AT193612B - Pyrophoric alloy - Google Patents
Pyrophoric alloyInfo
- Publication number
- AT193612B AT193612B AT193612DA AT193612B AT 193612 B AT193612 B AT 193612B AT 193612D A AT193612D A AT 193612DA AT 193612 B AT193612 B AT 193612B
- Authority
- AT
- Austria
- Prior art keywords
- pyrophoric alloy
- pyrophoric
- alloy
- Prior art date
Links
- 239000000956 alloy Substances 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 title 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT193612T | 1956-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AT193612B true AT193612B (en) | 1957-11-25 |
Family
ID=3666307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT193612D AT193612B (en) | 1956-02-10 | 1956-02-10 | Pyrophoric alloy |
Country Status (1)
| Country | Link |
|---|---|
| AT (1) | AT193612B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19526822A1 (en) * | 1995-07-15 | 1997-01-16 | Euromat Gmbh | Alloy, in particular solder alloy, method for connecting workpieces by soldering using a solder alloy and use of an alloy for soldering |
| US6047876A (en) * | 1997-09-12 | 2000-04-11 | Materials Resources International | Process of using an active solder alloy |
| US7806994B2 (en) | 2004-05-04 | 2010-10-05 | S-Bond Technologies, Llc | Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium |
-
1956
- 1956-02-10 AT AT193612D patent/AT193612B/en active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19526822A1 (en) * | 1995-07-15 | 1997-01-16 | Euromat Gmbh | Alloy, in particular solder alloy, method for connecting workpieces by soldering using a solder alloy and use of an alloy for soldering |
| WO1997003789A1 (en) * | 1995-07-15 | 1997-02-06 | Euromat Gmbh | Alloy, in particular a solder alloy, method for joining workpieces by soldering using the solder alloy and use of the alloy for soldering |
| DE19526822C2 (en) * | 1995-07-15 | 1998-07-02 | Euromat Gmbh | Solder alloy, use of the solder alloy and method for joining workpieces by soldering |
| US6231693B1 (en) | 1995-07-15 | 2001-05-15 | Materials Resources International | Alloy, in particular a solder alloy, for joining workpieces |
| US7041180B2 (en) | 1995-07-15 | 2006-05-09 | Materials Resources International | Method for joining workpieces using soldering alloy |
| US6047876A (en) * | 1997-09-12 | 2000-04-11 | Materials Resources International | Process of using an active solder alloy |
| US7806994B2 (en) | 2004-05-04 | 2010-10-05 | S-Bond Technologies, Llc | Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium |
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