Yogev et al., 2000 - Google Patents
Laser chemical process for clean applications of semiconductor manufacturingYogev et al., 2000
- Document ID
- 17254647380012913707
- Author
- Yogev D
- Engel M
- Zeid S
- Barzilay I
- Livshits B
- Publication year
- Publication venue
- Laser Applications in Microelectronic and Optoelectronic Manufacturing V
External Links
Snippet
Cleaning applications in the semiconductor manufacturing industry are tougher to meet as the device dimensions decrease. The uniqueness of Oramir-Laser-Chemical process relies on the mutual combination and effectiveness of laser particle removal mechanisms and …
- 238000004140 cleaning 0 title abstract description 44
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Exposure apparatus for microlithography
- G03F7/708—Construction of apparatus, e.g. environment, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution, removing pollutants from apparatus; electromagnetic and electrostatic-charge pollution
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5958268A (en) | Removal of material by polarized radiation | |
| US11740563B2 (en) | Mask cleaning | |
| US6048588A (en) | Method for enhancing chemisorption of material | |
| US5967156A (en) | Processing a surface | |
| US5800625A (en) | Removal of material by radiation applied at an oblique angle | |
| US5643472A (en) | Selective removal of material by irradiation | |
| US6747243B1 (en) | Spot cleaning of particles after inspection | |
| US8206510B2 (en) | Method and apparatus for an in-situ ultraviolet cleaning tool | |
| US6827816B1 (en) | In situ module for particle removal from solid-state surfaces | |
| US8293019B2 (en) | Apparatus and method for indirect surface cleaning | |
| US6881687B1 (en) | Method for laser cleaning of a substrate surface using a solid sacrificial film | |
| US6829035B2 (en) | Advanced mask cleaning and handling | |
| Yogev et al. | Laser chemical process for clean applications of semiconductor manufacturing | |
| JP3106040B2 (en) | Dry cleaning system for substrate surface | |
| JP2003303800A (en) | Surface-cleaning equipment and surface-cleaning method | |
| Singh et al. | Effects of cleaning on NIL templates: surface roughness, CD, and pattern integrity | |
| JP2008511151A (en) | High temperature source cleaning system | |
| CN1395515A (en) | In situ module for particle removal from solid state surface | |
| Kim et al. | Ablation and cleaning of wafer surface by excimer laser | |
| CA2259910C (en) | Removal of material by radiation applied at an oblique angle | |
| HK1015548A (en) | Removal of material by polarized radiation and back side application of radiation | |
| JP2003188136A (en) | Cleaning method and apparatus for object having ultra- miniaturized structure part | |
| Hicks | ASSESSMENT OF DRY TECHNOLOGIES FOR REMOVING PARTICLES FROM WAFERS | |
| JPH09237772A (en) | Substrate cleaning method |