[go: up one dir, main page]

ATE447243T1 - MICROWAVE MODULE - Google Patents

MICROWAVE MODULE

Info

Publication number
ATE447243T1
ATE447243T1 AT07425745T AT07425745T ATE447243T1 AT E447243 T1 ATE447243 T1 AT E447243T1 AT 07425745 T AT07425745 T AT 07425745T AT 07425745 T AT07425745 T AT 07425745T AT E447243 T1 ATE447243 T1 AT E447243T1
Authority
AT
Austria
Prior art keywords
microwave module
enclosure
cover
microwave
module
Prior art date
Application number
AT07425745T
Other languages
German (de)
Inventor
Leopoldo Manfredi
Giulio Favre
Original Assignee
Siae Microelettronica Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siae Microelettronica Spa filed Critical Siae Microelettronica Spa
Application granted granted Critical
Publication of ATE447243T1 publication Critical patent/ATE447243T1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Constitution Of High-Frequency Heating (AREA)

Abstract

A Microwave Module in the form of a sealed enclosure comprising: a back of said enclosure, a cover of said enclosure, characterized in that a plurality of spring contacts are placed between said back and said cover, and by comprising a waveguide flange. ( Fig. 1 )
AT07425745T 2007-11-26 2007-11-26 MICROWAVE MODULE ATE447243T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07425745A EP2063484B1 (en) 2007-11-26 2007-11-26 Microwave module

Publications (1)

Publication Number Publication Date
ATE447243T1 true ATE447243T1 (en) 2009-11-15

Family

ID=39301242

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07425745T ATE447243T1 (en) 2007-11-26 2007-11-26 MICROWAVE MODULE

Country Status (4)

Country Link
EP (1) EP2063484B1 (en)
AT (1) ATE447243T1 (en)
DE (1) DE602007003031D1 (en)
ES (1) ES2334399T3 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113555332B (en) * 2021-07-13 2024-09-17 赛莱克斯微系统科技（北京）有限公司 High-frequency device integrated module and module

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4166256A (en) * 1977-01-05 1979-08-28 Hughes Aircraft Company Anti multipacting resonant cavity
US6459343B1 (en) 1999-02-25 2002-10-01 Formfactor, Inc. Integrated circuit interconnect system forming a multi-pole filter
JP3986741B2 (en) 2000-09-18 2007-10-03 三菱電機株式会社 Microwave module storage chassis
US6573803B1 (en) 2000-10-12 2003-06-03 Tyco Electronics Corp. Surface-mounted millimeter wave signal source with ridged microstrip to waveguide transition
US7411279B2 (en) * 2004-06-30 2008-08-12 Endwave Corporation Component interconnect with substrate shielding

Also Published As

Publication number Publication date
EP2063484A1 (en) 2009-05-27
EP2063484B1 (en) 2009-10-28
DE602007003031D1 (en) 2009-12-10
ES2334399T3 (en) 2010-03-09

Similar Documents

Publication Publication Date Title
TW200638130A (en) Optical package, optical lens and backlight assembly having the same
IN2014CN03762A (en)
ATE407546T1 (en) HEAT DISSIPATION SYSTEM FOR PORTABLE ELECTRONIC DEVICES
EP1786058A4 (en) ELECTRIC POWER SOURCE DEVICE
FR2865897B1 (en) MODULATORS FOR THE DEVELOPMENT OF MYCORRHIZIAN FUNGI WITH ARBUSCLES, AND.
EP1711708A4 (en) HYDROELECTRIC POWER PLANT
ITMI20050905A1 (en) DEVICE WE COMBINED FOOD COOKING PROCEDURE
TW200639428A (en) Light modulator device
TW200741298A (en) An optical module
NL1035213A1 (en) Base plate for built-in electrical devices.
SG129364A1 (en) Semiconductor device
ATE447243T1 (en) MICROWAVE MODULE
UY3494Q (en) CARD WITH FLY
DK1959494T3 (en) The power semiconductor module
DE602006017119D1 (en) COOKING DEVICE
DE50209279D1 (en) Heating device for an oven
ATE524406T1 (en) SYSTEM HOUSING
TW200506917A (en) Optical disk device
FR2918226B1 (en) AMPLIFICATION DEVICE, ELECTRONIC CIRCUIT AND CORRESPONDING ACOUSTIC ENCLOSURE.
IN2014CN04215A (en)
NO20053926D0 (en) Electromagnetic release device and electrical switchgear comprising the same.
UA2603U (en) DEVICE FOR OSTEOSYNTHESIS WITH Z-LIKE DAMPHER
CR8016S (en) ELECTRICAL DEVICE COVER
CR8019S (en) ELECTRICAL DEVICE COVER
ATE534791T1 (en) INSULATED FRAME PART

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties