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ATE145292T1 - Geringbenachbarte dreidimensionale verbindung. - Google Patents

Geringbenachbarte dreidimensionale verbindung.

Info

Publication number
ATE145292T1
ATE145292T1 AT93907546T AT93907546T ATE145292T1 AT E145292 T1 ATE145292 T1 AT E145292T1 AT 93907546 T AT93907546 T AT 93907546T AT 93907546 T AT93907546 T AT 93907546T AT E145292 T1 ATE145292 T1 AT E145292T1
Authority
AT
Austria
Prior art keywords
dimensional
dimensional connection
small adjacent
tetrahedral
interconnect
Prior art date
Application number
AT93907546T
Other languages
English (en)
Inventor
Stephen A Ward
Gill A Pratt
John N Nguyen
John S Pezaris
Original Assignee
Massachusetts Inst Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Massachusetts Inst Technology filed Critical Massachusetts Inst Technology
Application granted granted Critical
Publication of ATE145292T1 publication Critical patent/ATE145292T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/76—Architectures of general purpose stored program computers
    • G06F15/80—Architectures of general purpose stored program computers comprising an array of processing units with common control, e.g. single instruction multiple data processors
    • G06F15/8007—Architectures of general purpose stored program computers comprising an array of processing units with common control, e.g. single instruction multiple data processors single instruction multiple data [SIMD] multiprocessors
    • G06F15/803—Three-dimensional arrays or hypercubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/023—Stackable modules

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Computing Systems (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Multi Processors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Secondary Cells (AREA)
  • Carbon And Carbon Compounds (AREA)
AT93907546T 1992-03-17 1993-03-17 Geringbenachbarte dreidimensionale verbindung. ATE145292T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85260392A 1992-03-17 1992-03-17

Publications (1)

Publication Number Publication Date
ATE145292T1 true ATE145292T1 (de) 1996-11-15

Family

ID=25313769

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93907546T ATE145292T1 (de) 1992-03-17 1993-03-17 Geringbenachbarte dreidimensionale verbindung.

Country Status (7)

Country Link
US (1) US5568361A (de)
EP (1) EP0631678B1 (de)
JP (1) JPH07505490A (de)
AT (1) ATE145292T1 (de)
AU (1) AU3811393A (de)
DE (1) DE69305981T2 (de)
WO (1) WO1993019432A1 (de)

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US5930119A (en) * 1998-02-26 1999-07-27 Arizona Digital, Inc. Backplane having reduced LC product
US6512396B1 (en) 1999-01-29 2003-01-28 Arizona Digital, Inc. High speed data processing system and method
US6469901B1 (en) 2000-05-15 2002-10-22 3C Interactive, Inc. System and method for cartridge-based, geometry-variant scalable electronic systems
US6545891B1 (en) * 2000-08-14 2003-04-08 Matrix Semiconductor, Inc. Modular memory device
US6765813B2 (en) * 2000-08-14 2004-07-20 Matrix Semiconductor, Inc. Integrated systems using vertically-stacked three-dimensional memory cells
US6711043B2 (en) 2000-08-14 2004-03-23 Matrix Semiconductor, Inc. Three-dimensional memory cache system
JP5041499B2 (ja) * 2000-09-21 2012-10-03 庸美 徳原 結合型コンピュータ
US20040115995A1 (en) * 2002-11-25 2004-06-17 Sanders Samuel Sidney Circuit array module
US20070167081A1 (en) * 2006-01-17 2007-07-19 David Edelson Modular multi configuration standardized bus computer system
USD547737S1 (en) * 2006-04-18 2007-07-31 Wen Sung Lee Static electricity remover
WO2008097329A2 (en) * 2006-06-23 2008-08-14 Massachusetts Institute Of Technology Digital assembler for digital materials
US7907423B2 (en) * 2007-10-04 2011-03-15 Tyco Electronics Brasil Ltda. Modular power distribution assembly and method of making same
US8935426B2 (en) * 2009-02-26 2015-01-13 Koninklijke Philips N.V. Routing messages over a network of interconnected devices of a networked control system
US9220180B2 (en) * 2010-12-09 2015-12-22 Richard Anthony Dunn, JR. System and methods for scalable parallel data processing and process control
US8279597B2 (en) 2010-05-27 2012-10-02 International Business Machines Corporation Heatsink allowing in-situ maintenance in a stackable module
US8174826B2 (en) * 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
US8179674B2 (en) 2010-05-28 2012-05-15 International Business Machines Corporation Scalable space-optimized and energy-efficient computing system
US8358503B2 (en) 2010-05-28 2013-01-22 International Business Machines Corporation Stackable module for energy-efficient computing systems
US20110317373A1 (en) * 2010-06-23 2011-12-29 Mcdermid William James Method and Apparatus for Interconnecting Circuit Boards
US8322906B2 (en) 2011-08-08 2012-12-04 XtraLight Manufacturing Partnership Ltd Versatile lighting units
TWI565394B (zh) * 2013-03-20 2017-01-01 緯創資通股份有限公司 具鎖扣腳墊的電子裝置、其鎖扣腳墊結構、及堆疊式電子裝置系統
US9203772B2 (en) 2013-04-03 2015-12-01 Hewlett-Packard Development Company, L.P. Managing multiple cartridges that are electrically coupled together
US9644829B2 (en) 2013-04-25 2017-05-09 Xtralight Manufacturing, Ltd. Systems and methods for providing a field repairable light fixture with a housing that dissipates heat
JP6299756B2 (ja) * 2013-05-17 2018-03-28 日本電気株式会社 基板と基板装置及び基板接続方法
JP6704126B2 (ja) * 2015-12-17 2020-06-03 パナソニックＩｐマネジメント株式会社 接続構造体
WO2018208948A1 (en) * 2017-05-09 2018-11-15 Cubic Corporation Dual purpose latch
US10993323B2 (en) 2019-01-14 2021-04-27 Cody Elsing Stackable printed circuit board
KR102301027B1 (ko) * 2020-01-14 2021-09-10 주식회사 럭스로보 모듈을 이용한 독자 참여형 전자책 시스템 및 동작 방법

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Also Published As

Publication number Publication date
WO1993019432A1 (en) 1993-09-30
DE69305981D1 (de) 1996-12-19
JPH07505490A (ja) 1995-06-15
DE69305981T2 (de) 1997-05-15
US5568361A (en) 1996-10-22
EP0631678B1 (de) 1996-11-13
AU3811393A (en) 1993-10-21
EP0631678A1 (de) 1995-01-04

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