Pham et al., 2010 - Google Patents
Metal-bonded, hermetic 0-level package for MEMSPham et al., 2010
View PDF- Document ID
- 16666487650367875893
- Author
- Pham N
- Limaye P
- Czarnecki P
- Olalla V
- Cherman V
- Tezcan D
- Tilmans H
- Publication year
- Publication venue
- 2010 12th Electronics Packaging Technology Conference
External Links
Snippet
This paper presents a zero-level packaging technology for hermetic encapsulation of MEMS. The technology relies on the “chip capping” of the MEMS using a metallic bond made by means of diffusion soldering of a Cu-Sn system at a temperature of around 250° C. For this …
- 239000012528 membrane 0 abstract description 38
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICRO-STRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing micro-systems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Tilmans et al. | The indent reflow sealing (IRS) technique-a method for the fabrication of sealed cavities for MEMS devices | |
| Oberhammer et al. | Sealing of adhesive bonded devices on wafer level | |
| Tilmans et al. | MEMS packaging and reliability: An undividable couple | |
| Esashi | Wafer level packaging of MEMS | |
| Wang et al. | Wafer-level vacuum sealing by transfer bonding of silicon caps for small footprint and ultra-thin MEMS packages | |
| CA2782262C (en) | Method for plugging a hole and a plugged hole | |
| US20050263878A1 (en) | Cold weld hermetic MEMS package and method of manufacture | |
| Mitchell et al. | Encapsulation of vacuum sensors in a wafer level package using a gold-silicon eutectic | |
| Welch et al. | Transient liquid phase (TLP) bonding for microsystem packaging applications | |
| Wang et al. | Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprint | |
| Pham et al. | Metal-bonded, hermetic 0-level package for MEMS | |
| Antelius et al. | Small footprint wafer-level vacuum packaging using compressible gold sealing rings | |
| GB2516079A (en) | Method for hermetically sealing with reduced stress | |
| Antelius et al. | Hermetic integration of liquids using high-speed stud bump bonding for cavity sealing at the wafer level | |
| Welch et al. | Nickel-tin transient liquid phase (TLP) wafer bonding for MEMS vacuum packaging | |
| Decharat et al. | Room-temperature sealing of microcavities by cold metal welding | |
| Chiao et al. | Device-level hermetic packaging of microresonators by RTP aluminum-to-nitride bonding | |
| Baltes et al. | Packaging of CMOS MEMS | |
| Antelius et al. | Wafer-level vacuum sealing by coining of wire bonded gold bumps | |
| Garnier et al. | Gold-tin bonding for 200mm wafer level hermetic MEMS packaging | |
| Manier et al. | Vacuum packaging at wafer level for MEMS using gold-tin metallurgy | |
| Su et al. | Packaging and reliability issues in micro/nano systems | |
| Tsou et al. | A novel wafer-level hermetic packaging for MEMS devices | |
| Yu et al. | Design, process integration and characterization of wafer level vacuum packaging for MEMS resonator | |
| Temel | Investigation of Solder Materials and Bond Formation for Wafer Level Packaging of MEMS Devices |