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Mickiewicz et al., 2012 - Google Patents

Non-destructive determination of the degree of cross-linking of EVA solar module encapsulation Using DMA shear measurements

Mickiewicz et al., 2012

Document ID
140717665946072231
Author
Mickiewicz R
Cahill E
Wu P
Publication year
Publication venue
2012 38th IEEE Photovoltaic Specialists Conference

External Links

Snippet

A mechanical measurement technique was investigated to correlate the degree of cross- linking in laminated ethylene vinyl acetate (EVA) solar module encapsulation with the cured EVA shear response by means of a dynamic mechanical analysis (DMA) measurement. The …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02Details not specific for a particular testing method
    • G01N2203/026Specifications of the specimen
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
    • G01M3/00Investigating fluid-tightness of structures
    • G01M3/02Investigating fluid-tightness of structures by using fluid or vacuum

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