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MX364462B - Corte de material transparente con láser ultrarrápido y óptica de haces. - Google Patents

Corte de material transparente con láser ultrarrápido y óptica de haces.

Info

Publication number
MX364462B
MX364462B MX2016007974A MX2016007974A MX364462B MX 364462 B MX364462 B MX 364462B MX 2016007974 A MX2016007974 A MX 2016007974A MX 2016007974 A MX2016007974 A MX 2016007974A MX 364462 B MX364462 B MX 364462B
Authority
MX
Mexico
Prior art keywords
laser
transparent material
material cutting
ultrafast laser
beam optics
Prior art date
Application number
MX2016007974A
Other languages
English (en)
Other versions
MX2016007974A (es
Inventor
Marjanovic Sasha
Andrew Piech Garrett
Tsuda Sergio
Stephen Wagner Robert
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of MX2016007974A publication Critical patent/MX2016007974A/es
Publication of MX364462B publication Critical patent/MX364462B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Un sistema de perforación por láser de un material incluye un láser pulsado configurado para producir un haz láser pulsado (2) que tiene una longitud de onda de menos de o igual a aproximadamente 850 nm, la longitud de onda se selecciona de tal manera que el material es sustancialmente transparente a esta longitud de onda; el sistema incluye adicionalmente un montaje óptico (6) colocado en la trayectoria de haz del láser, configurado para transformar el haz láser (2) en una línea focal de haz de láser (2b) orientada a lo largo de la dirección de propagación del haz, en un lado de aparición del haz del montaje óptico (6).
MX2016007974A 2013-12-17 2014-12-15 Corte de material transparente con láser ultrarrápido y óptica de haces. MX364462B (es)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361917140P 2013-12-17 2013-12-17
US201462022888P 2014-07-10 2014-07-10
US14/529,801 US9687936B2 (en) 2013-12-17 2014-10-31 Transparent material cutting with ultrafast laser and beam optics
PCT/US2014/070275 WO2015095014A1 (en) 2013-12-17 2014-12-15 Transparent material cutting with ultrafast laser and beam optics

Publications (2)

Publication Number Publication Date
MX2016007974A MX2016007974A (es) 2017-01-11
MX364462B true MX364462B (es) 2019-04-26

Family

ID=53367591

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016007974A MX364462B (es) 2013-12-17 2014-12-15 Corte de material transparente con láser ultrarrápido y óptica de haces.

Country Status (8)

Country Link
US (2) US9687936B2 (es)
EP (1) EP3083126B1 (es)
JP (1) JP6571085B2 (es)
CN (1) CN106170367A (es)
MX (1) MX364462B (es)
RU (1) RU2673258C1 (es)
TW (1) TWI645929B (es)
WO (1) WO2015095014A1 (es)

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US20150166397A1 (en) 2015-06-18

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