Sarac et al., 2010 - Google Patents
Three-dimensional shell fabrication using blow molding of bulk metallic glassSarac et al., 2010
View PDF- Document ID
- 13683066791166512674
- Author
- Sarac B
- Kumar G
- Hodges T
- Ding S
- Desai A
- Schroers J
- Publication year
- Publication venue
- Journal of Microelectromechanical Systems
External Links
Snippet
A blow molding method based on thermoplastic forming of bulk metallic glasses (BMGs) is used to fabricate 3-D microshells. The 3-D microshells are attached to the Si wafer through mechanical locking, which is achieved in the same processing step. Versatile sizes and …
- 238000000071 blow moulding 0 title abstract description 28
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICRO-STRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing micro-systems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing micro-systems without movable or flexible elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICRO-STRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of micro-structural devices or systems
- B81C2201/01—Manufacture or treatment of micro-structural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICRO-STRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
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