Wilson et al., 2001 - Google Patents
Directly electroplated microstructureWilson et al., 2001
- Document ID
- 842782802748626687
- Author
- Wilson A
- Muscat R
- Jackson I
- Olsson-Jacques C
- Retchford J
- Publication year
- Publication venue
- Smart Materials
External Links
Snippet
Structures have been electroplated directly to metal (Al) pads on Si wafers using only the metal pad geometry to define the position and shape of the electroplated pad. No further processing steps are required after the electroplating. These pads have been used to form …
- 238000000034 method 0 abstract description 55
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
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