AU2001266673A1 - System of fabricating plane parallel substrates with uniform optical paths - Google Patents
System of fabricating plane parallel substrates with uniform optical pathsInfo
- Publication number
- AU2001266673A1 AU2001266673A1 AU2001266673A AU6667301A AU2001266673A1 AU 2001266673 A1 AU2001266673 A1 AU 2001266673A1 AU 2001266673 A AU2001266673 A AU 2001266673A AU 6667301 A AU6667301 A AU 6667301A AU 2001266673 A1 AU2001266673 A1 AU 2001266673A1
- Authority
- AU
- Australia
- Prior art keywords
- fabricating
- plane parallel
- optical paths
- uniform optical
- parallel substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000003287 optical effect Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US20886300P | 2000-06-02 | 2000-06-02 | |
| US60208863 | 2000-06-02 | ||
| PCT/US2001/017955 WO2001094881A1 (en) | 2000-06-02 | 2001-06-01 | System of fabricating plane parallel substrates with uniform optical paths |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001266673A1 true AU2001266673A1 (en) | 2001-12-17 |
Family
ID=22776338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001266673A Abandoned AU2001266673A1 (en) | 2000-06-02 | 2001-06-01 | System of fabricating plane parallel substrates with uniform optical paths |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6639682B2 (en) |
| AU (1) | AU2001266673A1 (en) |
| WO (1) | WO2001094881A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6819438B2 (en) * | 2000-06-02 | 2004-11-16 | Gsi Lumonics Corporation | Technique for fabricating high quality optical components |
| JP4304904B2 (en) * | 2002-02-07 | 2009-07-29 | 株式会社島津製作所 | Etalon manufacturing method |
| US20040046969A1 (en) * | 2002-09-10 | 2004-03-11 | Honeywell International Inc. | System and method for monitoring thin film deposition on optical substrates |
| JP3811150B2 (en) * | 2003-09-05 | 2006-08-16 | 株式会社東芝 | Film thickness measuring method, film thickness measuring system, semiconductor device manufacturing method, and film thickness measuring system control program |
| JP2005291859A (en) * | 2004-03-31 | 2005-10-20 | Nec Compound Semiconductor Devices Ltd | Fine structure measurement method, fine structure measurement apparatus, and fine structure analysis system |
| US20080297808A1 (en) * | 2005-12-06 | 2008-12-04 | Nabeel Agha Riza | Optical Sensor For Extreme Environments |
| ATE503164T1 (en) * | 2007-01-17 | 2011-04-15 | Dow Corning | WEAR-RESISTANT MATERIALS USED BY DIRECT PROCESS |
| US8053256B2 (en) * | 2008-12-31 | 2011-11-08 | Texas Instruments Incorporated | Variable thickness single mask etch process |
| US8992286B2 (en) * | 2013-02-26 | 2015-03-31 | Applied Materials, Inc. | Weighted regression of thickness maps from spectral data |
| US9500468B2 (en) | 2014-08-25 | 2016-11-22 | Board Of Trustees Of Michigan State University | Scanning interferometry technique for through-thickness evaluation in multi-layered transparent structures |
| US9601904B1 (en) | 2015-12-07 | 2017-03-21 | Raytheon Company | Laser diode driver with variable input voltage and variable diode string voltage |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5327220A (en) | 1992-06-26 | 1994-07-05 | O.C.A. Applied Optics, Inc. | IR interferometric apparatus and method for determining the thickness variation of an optical part wherein said optical part defines Newton interference fringe patterns |
| US5396332A (en) * | 1993-02-08 | 1995-03-07 | Ciszek; Theodoer F. | Apparatus and method for measuring the thickness of a semiconductor wafer |
| US5528370A (en) | 1993-06-09 | 1996-06-18 | The Perkin-Elmer Corporation | Apparatus and method for measuring variations in thickness of an optical interference element |
| JPH07285069A (en) | 1994-04-18 | 1995-10-31 | Shin Etsu Handotai Co Ltd | Automatic taper removal polishing method and device of wafer in sheet type polishing |
| US5671050A (en) * | 1994-11-07 | 1997-09-23 | Zygo Corporation | Method and apparatus for profiling surfaces using diffracative optics |
| CN1131741A (en) | 1995-03-22 | 1996-09-25 | 载歌公司 | Optical gap measuring apparatus and method |
| US5724137A (en) | 1996-06-27 | 1998-03-03 | Tropel Corporation | Fringe pattern discriminator for interferometer using diffraction gratings |
| US5923425A (en) | 1997-11-20 | 1999-07-13 | Tropel Corporation | Grazing incidence interferometry for measuring transparent plane-parallel plates |
| US6301009B1 (en) * | 1997-12-01 | 2001-10-09 | Zygo Corporation | In-situ metrology system and method |
| US6048742A (en) | 1998-02-26 | 2000-04-11 | The United States Of America As Represented By The Secretary Of The Air Force | Process for measuring the thickness and composition of thin semiconductor films deposited on semiconductor wafers |
| US6198293B1 (en) | 1998-03-26 | 2001-03-06 | Massachusetts Institute Of Technology | Method and apparatus for thickness measurement using microwaves |
-
2001
- 2001-06-01 WO PCT/US2001/017955 patent/WO2001094881A1/en active Application Filing
- 2001-06-01 US US09/872,303 patent/US6639682B2/en not_active Expired - Fee Related
- 2001-06-01 AU AU2001266673A patent/AU2001266673A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20010053588A1 (en) | 2001-12-20 |
| US6639682B2 (en) | 2003-10-28 |
| WO2001094881A1 (en) | 2001-12-13 |
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