[go: up one dir, main page]

Toenshoff et al., 1991 - Google Patents

Absorption behavior of ceramic materials irradiated with excimer lasers

Toenshoff et al., 1991

Document ID
14391756733538833044
Author
Toenshoff H
Gedrat O
Publication year
Publication venue
Excimer Laser Materials Processing and Beam Delivery Systems

External Links

Snippet

Various investigations in the field of material processing indicate that the characteristics of excimer lasers such as emission of radiation in the UV and short pulse duration in the range of some 10 ns with very high pulse intensities lead to several advantages for processing …
Continue reading at www.spiedigitallibrary.org (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

Similar Documents

Publication Publication Date Title
US5800625A (en) Removal of material by radiation applied at an oblique angle
Schuöcker Handbook of the EuroLaser academy
Shirk et al. Ultrashort pulsed laser ablation of diamond
Stinnett et al. Thermal surface treatment using intense, pulsed ion beams
Lawrence et al. Wettability characteristics of a modified mild steel with CO2, Nd: YAG, excimer and high power diode lasers
Toenshoff et al. Absorption behavior of ceramic materials irradiated with excimer lasers
Choi et al. Analysis of the laser grooving and cutting processes
Dolgaev et al. Etching of sapphire assisted by copper-vapour laser radiation
Lee et al. Excimer laser ablation removal of thin chromium films from glass substrates
US5138130A (en) Laser rough and finish machining of hard materials
Metev et al. Pattern generation by laser-induced oxidation of thin metal films (microcircuit fabrication)
Semerok et al. Laser ablation efficiency of pure metals with femtosecond, picosecond, and nanosecond pulses
JPH0740336A (en) Diamond processing method
Jackson et al. Excimer laser ablation of Nd: YAG and Nd: glass
JPH04182093A (en) Laser beam machining method
Kreutz et al. Surface modelling during laser microprocessing
Steen Laser surface treatment: an overview
Toenshoff et al. Gas assisted microstructuring of ceramic materials irradiated with excimer lasers
Chaleard et al. Experimental investigation of laser ablation efficiency of metals
Burck et al. Laser machining of Si3N4 ceramics
Voronov et al. Laser-assisted etching of the surface of polycrystalline silicon carbide by copper-vapour laser radiation
Parkhill et al. Surface texturing of aluminum alloy 2024 via excimer laser irradiation
Campbell et al. Laser machining of silicon nitride base materials
Buetje Excimer laser processing of metals considering the effects of pulse duration and geometrical aspects
Dong et al. High-energy femtosecond pulsed laser micromachining of thin film deposited silicon in self-focused air medium