Torabi, 2018 - Google Patents

Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
  • G06F17/50—Computer-aided design
  • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
  • G06F17/5081—Layout analysis, e.g. layout verification, design rule check
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
  • G06F17/50—Computer-aided design
  • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
  • G06F17/5072—Floorplanning, e.g. partitioning, placement
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
  • G06F17/50—Computer-aided design
  • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
  • G06F17/5077—Routing
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
  • G06F17/50—Computer-aided design
  • G06F17/5045—Circuit design
  • G06F17/505—Logic synthesis, e.g. technology mapping, optimisation
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
  • G06F17/50—Computer-aided design
  • G06F17/5009—Computer-aided design using simulation
  • G06F17/5036—Computer-aided design using simulation for analog modelling, e.g. for circuits, spice programme, direct methods, relaxation methods
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
  • G06F2217/12—Design for manufacturability
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
  • G03F1/14—Originals characterised by structural details, e.g. supports, cover layers, pellicle rings
  • G03F1/144—Auxiliary patterns; Corrected patterns, e.g. proximity correction, grey level masks
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
  • G06F2217/78—Power analysis and optimization
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
  • G06F2217/08—Multi-objective optimization
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
  • G06F17/30—Information retrieval; Database structures therefor; File system structures therefor
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Exposure apparatus for microlithography
  • G03F7/70483—Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
  • G03F7/70491—Information management and control, including software
  • G03F7/705—Modelling and simulation from physical phenomena up to complete wafer process or whole workflow in wafer fabrication
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Exposure apparatus for microlithography
  • G03F7/70425—Imaging strategies, e.g. for increasing throughput, printing product fields larger than the image field, compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching, double patterning
  • G03F7/70433—Layout for increasing efficiency, for compensating imaging errors, e.g. layout of exposure fields,; Use of mask features for increasing efficiency, for compensating imaging errors
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
  • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
  • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
  • G03F1/70—Adapting basic layout or design of masks to lithographic process requirement, e.g., second iteration correction of mask patterns for imaging
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Exposure apparatus for microlithography
  • G03F7/70483—Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
  • G03F7/70616—Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane

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