN111278262B (en) Server radiating system with combination of gravity type heat pipe and heat pipe backboard of server chip
CN111526694B (en) Liquid cooling system for server cabinet and server cabinet
JP2025527598A (en) Cooling system
US9448001B2 (en) Indirect cooling unit
Morrison Liquid-Cooling Trends In Data Centers
CN113141753A (en) Data center cooling using heat pipes
Schmidt et al. Moderating the Impact of Integrating Water-Cooled Servers Into Data Centers
Morrison Saving Energy With Cooling Towers.
Januszewskia et al. Cooling–making efficient choices