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Jun et al., 2000 - Google Patents

Novel chemistry for surface engineering in MEMS

Jun et al., 2000

Document ID
161683578118702793
Author
Jun Y
Boiadjiev V
Major R
Zhu X
Publication year
Publication venue
Materials and Device Characterization in Micromachining III

External Links

Snippet

It is well recognized that controlling surface forces is one of the key issues in the design, fabrication, and operation of microelectromechanical systems (MEMS). Since the majority of MEMS devices are made of silicon from surface micromaching, an attractive approach is to …
Continue reading at www.spiedigitallibrary.org (other versions)

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICRO-STRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of micro-structural devices or systems
    • B81C2201/01Manufacture or treatment of micro-structural devices or systems in or on a substrate
    • B81C2201/0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102Surface micromachining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/18Processes for applying liquids or other fluent materials performed by dipping
    • B05D1/185Processes for applying liquids or other fluent materials performed by dipping applying monomolecular layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICRO-STRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity

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