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Sakamoto et al., 2023 - Google Patents

Polymer Hybrid Bonding using Copper Paste and Photosensitive Adhesive for Copper-Copper Bonding at 200-250° C

Sakamoto et al., 2023

Document ID
11596858740488967124
Author
Sakamoto H
Teranishi T
Nagai R
Kobatake T
Takawaki K
Haga M
Happoya A
Publication year
Publication venue
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

External Links

Snippet

As the speeds of mobile communication systems continue to increase, demand is also rapidly increasing for semiconductor technologies that can transmit vast quantities of information at high speed with low latency. Solder bonding technology has traditionally been …
Continue reading at ieeexplore.ieee.org (other versions)

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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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