Xin et al., 2024 - Google Patents
A white-light interferometry method for 3D measurement of compactly spaced micro-nano structural unitsXin et al., 2024
- Document ID
- 18045600285335589990
- Author
- Xin L
- Yang Z
- Liu Z
- Publication year
- Publication venue
- Optics & Laser Technology
External Links
Snippet
Micro-nanostructures refer to technologies that operate at the nanoscale and provide materials and devices with unique mechanical, physical, and chemical properties. These structures have diverse applications in fields such as microelectronics, biotechnology …
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical means
- G01B11/02—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical means
- G01B11/24—Measuring arrangements characterised by the use of optical means for measuring contours or curvatures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Instruments as specified in the subgroups and characterised by the use of optical measuring means
- G01B9/04—Measuring microscopes
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Kwon et al. | Microsphere-assisted, nanospot, non-destructive metrology for semiconductor devices | |
| Xin et al. | A white-light interferometry method for 3D measurement of compactly spaced micro-nano structural units | |
| TWI417518B (en) | Interferometer and method for measuring characteristics of optically undre-resolved surface features | |
| Ferreras Paz et al. | Solving the inverse grating problem by white light interference Fourier scatterometry | |
| CN109141224B (en) | An Interferometric Reflection Optical Thin Film Microscopic Measurement Method Based on Structured Light | |
| US8160351B2 (en) | Method and apparatus for mura detection and metrology | |
| KR20090097938A (en) | Apparatus and method for measuring the properties of surface features | |
| CN108895986B (en) | Microscopic three-dimensional topography measurement device based on fringe imaging projection | |
| Rendón-Barraza et al. | Deeply sub-wavelength non-contact optical metrology of sub-wavelength objects | |
| Jung et al. | Multi spectral holographic ellipsometry for a complex 3D nanostructure | |
| Ajithaprasad et al. | Dynamic noncontact surface profilometry using a fast eigenspace method in diffraction phase microscopy | |
| Paul et al. | Investigation of coherent Fourier scatterometry as a calibration tool for determination of steep side wall angle and height of a nanostructure | |
| US7430898B1 (en) | Methods and systems for analyzing a specimen using atomic force microscopy profiling in combination with an optical technique | |
| Wang et al. | Misalignment measurement in electron beam lithography from multi-scale grid by sampling Moiré method | |
| Attota et al. | Optimizing noise for defect analysis with through-focus scanning optical microscopy | |
| CN111521130B (en) | A Microstructure Optical Inspection Method for Rapidly Judging and Eliminating the Batwing Effect | |
| Lu et al. | Silicon-via (Si-via) hole metrology and inspection by grayfield edge diffractometry | |
| Li et al. | A 3D curved optical surface defect detection method with micro structured-light based on Multi-Parameter calibration | |
| CN105319196B (en) | A super-resolution structure detection confocal fluorescence imaging device and imaging method thereof | |
| Chen et al. | 3-D micro surface profilometry employing novel Mirau-based lateral scanning interferometry | |
| Kang et al. | High-speed three-dimensional surface profile measurement with the HiLo optical imaging technique | |
| Paz et al. | Depth sensitive Fourier-Scatterometry for the characterization of sub-100 nm periodic structures | |
| Wang et al. | A nondestructive raman spectra stress 2D analysis for the pressure sensor sensitive silicon membrane | |
| CN205785104U (en) | A kind of white light scanning interferometer measuration system | |
| Li et al. | Fast and accurate measurement of high aspect ratio MEMS trench array with optical lattice illumination |