Patsalas et al., 2010 - Google Patents
Electronic and crystal structure and bonding in Ti-based ternary solid solution nitrides and Ti–Cu–N nanocomposite filmsPatsalas et al., 2010
- Document ID
- 10839995143186974950
- Author
- Patsalas P
- Abadias G
- Matenoglou G
- Koutsokeras L
- Lekka C
- Publication year
- Publication venue
- Surface and Coatings Technology
External Links
Snippet
Complex transition metal nitrides (TMN) have lately gained special attention in an effort to improve the properties of their binary counterparts. In this work we review a very wide range of binary and ternary transition metal nitrides of the form: TixTM1− xN (TM= Zr, Hf, Nb, Ta …
- 150000004767 nitrides 0 title abstract description 23
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0005—Separation of the coating from the substrate
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Stolze et al. | Sc–Zr–Nb–Rh–Pd and Sc–Zr–Nb–Ta–Rh–Pd high-entropy alloy superconductors on a CsCl-type lattice | |
| Patsalas et al. | Electronic and crystal structure and bonding in Ti-based ternary solid solution nitrides and Ti–Cu–N nanocomposite films | |
| Johansson et al. | Multicomponent Hf-Nb-Ti-V-Zr nitride coatings by reactive magnetron sputter deposition | |
| Ma et al. | Nanoindentation study on the creep characteristics of high-entropy alloy films: Fcc versus bcc structures | |
| Rachbauer et al. | Increased thermal stability of Ti–Al–N thin films by Ta alloying | |
| Lee et al. | Grain-boundary structure and segregation in Nb3Sn coatings on Nb for high-performance superconducting radiofrequency cavity applications | |
| Tsai et al. | Thermal stability and performance of NbSiTaTiZr high-entropy alloy barrier for copper metallization | |
| Mayrhofer et al. | Thermally induced transitions of CrN thin films | |
| Mayrhofer et al. | Age hardening of PACVD TiBN thin films | |
| Alling | Metal to semiconductor transition and phase stability of Ti 1− x Mg x N y alloys investigated by first-principles calculations | |
| Berger et al. | Characterization of Cr–Al–C and Cr–Al–C–Y films synthesized by High Power Impulse Magnetron Sputtering at a low deposition temperature | |
| Persson et al. | Epitaxial Ti2AlN (0 0 0 1) thin film deposition by dual-target reactive magnetron sputtering | |
| Müller et al. | The as-deposited structure of co-sputtered Cu–Ta alloys, studied by X-ray diffraction and molecular dynamics simulations | |
| Lin et al. | A Study of Thin Film Resistors Prepared Using Ni‐Cr‐Si‐Al‐Ta High Entropy Alloy | |
| Tsai et al. | Oxidation resistance and structural evolution of (TiVCrZrHf) N coatings | |
| Stasiak et al. | Synthesis and characterization of the ceramic refractory metal high entropy nitride thin films from Cr-Hf-Mo-Ta-W system | |
| Matenoglou et al. | Structure, stability and bonding of ternary transition metal nitrides | |
| Emery et al. | Thin film combinatorial sputtering of Al-Ce alloys: Investigating the phase separation of as-deposited solid solutions and determining the coefficient of thermal expansion | |
| Guitar et al. | Production of single-phase intermetallic films from Ru-Al multilayers | |
| Tillmann et al. | Optimization of the deposition parameters of Ni-20Cr thin films on thermally sprayed Al2O3 for sensor application | |
| Parsamehr et al. | Mechanical and surface properties of aluminum-copper-iron quasicrystal thin films | |
| Barsoum et al. | The M n+ 1AX n Phases: The Precursors for MXenes | |
| Zhang et al. | Origin of Al deficient Ti2AlN and pathways of vacancy-assisted diffusion | |
| Barber | The control of thin film deposition and recent developments in oxide film growth | |
| Crisan et al. | Incipient low-temperature formation of MAX phase in Cr–Al–C films |