Hsu et al., 2003 - Google Patents
Low k1 lithography patterning option for the 90-nm and 65-nm nodesHsu et al., 2003
- Document ID
- 14303234089067539771
- Author
- Hsu S
- Van Den Broeke D
- Shi X
- Hsu M
- Wampler K
- Chen J
- Yu A
- Yang S
- Hsieh F
- Publication year
- Publication venue
- Photomask and Next-Generation Lithography Mask Technology X
External Links
Snippet
As IC fabrication processes are maturing for the 130nm node, silicon manufacturers are focusing on 90nm device manufacturing at ever-lower k 1 factors. Driven by cost savings, many integrated device manufacturers (IDMs) and foundries are working toward patterning …
- 238000001459 lithography 0 title abstract description 15
Classifications
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Exposure apparatus for microlithography
- G03F7/70483—Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
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- G03F7/705—Modelling and simulation from physical phenomena up to complete wafer process or whole workflow in wafer fabrication
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Exposure apparatus for microlithography
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- G03F7/70616—Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
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