[go: up one dir, main page]

Wong et al., 2002 - Google Patents

Amorphous silicon thin-film transistors and arrays fabricated by jet printing

Wong et al., 2002

View PDF
Document ID
8722725271722735878
Author
Wong W
Ready S
Matusiak R
White S
Lu J
Ho J
Street R
Publication year
Publication venue
Applied Physics Letters

External Links

Snippet

Phase-change wax-based printed masks, in place of conventional photolithography, were used to fabricate hydrogenated amorphous silicon thin-film transistors (TFTs). Wax-mask features with a minimum feature size of∼ 20 μm were achieved using an acoustic-ink …
Continue reading at pubs.aip.org (PDF) (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/1292Multistep manufacturing methods using liquid deposition, e.g. printing
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/05Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture
    • H01L51/0504Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or swiched, e.g. three-terminal devices
    • H01L51/0508Field-effect devices, e.g. TFTs
    • H01L51/0512Field-effect devices, e.g. TFTs insulated gate field effect transistors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/164Production of nozzles manufacturing processes thin film formation
    • B41J2/1645Production of nozzles manufacturing processes thin film formation thin film formation by spincoating
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0021Formation of conductors
    • H01L51/0022Formation of conductors using printing techniques, e.g. ink jet printing
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0002Deposition of organic semiconductor materials on a substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0014Processes specially adapted for the manufacture or treatment of devices or of parts thereof for changing the shape of the device layer, e.g. patterning
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]

Similar Documents

Publication Publication Date Title
Wong et al. Amorphous silicon thin-film transistors and arrays fabricated by jet printing
US6972261B2 (en) Method for fabricating fine features by jet-printing and surface treatment
US7033516B2 (en) Inexpensive fabrication of large-area pixel arrays for displays and sensors
Street et al. Jet printing flexible displays
Burns et al. Inkjet printing of polymer thin-film transistor circuits
EP1777581B1 (en) Fabrication of a wiring pattern and of an active matrix substrate
US6742884B2 (en) Apparatus for printing etch masks using phase-change materials
TWI301322B (en) Pixel structure, active matrix substrate, method of manufacturing active matrix substrate, electro-optical device, and electronic apparatus
Wong et al. Hydrogenated amorphous silicon thin-film transistor arrays fabricated by digital lithography
KR102511414B1 (en) Manufacturing of carbon nanotube thin film transistor backplanes and display integration thereof
EP2087536A1 (en) Methods and apparatus for the manufacture of microstructures
US20070221611A1 (en) Method of manufacturing fine features for thin film transistors
TWI304600B (en) Bank structure, wiring pattern forming method, device, electro-optical device, and electronic apparatus
US7524768B2 (en) Method using monolayer etch masks in combination with printed masks
JP2004351305A (en) Thin-film pattern forming method, device and manufacturing method thereof, electro-optical device, and electronic apparatus
Wong et al. Jet-printed fabrication of a-Si: H thin-film transistors and arrays
JP4337744B2 (en) Film pattern forming method and active matrix substrate manufacturing method
JP2004335851A (en) Line pattern forming method, device and manufacturing method thereof, electro-optical device, and electronic equipment
Wong et al. Jet-printed Lithography for Semiconductor Device Fabrication
Wong et al. Jet-printed Fabrication of a-Si: H Thin-film Transistors and Arrays
TWI322464B (en) Film pattern forming method, device, electro-optical apparatus, and electronic appliance
Wong et al. Digital-lithographic processing for thin-film transistor array fabrication
Wong et al. Thin‐film Transistor Fabrication by Digital Lithography
JP2004330164A (en) Thin-film pattern forming method, device and manufacturing method thereof, electro-optical device, and electronic apparatus
Wong et al. Digital lithographic processing for large‐area electronics