[go: up one dir, main page]

Dickinson et al., 2000 - Google Patents

Onset of laser plume formation at 248 nm on cleaved-single crystal NaCl: evidence for highly localized emissions

Dickinson et al., 2000

Document ID
2387139760773576079
Author
Dickinson J
Kawaguchi Y
Dawes M
Langford S
Publication year
Publication venue
Laser Plasma Generation and Diagnostics

External Links

Snippet

When a wide bandgap insulator is exposed to UV laser radiation at fluences close to the damage threshold, many laser pulses may be required before the onset of damage. Typically, damage is accompanied by the formation of a highly localized, bright, fluorescent …
Continue reading at www.spiedigitallibrary.org (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece

Similar Documents

Publication Publication Date Title
Zhou et al. Physical mechanism of silicon ablation with long nanosecond laser pulses at 1064 nm through time-resolved observation
Dickinson et al. Interactions of wide band gap single crystals with 248 nm excimer laser radiation. III. The role of cleavage‐induced defects in MgO
Narayan Depth of melting produced by pulsed‐laser irradiation
Ashkenasi et al. Pulse-width influence on laser structuring of dielectrics
Li et al. Comparison between single shot micromachining of silicon with nanosecond pulse shaped IR fiber laser and DPSS UV laser
Genin et al. Laser-induced damage of fused silica at 355 and 1064 nm initiated at aluminum contamination particles on the surface
Porteus et al. Evaluation of metal mirrors for high power applications by multithreshold damage analysis
Panahibakhsh et al. Control of defects and their luminescence properties in Nd: YAG crystals by laser irradiation
Dickinson et al. Onset of laser plume formation at 248 nm on cleaved-single crystal NaCl: evidence for highly localized emissions
Kawaguchi et al. Interaction of wide band gap single crystals with 248 nm excimer laser irradiation. VII. Localized plasma formation on NaCl single crystal surfaces
Ma et al. Difference in laser-induced damage behavior between back and front surfaces
Khaleeq-ur-Rahman et al. Laser induced plasma plume imaging and surface morphology of silicon
Panzner et al. Processing of silicon by Nd: YAG lasers with harmonics generation
Riley et al. Reflectivity experiments with 60 femtosecond laser pulses
Kawakami et al. Tungsten microcone arrays grown using nanosecond pulsed-Nd: YAG laser in a low-pressure He-gas atmosphere
Wang et al. Ablation and ultrafast dynamics of zinc selenide under femtosecond laser irradiation
Simakin et al. Laser-assisted etching-like damage of Si
Magyar et al. High-power laser interactions with nanostructured materials
Wang et al. Ablation and cutting of silicon wafer and micro-mold fabrication using femtosecond laser pulses
Rice et al. Micromachining of gallium nitride, sapphire, and silicon carbide with ultrashort pulses
O'Neill et al. Mixed wavelength processing
Srećković et al. Laser damage in silicon
Sun et al. Laser-induced damage threshold and laser processing of GaN
Michael et al. Processing of silicon by Nd: YAG lasers with harmonics generation
Kawaguchi et al. Onset of laser ablation in CaF2 crystal under excimer laser irradiation