[go: up one dir, main page]

Douin et al., 2007 - Google Patents

Picosecond timing analysis in integrated circuits with pulsed laser stimulation

Douin et al., 2007

Document ID
8799975108490613865
Author
Douin A
Pouget V
Lewis D
Fouillat P
Perdu P
Publication year
Publication venue
2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual

External Links

Snippet

This paper presents new approaches for timing analysis in fast integrated circuits using picosecond pulsed laser stimulation. The proposed techniques provide very good temporal resolution as illustrated by several case studies on digital test structures. They can be used …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318594—Timing aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/30—Marginal testing, e.g. varying supply voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/02—Testing of electric apparatus, lines or components, for short-circuits, discontinuities, leakage of current, or incorrect line connection
    • G01R31/024—Arrangements for indicating continuity or short-circuits in electric apparatus or lines, leakage or ground faults
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/12—Testing dielectric strength or breakdown voltage; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/08—Locating faults in cables, transmission lines, or networks
    • G01R31/11—Locating faults in cables, transmission lines, or networks using pulse reflection methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing

Similar Documents

Publication Publication Date Title
US11047906B2 (en) Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and laser-induced upsets
US11353479B2 (en) Laser-assisted device alteration using synchronized laser pulses
Stellari et al. CMOS circuit testing via time-resolved luminescence measurements and simulations
WO2013188046A1 (en) Laser-assisted device alteration using synchronized laser pulses
Stellari et al. High-speed CMOS circuit testing by 50 ps time-resolved luminescence measurements
Ravikumar et al. Laser voltage probing in failure analysis of advanced integrated circuits on SOI
Perdu et al. Optical probing (EOFM/TRI): a large set of complementary applications for ultimate VLSI
Erington et al. Measuring propagation delays of critical paths using time-resolved LADA
King et al. In situ observation of circuit behavior using pump-probe laser voltage probe technique
Douin et al. Picosecond timing analysis in integrated circuits with pulsed laser stimulation
Eiles et al. Optical probing of VLSI ICs from the silicon backside
Dickson et al. Picosecond Time-Resolved LADA Integrated with a Solid Immersion Lens on a Laser Scanning Microscope
Sanchez et al. Dynamic laser delay variation mapping (DVM) implementations and applications
Ravikumar et al. Laser Voltage Tracing for Electrical Fault Isolation of Circuits Propagating Aperiodic Signals
Stellari et al. Switching time extraction of CMOS gates using time-resolved emission (TRE)
Douin et al. Time resolved imaging using synchronous picosecond Photoelectric Laser Stimulation
US6882170B2 (en) Device speed alteration by electron-hole pair injection and device heating
Kiyan et al. Timing sensitivity analysis of logical nodes in scan design integrated circuits by pulsed diode laser stimulation
Beaudoin et al. Dynamic laser stimulation techniques for advanced failure analysis and design debug applications
Winson et al. Root Cause Analysis on Analog Circuit Using TR-LADA
Ravikumar et al. Continuous-Wave 1064 nm Laser for Laser Voltage Imaging and Probing Applications
Dickson Differential Laser Voltage Probe: A Brief Overview and Thoughts on What Could Come Next
Douin et al. Jitter Improvement of Time-Resolved Photoelectric Laser Stimulation for Dynamic Imaging of Integrated Circuits
Goh et al. Electrically-Enhanced LADA (EeLADA) Technique
Perdu et al. Identification of some key parameters for photoelectric laser stimulation of IC: an experimental approach