Liu et al., 2014 - Google Patents
Electrodeposition of nanocrystalline copper thin films from 1-ethyl-3-methylimidazolium ethylsulphate ionic liquidLiu et al., 2014
View PDF- Document ID
- 14726999918791080985
- Author
- Liu T
- Vilar R
- Eugénio S
- Grondin J
- Danten Y
- Publication year
- Publication venue
- Journal of Applied Electrochemistry
External Links
Snippet
Copper thin films are increasingly important as interconnectors for the creation of smaller and better performing integrated circuits and electrodeposition from ionic liquid-based electrolytes could provide a greener fabrication method for these films. The …
- 239000010949 copper 0 title abstract description 72
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of or comprising active material
- H01M4/36—Selection of substances as active materials, active masses, active liquids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Liu et al. | Electrodeposition of zinc films from ionic liquids and ionic liquid/water mixtures | |
| Zhang et al. | Electrodeposition in ionic liquids | |
| Tsuda et al. | Electrochemical surface finishing and energy storage technology with room-temperature haloaluminate ionic liquids and mixtures | |
| Bryngelsson et al. | Electrodeposited Sb and Sb/Sb2O3 nanoparticle coatings as anode materials for Li-ion batteries | |
| Bijani et al. | Low-temperature electrodeposition of Cu2O thin films: modulation of micro-nanostructure by modifying the applied potential and electrolytic bath pH | |
| Pulletikurthi et al. | Electrodeposition of silicon from three different ionic liquids: possible influence of the anion on the deposition process | |
| El Abedin et al. | Electrodeposition of nanocrystalline silver films and nanowires from the ionic liquid 1-ethyl-3-methylimidazolium trifluoromethylsulfonate | |
| Al-Salman et al. | Template-free electrochemical synthesis of high aspect ratio Sn nanowires in ionic liquids: a general route to large-area metal and semimetal nanowire arrays? | |
| Ru et al. | Preparation of sub-micrometer lead wires from PbO by electrodeposition in choline chloride-urea deep eutectic solvent | |
| Liu et al. | Electrodeposition of nanocrystalline copper thin films from 1-ethyl-3-methylimidazolium ethylsulphate ionic liquid | |
| Balischewski et al. | Metal sulfide nanoparticle synthesis with ionic liquids–state of the art and future perspectives | |
| Liu et al. | Electrodeposition of copper thin films from 1-ethyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide | |
| Debbarma et al. | A comprehensive review on advanced supercapacitors based on transition metal tellurides: from material engineering to device fabrication | |
| Anicai et al. | Electrodeposition of lead selenide films from ionic liquids based on choline chloride | |
| Yang et al. | Electrodeposition of indium antimonide from the water-stable 1-ethyl-3-methylimidazolium chloride/tetrafluoroborate ionic liquid | |
| Chen et al. | Electrochemistry of acetylide anion and anodic formation of carbon films in a LiCl–KCl–CaCl2–CaC2 melt | |
| Crowe et al. | Kinetics of magnesium deposition and stripping from non-aqueous electrolytes | |
| Phi et al. | Insights into electronucleation and electrodeposition of nickel from a non-aqueous solvent based on NiCl2· 6H2O dissolved in ethylene glycol | |
| Torriero | Electrochemistry in Ionic Liquids: Volume 2: Applications | |
| Kumbhar et al. | Modified chemical synthesis of porous α-Sm2S3 thin films | |
| Han et al. | The electrochemical self-assembly of hierarchical dendritic Bi 2 Se 3 nanostructures | |
| De Sa et al. | Electrodeposition of gold thin films from 1-butyl-1-methylpyrrolidinium dicyanamide Au3+ solutions | |
| Abbasi-Kesbi et al. | Preparation of ultrafine grained copper nanoparticles via immersion deposit method | |
| Tu et al. | Fundamental understanding on selenium electrochemistry: from electrolytic cell to advanced energy storage | |
| Hsieh et al. | Electrochemical co-deposition of gallium and antimonide from the 1-butyl-1-methylpyrrolidinium dicyanamide room temperature ionic liquid |