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Lo et al., 2007 - Google Patents

STEAC: A platform for automatic SOC test integration

Lo et al., 2007

Document ID
18049560312195392000
Author
Lo C
Wang C
Cheng K
Huang J
Wang C
Wang S
Wu C
Publication year
Publication venue
IEEE transactions on very large scale integration (VLSI) systems

External Links

Snippet

The lack of electronic design automation tools for system-on-chip (SOC) test integration increases SOC development time and cost, so SOC test integration tools are important in the success of promoting SOC. We have stressed practical SOC test integration issues …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318555—Control logic
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    • G01R31/317—Testing of digital circuits
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    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318558—Addressing or selecting of subparts of the device under test
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    • G01R31/318536—Scan chain arrangements, e.g. connections, test bus, analog signals
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    • G01R31/318541—Scan latches or cell details
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    • G01R31/318583—Design for test
    • G—PHYSICS
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    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G01R31/318508—Board Level Test, e.g. P1500 Standard
    • G—PHYSICS
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    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G—PHYSICS
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    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/30—Marginal testing, e.g. varying supply voltage
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
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    • G06F11/26—Functional testing
    • G06F11/273—Tester hardware, i.e. output processing circuits
    • G06F11/2733—Test interface between tester and unit under test
    • G—PHYSICS
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    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5009—Computer-aided design using simulation
    • G06F17/5022—Logic simulation, e.g. for logic circuit operation
    • G—PHYSICS
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    • G06F11/2205—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
    • G06F11/2236—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested to test CPU or processors
    • G—PHYSICS
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    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
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    • G06F11/27—Built-in tests
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
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    • G06F17/5045—Circuit design
    • G—PHYSICS
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    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
    • G06F2217/70—Fault tolerant, i.e. transient fault suppression

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