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BRPI0921441A2 - liga de cobre-estanho, material composto e uso - Google Patents

liga de cobre-estanho, material composto e uso

Info

Publication number
BRPI0921441A2
BRPI0921441A2 BRPI0921441A BRPI0921441A BRPI0921441A2 BR PI0921441 A2 BRPI0921441 A2 BR PI0921441A2 BR PI0921441 A BRPI0921441 A BR PI0921441A BR PI0921441 A BRPI0921441 A BR PI0921441A BR PI0921441 A2 BRPI0921441 A2 BR PI0921441A2
Authority
BR
Brazil
Prior art keywords
copper
composite material
tin alloy
tin
alloy
Prior art date
Application number
BRPI0921441A
Other languages
English (en)
Inventor
Andreas Heide
Michael Köhler
Ralf Hojda
Udo Riepe
Original Assignee
Sundwiger Messingwerk Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sundwiger Messingwerk Gmbh & Co Kg filed Critical Sundwiger Messingwerk Gmbh & Co Kg
Publication of BRPI0921441A2 publication Critical patent/BRPI0921441A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Insulated Conductors (AREA)
  • Contacts (AREA)
BRPI0921441A 2008-10-31 2009-10-27 liga de cobre-estanho, material composto e uso BRPI0921441A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008054183 2008-10-31
PCT/EP2009/007669 WO2010049118A1 (de) 2008-10-31 2009-10-27 Kupfer-zinn-legierung, verbundwerkstoff und verwendung

Publications (1)

Publication Number Publication Date
BRPI0921441A2 true BRPI0921441A2 (pt) 2016-01-05

Family

ID=41508956

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0921441A BRPI0921441A2 (pt) 2008-10-31 2009-10-27 liga de cobre-estanho, material composto e uso

Country Status (9)

Country Link
US (1) US20110206941A1 (pt)
EP (1) EP2340318B1 (pt)
JP (1) JP2012506952A (pt)
KR (1) KR20110079638A (pt)
CN (1) CN102177265B (pt)
BR (1) BRPI0921441A2 (pt)
ES (1) ES2623604T3 (pt)
RU (1) RU2482204C2 (pt)
WO (1) WO2010049118A1 (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012067903A2 (en) * 2010-11-17 2012-05-24 Luvata Appleton Llc Alkaline collector anode
CN102176809A (zh) * 2011-01-14 2011-09-07 中国科学院上海技术物理研究所 一种用于印制电路板上的贴片电阻与电容的调试器
CN102703748B (zh) * 2012-07-06 2013-10-16 山东大学 一种纳米多孔铜锡合金的制备方法
RU2502817C1 (ru) * 2012-12-18 2013-12-27 Юлия Алексеевна Щепочкина Сплав на основе меди
JP5773015B2 (ja) 2013-05-24 2015-09-02 三菱マテリアル株式会社 銅合金線
JP6113674B2 (ja) 2014-02-13 2017-04-12 株式会社神戸製鋼所 耐熱性に優れる表面被覆層付き銅合金板条
RU2587110C9 (ru) * 2014-09-22 2016-08-10 Дмитрий Андреевич Михайлов МЕДНЫЙ СПЛАВ, ЛЕГИРОВАННЫЙ ТЕЛЛУРОМ ТелО, ДЛЯ КОЛЛЕКТОРОВ ЭЛЕКТРИЧЕСКИХ МАШИН
CN107034381B (zh) * 2017-04-26 2019-03-19 江西理工大学 一种Cu-Ni-Co-Sn-P铜合金及其制备方法
RU2709909C1 (ru) * 2018-11-26 2019-12-23 Федеральное государственное автономное образовательное учреждение высшего образования "Белгородский государственный национальный исследовательский университет" (НИУ "БелГУ") Низколегированный медный сплав
DE102019106136A1 (de) 2019-03-11 2020-09-17 M.G. Meccanica Srl Verfahren zur Herstellung von metallischen Bauteilen sowie dadurch hergestelltes metallisches Bauteil
CN116411202A (zh) * 2021-12-29 2023-07-11 无锡市蓝格林金属材料科技有限公司 一种铜锡合金线材及其制备方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727051A (en) * 1980-07-25 1982-02-13 Nippon Telegr & Teleph Corp <Ntt> Copper nickel tin alloy for integrated circuit conductor and its manufacture
JPH0612796B2 (ja) * 1984-06-04 1994-02-16 株式会社日立製作所 半導体装置
JPS6379929A (ja) * 1987-08-26 1988-04-09 Nippon Telegr & Teleph Corp <Ntt> 集積回路導体用銅ニッケル錫合金およびその製造方法
US5322575A (en) * 1991-01-17 1994-06-21 Dowa Mining Co., Ltd. Process for production of copper base alloys and terminals using the same
JP3550233B2 (ja) * 1995-10-09 2004-08-04 同和鉱業株式会社 高強度高導電性銅基合金の製造法
JP3408929B2 (ja) * 1996-07-11 2003-05-19 同和鉱業株式会社 銅基合金およびその製造方法
US6254702B1 (en) * 1997-02-18 2001-07-03 Dowa Mining Co., Ltd. Copper base alloys and terminals using the same
US6679956B2 (en) * 1997-09-16 2004-01-20 Waterbury Rolling Mills, Inc. Process for making copper-tin-zinc alloys
JP4308931B2 (ja) * 1997-11-04 2009-08-05 三菱伸銅株式会社 ＳｎまたはＳｎ合金メッキ銅合金薄板およびその薄板で製造したコネクタ
KR100329153B1 (ko) * 1998-07-08 2002-03-21 구마모토 마사히로 단자 및 커넥터용 구리합금 및 그 제조방법
RU2138573C1 (ru) * 1998-12-24 1999-09-27 Мочалов Николай Алексеевич Сплав на основе меди
DE10025106A1 (de) * 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Elektrisch leitfähiges Metallband und Steckverbinder hieraus
JP3878640B2 (ja) * 2003-03-03 2007-02-07 三宝伸銅工業株式会社 耐熱性銅合金材
JP2007519261A (ja) * 2004-01-21 2007-07-12 エントン インコーポレイテッド 電子部品のスズ表面における半田付け性の保存及びウイスカ成長の阻止
JP4660735B2 (ja) * 2004-07-01 2011-03-30 Ｄｏｗａメタルテック株式会社 銅基合金板材の製造方法
JP4461269B2 (ja) * 2004-09-15 2010-05-12 Ｄｏｗａメタルテック株式会社 導電性を改善した銅合金およびその製造法
JP4350049B2 (ja) * 2005-02-07 2009-10-21 株式会社神戸製鋼所 耐応力緩和特性に優れた銅合金板の製造方法
JP4959141B2 (ja) * 2005-02-28 2012-06-20 Ｄｏｗａホールディングス株式会社 高強度銅合金
JP4887851B2 (ja) * 2005-03-17 2012-02-29 Ｄｏｗａメタルテック株式会社 Ｎｉ−Ｓｎ−Ｐ系銅合金
JP3871064B2 (ja) * 2005-06-08 2007-01-24 株式会社神戸製鋼所 電気接続部品用銅合金板
JP4756195B2 (ja) * 2005-07-28 2011-08-24 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｓｎ−Ｐ系銅合金
JP4439447B2 (ja) * 2005-08-03 2010-03-24 株式会社神戸製鋼所 異形断面銅合金板の製造方法
JP4984108B2 (ja) * 2005-09-30 2012-07-25 Ｄｏｗａメタルテック株式会社 プレス打抜き性の良いＣｕ−Ｎｉ−Ｓｎ−Ｐ系銅合金およびその製造法
JP4680765B2 (ja) * 2005-12-22 2011-05-11 株式会社神戸製鋼所 耐応力緩和特性に優れた銅合金
RU2315124C2 (ru) * 2006-01-10 2008-01-20 ОАО "Каменск-Уральский завод по обработке цветных металлов" Оловянно-цинковая бронза для изготовления проволоки
JP4845747B2 (ja) * 2007-01-12 2011-12-28 株式会社神戸製鋼所 ヒューズ用めっき付き銅合金材料及びその製造方法
EP2228460B1 (en) * 2007-12-21 2017-01-11 Mitsubishi Shindoh Co., Ltd. High-strength highly heat-conductive copper alloy pipe and process for producing the same

Also Published As

Publication number Publication date
JP2012506952A (ja) 2012-03-22
WO2010049118A1 (de) 2010-05-06
KR20110079638A (ko) 2011-07-07
ES2623604T3 (es) 2017-07-11
CN102177265A (zh) 2011-09-07
CN102177265B (zh) 2014-07-09
RU2011121810A (ru) 2012-12-10
EP2340318B1 (de) 2017-02-15
US20110206941A1 (en) 2011-08-25
RU2482204C2 (ru) 2013-05-20
EP2340318A1 (de) 2011-07-06

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]