[go: up one dir, main page]

Thomsen et al., 1987 - Google Patents

Picosecond acoustics as a non-destructive tool for the characterization of very thin films

Thomsen et al., 1987

Document ID
10225923010243596945
Author
Thomsen C
Maris H
Tauc J
Publication year
Publication venue
Thin Solid Films

External Links

Snippet

A new technique for the non-destructive evaluation of film thickness, adhesion and homogeneity is presented. We describe how a subpicosecond laser pulse generates a high frequency acoustic pulse in opaque thin films of a material. The pulse traverse the film …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/028Material parameters
    • G01N2291/02881Temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/028Material parameters
    • G01N2291/02827Elastic parameters, strength or force
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04Analysing solids
    • G01N29/07Analysing solids by measuring propagation velocity or propagation time of acoustic waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02Analysing fluids
    • G01N29/024Analysing fluids by measuring propagation velocity or propagation time of acoustic waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/221Arrangements for directing or focusing the acoustical waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/04Wave modes and trajectories
    • G01N2291/042Wave modes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/171Systems in which incident light is modified in accordance with the properties of the material investigated with calorimetric detection, e.g. with thermal lens detection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/43Refractivity; Phase-affecting properties, e.g. optical path length by measuring critical angle
    • G01N21/431Dip refractometers, e.g. using optical fibres
    • G01N2021/432Dip refractometers, e.g. using optical fibres comprising optical fibres
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55Specular reflectivity
    • G01N21/552Attenuated total reflection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/10Number of transducers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/46Processing the detected response signal, e.g. electronic circuits specially adapted therefor by spectral analysis, e.g. Fourier analysis or wavelet analysis
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/636Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited using an arrangement of pump beam and probe beam; using the measurement of optical non-linear properties
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B17/00Measuring arrangements characterised by the use of subsonic, sonic or ultrasonic vibrations
    • G01B17/02Measuring arrangements characterised by the use of subsonic, sonic or ultrasonic vibrations for measuring thickness
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical means
    • G01B11/02Measuring arrangements characterised by the use of optical means for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material of coating
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K11/00Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress in general
    • G01L1/25Measuring force or stress in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons
    • G01L1/255Measuring force or stress in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons using acoustic waves, or acoustic emission

Similar Documents

Publication Publication Date Title
Thomsen et al. Picosecond acoustics as a non-destructive tool for the characterization of very thin films
US6175416B1 (en) Optical stress generator and detector
Saito et al. Picosecond acoustic phonon pulse generation in nickel and chromium
Bonello et al. Application of the picosecond ultrasonic technique to the study of elastic and time-resolved thermal properties of materials
US5748318A (en) Optical stress generator and detector
US4710030A (en) Optical generator and detector of stress pulses
US6211961B1 (en) Optical method for the characterization of the electrical properties of semiconductors and insulating films
Tam et al. Photoacoustic generation and detection of 10‐ns acoustic pulses in solids
US5438402A (en) System and method for measuring the interface tensile strength of planar interfaces
US20040085550A1 (en) Material thickness measurement method and apparatus
WO1999061867A1 (en) An apparatus and method for measuring a property of a structure comprising at least one layer
US8537363B2 (en) Picosecond ultrasonic system incorporating an optical cavity
US20070024871A1 (en) Method and apparatus for measuring thickness of thin films via transient thermoreflectance
Hayashi et al. Acoustic pulse echoes probed with time-resolved X-ray triple-crystal diffractometry
JP2001519892A (en) Optical method for determining mechanical properties of materials
CN106441124A (en) Novel method for measuring film thickness by time response based on laser-induced thermoelectricity voltage
Quan et al. Photoacoustic generation in liquids with low optical absorption
Dewhurst et al. The performance of thick piezoelectric transducers as wide-band ultrasonic detectors
Reese et al. Examination of the epicentral waveform for laser ultrasound in the melting regime
Thomsen et al. Ultrasonic experiments with picosecond time resolution
Ma et al. Wafer-level metal thin film thickness scanning based on multiple probe wavelengths nanosecond transient thermoreflectance
JP2006524813A (en) Thin film evaluation method
Zharkii et al. Laser ultrasonic study of porous silicon layers
Tam et al. Ultrasonic imaging of layered structures utilizing nondestructive subnanosecond photoacoustic pulse generation
Martyanov et al. Development of a high frequency ultrasonic setup for measuring the parameters of thin films