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Eyer et al., 1991 - Google Patents

Localization of the Solid/Liquid Interface during Directional Solidification of Silicon by a Pulse-Echo Ultrasonic Technique

Eyer et al., 1991

Document ID
11305791845159428581
Author
Eyer A
Haas F
Schätzle P
Paul M
Knobel R
Publication year
Publication venue
Tenth EC Photovoltaic Solar Energy Conference: Proceedings of the International Conference, held at Lisbon, Portugal, 8–12 April 1991

External Links

Snippet

An ultrasonic system is suited to detect the solid/liquid interface in a directional solidification process of silicon. Such processes are used to produce large multicrystalline ingots from which silicon wafers for low cost solar cells for terrestrial power applications are sliced …
Continue reading at link.springer.com (other versions)

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