MY119783A - Prepreg, process for producing the same and printed circuit substrate/ board using the same - Google Patents
Prepreg, process for producing the same and printed circuit substrate/ board using the sameInfo
- Publication number
- MY119783A MY119783A MYPI9701098A MY119783A MY 119783 A MY119783 A MY 119783A MY PI9701098 A MYPI9701098 A MY PI9701098A MY 119783 A MY119783 A MY 119783A
- Authority
- MY
- Malaysia
- Prior art keywords
- film
- para
- porous
- aromatic polyamide
- thermoplastic resin
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 3
- 229920003235 aromatic polyamide Polymers 0.000 abstract 6
- 239000004760 aramid Substances 0.000 abstract 5
- 229920005992 thermoplastic resin Polymers 0.000 abstract 5
- 229920001187 thermosetting polymer Polymers 0.000 abstract 5
- 239000000463 material Substances 0.000 abstract 4
- 239000002904 solvent Substances 0.000 abstract 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 abstract 2
- 150000001342 alkaline earth metals Chemical class 0.000 abstract 2
- 239000000243 solution Substances 0.000 abstract 2
- 239000004952 Polyamide Substances 0.000 abstract 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract 1
- 230000001476 alcoholic effect Effects 0.000 abstract 1
- 150000001408 amides Chemical class 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000004202 carbamide Substances 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 229920002647 polyamide Polymers 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
THE PRESENT INVENTION PROVIDES A LIGHTWEIGHT PREPREG HAVING UNIFORM FORMATION, LOW LINEAR THERMAL EXPANSION COEFFICIENT AND GOOD MECHANICAL STRENGTH, COMPRISING A POROUS PARA-ORIENTED ARQMATIC POLYAMIDE FILM AND A THERMOPLASTIC RESIN AND/OR A THERMOSETTING RESIN, THE POROUS PARA-ORIENTED AROMATIC POLYAMIDE FILM BEING IMPREGNATED WITH THE THERMOPLASTIC RESIN AND/OR THE THERMOSETTING RESIN, A PROCESS FOR PRODUCING THE SAME, AND A PRINTED CIRCUIT SUBSTRATE/BOARD USING THE SAME. A PROCESS FOR PRODUCING FOR PRODUCING A PREPREG COMPRISING A POROUS PARA-ORIENTED AROMATIC POLYAMIDE FILM AND A THERMOPLASTIC RESIN AND/OR A THERMOSETTING RESIN, THE POROUS PARA-ORIENTED AROMATIC POLYAMIDE FILM BEING IMPREGNATED WITH THE THERMOPLASTIC RESIN AND/OR THERMOSETTING RESIN, WHICH COMPRISES THE FOLLOWING STEPS (A) TO (D): STEP (A) OF FORMING A FILM-LIKE MATERIAL FROM A SOLUTION CONTAINING 1 TO 10% BY WEIGHT OF A PARA-ORIENTED AROMATIC POLYAMIDE HAVING AN INHERENT VISCOSITY OF 1.0 TO 2.8 DL/G AND 1 TO 10% BY WEIGHT OF A CHLORIDE OF AN ALKALINE METAL OR AN ALKALINE EARTH METAL IN A POLAR AMIDE SOLVENT OR A POLAR UREA SOLVENT; STEP (B) OF MAINTAINING THE FILM-LIKE MATERIAL AT A TEMPERATURE OF NOT LESS THAN 20°C OR NOT MORE THAN -5OC TO DEPOSIT THE PARA-ORIENTED AROMATIC POLYAMIDE FROM THE FILM-LIKE MATERIAL; STEP (C) OF IMMERSING THE FILM-LIKE MATERIAL OBTAINED IN THE STEP (B) IN AN AQUEOUS SOLUTION OR AN ALCOHOLIC SOLUTION TO ELUTE THE SOLVENT AND THE CHLORIDE OF THE ALKALINE METAL OR ALKALINE EARTH METAL, FOLLOWED BY DRYING TO OBTAIN A PARA-ARAMID POROUS FILM; AND STEP (D) OF IMPREGNATING THE POROUS FILM OBTAINED IN THE STEP (C) AS A SUBSTRATE WITH THE THERMOPLASTIC RESIN AND/OR THERMOSETTING RESIN TO PRODUCE A PREPREG.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI9701098 MY119783A (en) | 1997-03-15 | 1997-03-15 | Prepreg, process for producing the same and printed circuit substrate/ board using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI9701098 MY119783A (en) | 1997-03-15 | 1997-03-15 | Prepreg, process for producing the same and printed circuit substrate/ board using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY119783A true MY119783A (en) | 2005-07-29 |
Family
ID=47227316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI9701098 MY119783A (en) | 1997-03-15 | 1997-03-15 | Prepreg, process for producing the same and printed circuit substrate/ board using the same |
Country Status (1)
| Country | Link |
|---|---|
| MY (1) | MY119783A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2060490A (en) * | 1979-10-16 | 1981-05-07 | Technochemie Gmbh | Composite Material and a Process for Manufacturing the Same |
| US5002637A (en) * | 1987-11-30 | 1991-03-26 | Honshu Paper Co. Ltd. | Composite material reinforced by para-oriented aramide fiber sheet and process for preparing the same |
| WO1993000389A1 (en) * | 1991-06-26 | 1993-01-07 | E.I. Du Pont De Nemours And Company | Ballistic composite |
-
1997
- 1997-03-15 MY MYPI9701098 patent/MY119783A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2060490A (en) * | 1979-10-16 | 1981-05-07 | Technochemie Gmbh | Composite Material and a Process for Manufacturing the Same |
| US5002637A (en) * | 1987-11-30 | 1991-03-26 | Honshu Paper Co. Ltd. | Composite material reinforced by para-oriented aramide fiber sheet and process for preparing the same |
| WO1993000389A1 (en) * | 1991-06-26 | 1993-01-07 | E.I. Du Pont De Nemours And Company | Ballistic composite |
Non-Patent Citations (1)
| Title |
|---|
| CHEMICAL ABSTRACTS, VOL.120, NO.26,27 JUNE 1994 COLUMBUS, OHIO, US; ABSTRACT NO. 337120, XP0020228411 * |
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