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Datta et al., 2002 - Google Patents

Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's)

Datta et al., 2002

Document ID
2994776958110399263
Author
Datta M
Merritt S
Dagenais M
Publication year
Publication venue
IEEE Transactions on Components and Packaging Technologies

External Links

Snippet

A method for remetallizing the bond pads of electronic chips, which are initially metallized with aluminum or aluminum alloy is presented. Application of electroless plating process for the remetallization of aluminum to a solderable gold surface can reduce the cost and …
Continue reading at ieeexplore.ieee.org (other versions)

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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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