Peyrard, 2024 - Google Patents
Study of on-chip autodetection principles of power supply RLC parasitic elements in a microcontroller environmentPeyrard, 2024
View PDF- Document ID
- 12089805656931945814
- Author
- Peyrard M
- Publication year
External Links
Snippet
This thesis work is the result of a collaboration between the PolytechLab laboratory and STMicroelectronics company, within the scope of a “CIFRE convention.” This study focuses on the power integrity issues in a microcontroller (MCU) integrated circuit. Supply noise is a …
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuit
- G01R31/31903—Tester hardware, i.e. output processing circuit tester configuration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31725—Timing aspects, e.g. clock distribution, skew, propagation delay
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31708—Analysis of signal quality
- G01R31/31709—Jitter measurements; Jitter generators
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/50—Computer-aided design
- G06F17/5009—Computer-aided design using simulation
- G06F17/5036—Computer-aided design using simulation for analog modelling, e.g. for circuits, spice programme, direct methods, relaxation methods
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F2217/00—Indexing scheme relating to computer aided design [CAD]
- G06F2217/78—Power analysis and optimization
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F1/00—Details of data-processing equipment not covered by groups G06F3/00 - G06F13/00, e.g. cooling, packaging or power supply specially adapted for computer application
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R21/00—Arrangements for measuring electric power or power factor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the preceding groups
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Swaminathan et al. | Power integrity modeling and design for semiconductors and systems | |
| Das et al. | Modeling and characterization of the system-level Power Delivery Network for a dual-core ARM Cortex-A57 cluster in 28nm CMOS | |
| Aygün et al. | Power Delivery for High-Performance Microprocessors. | |
| US7138815B1 (en) | Power distribution system built-in self test using on-chip data converter | |
| Song et al. | Novel target-impedance extraction method-based optimal PDN design for high-performance SSD using deep reinforcement learning | |
| Leca et al. | EMI measurements, modeling, and reduction of 32-Bit high-performance microcontrollers | |
| Sjiariel et al. | Power integrity simulation of power delivery network system | |
| Fasig et al. | Introduction to non-invasive current estimation (NICE) | |
| WO2023201797A1 (en) | Frequency domain characteristic measurement method, apparatus and system, and storage medium | |
| Peyrard | Study of on-chip autodetection principles of power supply RLC parasitic elements in a microcontroller environment | |
| Ko et al. | Simplified chip power modeling methodology without netlist information in early stage of soc design process | |
| DeBoi | Characterization and Modeling of SiC Multi-Chip Power Modules | |
| Park et al. | Estimation of power switching current by chip-package-PCB cosimulation | |
| Kim et al. | Package embedded decoupling capacitor impact on core power delivery network for ARM SoC application | |
| Evans et al. | Modeling and measurement of a high-performance computer power distribution system | |
| Goral et al. | Power delivery network simulation methodology including integrated circuit behavior | |
| Song et al. | Optimal power distribution network design for high-performance solid-state-drive based on novel target-impedance extraction method | |
| Ichikawa et al. | Experimental verification of power supply noise modeling for EMI analysis through on-board and on-chip noise measurements | |
| Barnes et al. | Extracting the Dynamic Current of a Power Delivery Network | |
| Cunha et al. | Validation by measurements of an IC modeling approach for SiP applications | |
| Xu | System level power integrity transient analysis using a physics-based approach | |
| Li et al. | Development and validation of a microcontroller model for EMC | |
| Taylor et al. | An approach to measuring power supply impedance of microprocessors | |
| Musolino et al. | Chip-level design constraints to comply with conducted electromagnetic emission specifications | |
| Matsuno et al. | Modeling of power noise generation in standard-cell based CMOS digital circuits |