AU3135202A - Physical vapor deposition targets, and methods of fabricating metallic materials - Google Patents
Physical vapor deposition targets, and methods of fabricating metallic materialsInfo
- Publication number
- AU3135202A AU3135202A AU3135202A AU3135202A AU3135202A AU 3135202 A AU3135202 A AU 3135202A AU 3135202 A AU3135202 A AU 3135202A AU 3135202 A AU3135202 A AU 3135202A AU 3135202 A AU3135202 A AU 3135202A
- Authority
- AU
- Australia
- Prior art keywords
- methods
- vapor deposition
- physical vapor
- metallic materials
- deposition targets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C23/00—Extruding metal; Impact extrusion
- B21C23/001—Extruding metal; Impact extrusion to improve the material properties, e.g. lateral extrusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J1/00—Preparing metal stock or similar ancillary operations prior, during or post forging, e.g. heating or cooling
- B21J1/02—Preliminary treatment of metal stock without particular shaping, e.g. salvaging segregated zones, forging or pressing in the rough
- B21J1/025—Preliminary treatment of metal stock without particular shaping, e.g. salvaging segregated zones, forging or pressing in the rough affecting grain orientation
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Landscapes
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Forging (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/705,101 US6946039B1 (en) | 2000-11-02 | 2000-11-02 | Physical vapor deposition targets, and methods of fabricating metallic materials |
| PCT/US2001/051010 WO2002036847A2 (en) | 2000-11-02 | 2001-10-25 | Sputtering target |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU3135202A true AU3135202A (en) | 2002-05-15 |
Family
ID=24832037
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002231352A Abandoned AU2002231352A1 (en) | 2000-11-02 | 2001-10-25 | Sputtering target |
| AU3135202A Pending AU3135202A (en) | 2000-11-02 | 2001-10-26 | Physical vapor deposition targets, and methods of fabricating metallic materials |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002231352A Abandoned AU2002231352A1 (en) | 2000-11-02 | 2001-10-25 | Sputtering target |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6946039B1 (xx) |
| EP (1) | EP1337682A2 (xx) |
| JP (1) | JP2004513228A (xx) |
| KR (1) | KR20030063372A (xx) |
| CN (1) | CN1266304C (xx) |
| AU (2) | AU2002231352A1 (xx) |
| TW (1) | TWI247819B (xx) |
| WO (1) | WO2002036847A2 (xx) |
Families Citing this family (79)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040072009A1 (en) * | 1999-12-16 | 2004-04-15 | Segal Vladimir M. | Copper sputtering targets and methods of forming copper sputtering targets |
| US6878250B1 (en) | 1999-12-16 | 2005-04-12 | Honeywell International Inc. | Sputtering targets formed from cast materials |
| US20010047838A1 (en) * | 2000-03-28 | 2001-12-06 | Segal Vladimir M. | Methods of forming aluminum-comprising physical vapor deposition targets; sputtered films; and target constructions |
| US6946039B1 (en) | 2000-11-02 | 2005-09-20 | Honeywell International Inc. | Physical vapor deposition targets, and methods of fabricating metallic materials |
| US20040221929A1 (en) | 2003-05-09 | 2004-11-11 | Hebda John J. | Processing of titanium-aluminum-vanadium alloys and products made thereby |
| US7228722B2 (en) * | 2003-06-09 | 2007-06-12 | Cabot Corporation | Method of forming sputtering articles by multidirectional deformation |
| US7293445B2 (en) * | 2003-06-13 | 2007-11-13 | General Motors Corporation | Sheet processing apparatus, method of use, and plastically deformed sheet |
| KR20060029622A (ko) * | 2003-06-20 | 2006-04-06 | 캐보트 코포레이션 | 백킹 플레이트에 스퍼터 타겟 부착을 위한 방법 및 디자인 |
| WO2005021828A2 (en) * | 2003-08-21 | 2005-03-10 | Honeywell International Inc. | Copper-containing pvd targets and methods for their manufacture |
| US20050236270A1 (en) * | 2004-04-23 | 2005-10-27 | Heraeus, Inc. | Controlled cooling of sputter targets |
| US7837812B2 (en) | 2004-05-21 | 2010-11-23 | Ati Properties, Inc. | Metastable beta-titanium alloys and methods of processing the same by direct aging |
| US7998287B2 (en) * | 2005-02-10 | 2011-08-16 | Cabot Corporation | Tantalum sputtering target and method of fabrication |
| EP2123791B1 (en) * | 2005-03-28 | 2014-08-13 | JX Nippon Mining & Metals Corporation | Deep-pot-shaped copper sputtering target |
| AT8697U1 (de) | 2005-10-14 | 2006-11-15 | Plansee Se | Rohrtarget |
| DE102006003279B4 (de) * | 2006-01-23 | 2010-03-25 | W.C. Heraeus Gmbh | Sputtertarget mit hochschmelzender Phase |
| CN101374611B (zh) * | 2006-03-07 | 2015-04-08 | 卡伯特公司 | 制备变形金属制品的方法 |
| US20070251819A1 (en) * | 2006-05-01 | 2007-11-01 | Kardokus Janine K | Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targets |
| US20080078268A1 (en) | 2006-10-03 | 2008-04-03 | H.C. Starck Inc. | Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof |
| US20080145688A1 (en) | 2006-12-13 | 2008-06-19 | H.C. Starck Inc. | Method of joining tantalum clade steel structures |
| US8261592B2 (en) * | 2007-04-19 | 2012-09-11 | Indimet Inc. | Method of providing a solenoid housing |
| US8197894B2 (en) | 2007-05-04 | 2012-06-12 | H.C. Starck Gmbh | Methods of forming sputtering targets |
| CN100421830C (zh) * | 2007-05-09 | 2008-10-01 | 中国科学院金属研究所 | 一种制备异种合金层状复合材料的方法 |
| KR101201577B1 (ko) | 2007-08-06 | 2012-11-14 | 에이치. 씨. 스타아크 아이앤씨 | 향상된 조직 균일성을 가진 내화 금속판 |
| US8250895B2 (en) * | 2007-08-06 | 2012-08-28 | H.C. Starck Inc. | Methods and apparatus for controlling texture of plates and sheets by tilt rolling |
| US8702919B2 (en) * | 2007-08-13 | 2014-04-22 | Honeywell International Inc. | Target designs and related methods for coupled target assemblies, methods of production and uses thereof |
| JP5160554B2 (ja) * | 2007-10-23 | 2013-03-13 | Jx日鉱日石金属株式会社 | 高純度イッテルビウム、高純度イッテルビウムからなるスパッタリングターゲット、高純度イッテルビウムを含有する薄膜及び高純度イッテルビウムの製造方法 |
| JP5046890B2 (ja) * | 2007-11-29 | 2012-10-10 | 株式会社コベルコ科研 | Ag系スパッタリングターゲット |
| JP5379010B2 (ja) * | 2008-02-08 | 2013-12-25 | Jx日鉱日石金属株式会社 | イッテルビウム製スパッタリングターゲット及び同ターゲットの製造方法。 |
| US7958764B2 (en) * | 2008-02-15 | 2011-06-14 | Indimet Inc. | Method for providing an armature housing |
| US7846378B2 (en) * | 2008-04-01 | 2010-12-07 | Los Alamos National Security, Llc | Preparation of a dense, polycrystalline ceramic structure |
| US8246903B2 (en) | 2008-09-09 | 2012-08-21 | H.C. Starck Inc. | Dynamic dehydriding of refractory metal powders |
| US20110123389A1 (en) * | 2008-09-30 | 2011-05-26 | Jx Nippon Mining & Metals Corporation | High Purity Copper and Method of Producing High Purity Copper Based on Electrolysis |
| KR101290856B1 (ko) | 2008-09-30 | 2013-07-29 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 고순도 구리 또는 고순도 구리 합금 스퍼터링 타겟 및 동 스퍼터링 타겟의 제조 방법 |
| US8453487B2 (en) * | 2008-10-10 | 2013-06-04 | Tosoh Smd, Inc. | Circular groove pressing mechanism and method for sputtering target manufacturing |
| RU2383654C1 (ru) * | 2008-10-22 | 2010-03-10 | Государственное образовательное учреждение высшего профессионального образования "Уфимский государственный авиационный технический университет" | Наноструктурный технически чистый титан для биомедицины и способ получения прутка из него |
| JP5696051B2 (ja) * | 2008-11-03 | 2015-04-08 | トーソー エスエムディー,インク. | スパッターターゲットを製造する方法 |
| KR20110106787A (ko) * | 2009-01-22 | 2011-09-29 | 토소우 에스엠디, 인크 | 모놀리식 알루미늄 합금 타겟 및 그 제조방법 |
| US8493746B2 (en) * | 2009-02-12 | 2013-07-23 | International Business Machines Corporation | Additives for grain fragmentation in Pb-free Sn-based solder |
| US8128868B2 (en) * | 2009-02-12 | 2012-03-06 | International Business Machines Corporation | Grain refinement by precipitate formation in PB-free alloys of tin |
| US10053758B2 (en) | 2010-01-22 | 2018-08-21 | Ati Properties Llc | Production of high strength titanium |
| MY160620A (en) * | 2010-03-17 | 2017-03-15 | Nippon Steel Corp | Metal tape material and interconnector for solar cell collection |
| US9255316B2 (en) | 2010-07-19 | 2016-02-09 | Ati Properties, Inc. | Processing of α+β titanium alloys |
| US8499605B2 (en) | 2010-07-28 | 2013-08-06 | Ati Properties, Inc. | Hot stretch straightening of high strength α/β processed titanium |
| US9206497B2 (en) | 2010-09-15 | 2015-12-08 | Ati Properties, Inc. | Methods for processing titanium alloys |
| US8613818B2 (en) | 2010-09-15 | 2013-12-24 | Ati Properties, Inc. | Processing routes for titanium and titanium alloys |
| US10513755B2 (en) | 2010-09-23 | 2019-12-24 | Ati Properties Llc | High strength alpha/beta titanium alloy fasteners and fastener stock |
| US8652400B2 (en) | 2011-06-01 | 2014-02-18 | Ati Properties, Inc. | Thermo-mechanical processing of nickel-base alloys |
| JP5787647B2 (ja) * | 2011-07-08 | 2015-09-30 | 古河電気工業株式会社 | スパッタリングターゲット用銅材料の製造方法 |
| US9120183B2 (en) | 2011-09-29 | 2015-09-01 | H.C. Starck Inc. | Methods of manufacturing large-area sputtering targets |
| US9142226B2 (en) | 2012-06-29 | 2015-09-22 | Seagate Technology Llc | Thin film with tuned grain size |
| US9050647B2 (en) | 2013-03-15 | 2015-06-09 | Ati Properties, Inc. | Split-pass open-die forging for hard-to-forge, strain-path sensitive titanium-base and nickel-base alloys |
| US9034150B2 (en) | 2012-11-29 | 2015-05-19 | Seagate Technology Llc | Thin film with tuned anisotropy and magnetic moment |
| US9869003B2 (en) | 2013-02-26 | 2018-01-16 | Ati Properties Llc | Methods for processing alloys |
| US9192981B2 (en) | 2013-03-11 | 2015-11-24 | Ati Properties, Inc. | Thermomechanical processing of high strength non-magnetic corrosion resistant material |
| US9777361B2 (en) | 2013-03-15 | 2017-10-03 | Ati Properties Llc | Thermomechanical processing of alpha-beta titanium alloys |
| US11111552B2 (en) | 2013-11-12 | 2021-09-07 | Ati Properties Llc | Methods for processing metal alloys |
| WO2015142640A1 (en) * | 2014-03-18 | 2015-09-24 | University Of Houston System | Systems, methods, and materials for cryogenic thermoelectric cooling |
| US10011895B2 (en) | 2014-05-06 | 2018-07-03 | Gyrus Acmi, Inc. | Assembly fabrication and modification of elasticity in materials |
| US9378760B2 (en) | 2014-07-31 | 2016-06-28 | Seagate Technology Llc | Data reader with tuned microstructure |
| US10094003B2 (en) | 2015-01-12 | 2018-10-09 | Ati Properties Llc | Titanium alloy |
| JP6459601B2 (ja) * | 2015-02-17 | 2019-01-30 | 三菱マテリアル株式会社 | Niスパッタリングターゲット |
| JP7021069B2 (ja) | 2015-08-03 | 2022-02-16 | ハネウェル・インターナショナル・インコーポレーテッド | 向上した特性を有する無摩擦鍛造アルミニウム合金スパッタリングターゲット |
| US10502252B2 (en) | 2015-11-23 | 2019-12-10 | Ati Properties Llc | Processing of alpha-beta titanium alloys |
| JP7077225B2 (ja) * | 2016-06-02 | 2022-05-30 | 田中貴金属工業株式会社 | 金スパッタリングターゲット |
| US10900102B2 (en) | 2016-09-30 | 2021-01-26 | Honeywell International Inc. | High strength aluminum alloy backing plate and methods of making |
| US11244815B2 (en) | 2017-04-20 | 2022-02-08 | Honeywell International Inc. | Profiled sputtering target and method of making the same |
| US10760156B2 (en) * | 2017-10-13 | 2020-09-01 | Honeywell International Inc. | Copper manganese sputtering target |
| JP7274816B2 (ja) * | 2017-12-06 | 2023-05-17 | 田中貴金属工業株式会社 | 金スパッタリングターゲットとその製造方法 |
| JP7214650B2 (ja) * | 2017-12-06 | 2023-01-30 | 田中貴金属工業株式会社 | 金スパッタリングターゲットの製造方法及び金膜の製造方法 |
| KR20190071369A (ko) * | 2017-12-14 | 2019-06-24 | 엘티메탈 주식회사 | 전자기 차폐용 스퍼터링 타겟 및 이의 제조방법 |
| CN108465700B (zh) * | 2018-03-13 | 2020-09-08 | 重庆大学 | 一种获得均匀组织和织构的溅射靶材用钽板轧制方法 |
| CN110735060A (zh) * | 2019-11-25 | 2020-01-31 | 兰州理工大学 | 一种改善铝合金性能的连续正交轧制方法 |
| CN111304608B (zh) * | 2020-03-17 | 2021-10-15 | 贵研铂业股份有限公司 | 一种晶粒高定向取向的镍铂合金溅射靶材及其制备方法 |
| CN112063976B (zh) * | 2020-09-11 | 2022-08-30 | 宁波江丰电子材料股份有限公司 | 一种超高纯铜靶材及其晶粒控制方法 |
| CN112921287B (zh) * | 2021-01-22 | 2022-10-28 | 宁波江丰电子材料股份有限公司 | 一种超高纯铜靶材及其晶粒取向控制方法 |
| CN113046705B (zh) * | 2021-03-16 | 2022-08-16 | 宁波江丰电子材料股份有限公司 | 一种铜靶材及其制备方法和用途 |
| US12344918B2 (en) | 2023-07-12 | 2025-07-01 | Ati Properties Llc | Titanium alloys |
| CN116716499A (zh) * | 2023-08-07 | 2023-09-08 | 包头职业技术学院 | 一种高性能AlZnMgCu合金的制备工艺 |
| CN117187722A (zh) * | 2023-09-28 | 2023-12-08 | 芜湖映日科技股份有限公司 | 一种银合金靶材晶粒均匀化的轧制退火控制工艺 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5087297A (en) | 1991-01-17 | 1992-02-11 | Johnson Matthey Inc. | Aluminum target for magnetron sputtering and method of making same |
| JP3769761B2 (ja) | 1994-04-28 | 2006-04-26 | 住友化学株式会社 | アルミニウム合金単結晶ターゲットおよびその製造方法 |
| US5590389A (en) * | 1994-12-23 | 1996-12-31 | Johnson Matthey Electronics, Inc. | Sputtering target with ultra-fine, oriented grains and method of making same |
| US6197134B1 (en) | 1997-01-08 | 2001-03-06 | Dowa Mining Co., Ltd. | Processes for producing fcc metals |
| US6569270B2 (en) * | 1997-07-11 | 2003-05-27 | Honeywell International Inc. | Process for producing a metal article |
| US6139701A (en) * | 1997-11-26 | 2000-10-31 | Applied Materials, Inc. | Copper target for sputter deposition |
| US6086725A (en) * | 1998-04-02 | 2000-07-11 | Applied Materials, Inc. | Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life |
| AU2001265309A1 (en) | 2000-06-02 | 2001-12-17 | Honeywell International, Inc. | Fine grain size material, sputtering target, methods of forming, and micro-arc reduction method |
| US6946039B1 (en) | 2000-11-02 | 2005-09-20 | Honeywell International Inc. | Physical vapor deposition targets, and methods of fabricating metallic materials |
-
2000
- 2000-11-02 US US09/705,101 patent/US6946039B1/en not_active Expired - Fee Related
-
2001
- 2001-10-25 WO PCT/US2001/051010 patent/WO2002036847A2/en active Application Filing
- 2001-10-25 EP EP01991626A patent/EP1337682A2/en not_active Withdrawn
- 2001-10-25 JP JP2002539586A patent/JP2004513228A/ja not_active Withdrawn
- 2001-10-25 AU AU2002231352A patent/AU2002231352A1/en not_active Abandoned
- 2001-10-26 AU AU3135202A patent/AU3135202A/xx active Pending
- 2001-10-26 CN CNB01821701XA patent/CN1266304C/zh not_active Expired - Fee Related
- 2001-10-26 KR KR10-2003-7006139A patent/KR20030063372A/ko not_active Ceased
- 2001-11-02 TW TW090127312A patent/TWI247819B/zh active
-
2002
- 2002-06-12 US US10/171,714 patent/US6908517B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI247819B (en) | 2006-01-21 |
| WO2002036847A2 (en) | 2002-05-10 |
| KR20030063372A (ko) | 2003-07-28 |
| WO2002036847A3 (en) | 2003-02-13 |
| CN1484711A (zh) | 2004-03-24 |
| EP1337682A2 (en) | 2003-08-27 |
| US6946039B1 (en) | 2005-09-20 |
| US20020153071A1 (en) | 2002-10-24 |
| JP2004513228A (ja) | 2004-04-30 |
| AU2002231352A1 (en) | 2002-05-15 |
| CN1266304C (zh) | 2006-07-26 |
| US6908517B2 (en) | 2005-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU3135202A (en) | Physical vapor deposition targets, and methods of fabricating metallic materials | |
| AU2003259147A1 (en) | Continuous chemical vapor deposition process and process furnace | |
| TW574392B (en) | Physical vapor deposition device and method | |
| AU1959501A (en) | Thermal barrier coatings and electron-beam, physical vapor deposition for makingsame | |
| MXPA03003545A (es) | Metodo para elaborar articulos revestidos, y los articulos revestidos a partir del mismo. | |
| AU2001229351A1 (en) | Manufacturing medical devices by vapor deposition | |
| AU2002353162A1 (en) | Multiple threat penetration resistant articles | |
| AU2568502A (en) | Plasma enhanced pulsed layer deposition | |
| EP1314795A4 (en) | LOW PARTICLE NUMBER OF PRODUCING SPUTTERING TARGET | |
| AU2002249878A1 (en) | Methods of forming sputtering targets | |
| GB0026868D0 (en) | Control of deposition and other processes | |
| EP1449935A4 (en) | SPRAY TARGET AND METHOD OF MANUFACTURING THE SAME | |
| DE60012625D1 (de) | Material zur Gasphasenabscheidung | |
| EP1088787A4 (en) | METHOD FOR PRODUCING METAL OXIDE, TARGET COMPRISING METAL OXIDE FOR FORMING A THIN FILM OF METAL OXIDE, METHOD FOR PRODUCING SAME AND METHOD FOR PRODUCING THIN FILM OF METAL OXIDE | |
| GB0207577D0 (en) | Perforating gun carriers and their methods of manufacture | |
| AU2002255471A1 (en) | Physical vapor deposition components and methods of formation | |
| AU2002249829A1 (en) | Chemical vapor deposition devices and methods | |
| SG115347A1 (en) | Composite magnetizer, composite magnetizer sheet, and methods of manufacturing the same | |
| AU2727201A (en) | Ferroelectric composition, ferroelectric vapor deposition target and method of making a ferroelectric vapor deposition target | |
| GB2348440B (en) | Depositing metal upon an article | |
| AUPR353601A0 (en) | Deposition process | |
| HK1058809A (en) | Physical vapor deposition targets, and methods of fabricating metallic materials | |
| HK1058808A (en) | Physical vapor deposition target assemblies, and methods of forming physical vapor deposition target assemblies | |
| GB0115396D0 (en) | Improved metallic materials and their production | |
| AU2001239345A1 (en) | High temperature resistant composite material |