Zhu et al., 2012 - Google Patents
Millimeter wave interchip communicationZhu et al., 2012
- Document ID
- 11425886676433416066
- Author
- Zhu G
- Guidotti D
- Lin F
- Wang Q
- Cui J
- Wang Q
- Cao L
- Ye T
- Wan L
- Publication year
- Publication venue
- proceedings of 2012 5th Global Symposium on Millimeter-Waves
External Links
Snippet
High performance multicore processors are approaching 256 GFLOPS and use and generate data at unprecedented rates. Much of the short range data transport between chips, however, is based on legacy LC transmission line infrastructure. Consequently, high …
- 238000004891 communication 0 title abstract description 10
Classifications
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
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