[go: up one dir, main page]

Ozaki et al., 2018 - Google Patents

Biaxial flexure testing of free-standing thin film membrane with nanoindentation system

Ozaki et al., 2018

Document ID
11308258630944400971
Author
Ozaki T
Koga T
Fujitsuka N
Makino H
Hohjo H
Kadoura H
Publication year
Publication venue
Sensors and Actuators A: Physical

External Links

Snippet

The advent of microelectromechanical devices has increased the demand for biaxial flexure testing at the micro-and nanoscale. However, testing at these scales is challenging owing to difficulties in manipulating very small samples and applying highly symmetric biaxial loads …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02Details not specific for a particular testing method
    • G01N2203/026Specifications of the specimen
    • G01N2203/0286Miniature specimen; Testing on micro-regions of a specimen
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058Kind of property studied
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes
    • G01L5/0047Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes measuring forces due to residual stresses

Similar Documents

Publication Publication Date Title
DelRio et al. Fracture strength of micro-and nano-scale silicon components
Yi et al. Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength
Lin et al. A micro strain gauge with mechanical amplifier
Tsuchiya et al. Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films
WO2018196466A1 (en) Method and device for measuring mechanical parameter of multi-layer composite thin film structure
Huang et al. Finite element analysis on nanoindentation with friction contact at the film/substrate interface
Gaither et al. Etching process effects on surface structure, fracture strength, and reliability of single-crystal silicon theta-like specimens
Fujii et al. Focused ion beam induced surface damage effect on the mechanical properties of silicon nanowires
Ozaki et al. Biaxial flexure testing of free-standing thin film membrane with nanoindentation system
Schweitz et al. Evaluation of mechanical materials properties by means of surface micromachined structures
Ding et al. Specimen size effect on mechanical properties of polysilicon microcantilever beams measured by deflection using a nanoindenter
Namazu et al. Design and development of a biaxial tensile test device for a thin film specimen
Chasiotis et al. Mechanical properties of thin polysilicon films by means of probe microscopy
Gennat et al. Determination of parameters with uncertainties for quality control in MEMS fabrication
Namazu et al. Thermal annealing effect on elastic-plastic behavior of Al-Si-Cu structural films under uniaxial and biaxial tension
Tsuchiya et al. Tensile and tensile-mode fatigue testing of microscale specimens in constant humidity environment
Namazu et al. Tension–Torsion Combined Loading Test Equipment for a Minute Beam Specimen
Takahashi et al. Triaxial piezoresistive force sensor probe with high sensitivity and stiffness using 3D notch structure
Süss et al. Stress reduction in ultra-small thin film Al2O3 diaphragms by atomic layer deposition
Shikida et al. Mechanical strengthening of Si cantilevers by chemical wet etching
Wasmer et al. In situ compression tests on micron-sized silicon pillars by Raman microscopy—Stress measurements and deformation analysis
Tanemura et al. Fatigue characteristics of polycrystalline silicon thin-film membrane and its dependence on humidity
Youssef et al. Methods to improve reliability of bulge test technique to extract mechanical properties of thin films
CN104458417B (en) Micro beam breaking strength testing structure based on flat plate type capacitance detection
Lin et al. Residual stresses at cavity corners in silicon-on-insulator bonded wafers