CA1340758C - Energy curable compositions: single component curing agents - Google Patents
Energy curable compositions: single component curing agentsInfo
- Publication number
- CA1340758C CA1340758C CA000597247A CA597247A CA1340758C CA 1340758 C CA1340758 C CA 1340758C CA 000597247 A CA000597247 A CA 000597247A CA 597247 A CA597247 A CA 597247A CA 1340758 C CA1340758 C CA 1340758C
- Authority
- CA
- Canada
- Prior art keywords
- eta6
- compounds
- electrons
- composition according
- ligands
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 100
- 239000000178 monomer Substances 0.000 claims abstract description 60
- 125000002524 organometallic group Chemical group 0.000 claims abstract description 35
- 239000002243 precursor Substances 0.000 claims abstract description 32
- 239000004593 Epoxy Substances 0.000 claims abstract description 31
- 239000004814 polyurethane Substances 0.000 claims abstract description 30
- 229920002635 polyurethane Polymers 0.000 claims abstract description 30
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 27
- 150000001768 cations Chemical class 0.000 claims abstract description 23
- 239000011230 binding agent Substances 0.000 claims abstract description 6
- 239000012704 polymeric precursor Substances 0.000 claims abstract description 5
- 239000011253 protective coating Substances 0.000 claims abstract description 3
- -1 sulfonate anions Chemical class 0.000 claims description 167
- 150000001875 compounds Chemical group 0.000 claims description 64
- 239000003446 ligand Substances 0.000 claims description 57
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 238000006116 polymerization reaction Methods 0.000 claims description 27
- 239000005056 polyisocyanate Substances 0.000 claims description 26
- 229920001228 polyisocyanate Polymers 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 15
- 150000001450 anions Chemical group 0.000 claims description 14
- 125000004429 atom Chemical group 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 11
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 10
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 9
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 9
- 125000004122 cyclic group Chemical group 0.000 claims description 8
- 150000003926 acrylamides Chemical class 0.000 claims description 6
- 125000002015 acyclic group Chemical group 0.000 claims description 6
- 125000006615 aromatic heterocyclic group Chemical group 0.000 claims description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims description 5
- 229910052752 metalloid Inorganic materials 0.000 claims description 5
- 150000002738 metalloids Chemical class 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 230000000737 periodic effect Effects 0.000 claims description 5
- 230000005670 electromagnetic radiation Effects 0.000 claims description 4
- 230000000977 initiatory effect Effects 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000003504 photosensitizing agent Substances 0.000 claims description 4
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 claims description 3
- 239000007800 oxidant agent Substances 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- MYWUZJCMWCOHBA-VIFPVBQESA-N methamphetamine Chemical compound CN[C@@H](C)CC1=CC=CC=C1 MYWUZJCMWCOHBA-VIFPVBQESA-N 0.000 claims 1
- 150000003839 salts Chemical class 0.000 abstract description 32
- 125000004432 carbon atom Chemical group C* 0.000 abstract description 13
- 229910052799 carbon Inorganic materials 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000003082 abrasive agent Substances 0.000 abstract description 3
- 150000003624 transition metals Chemical group 0.000 abstract description 3
- 238000001723 curing Methods 0.000 description 36
- 229920000642 polymer Polymers 0.000 description 23
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 22
- 230000005855 radiation Effects 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 12
- 125000005842 heteroatom Chemical group 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- 229940048053 acrylate Drugs 0.000 description 11
- 239000003054 catalyst Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 125000003118 aryl group Chemical group 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 9
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 9
- 229910052787 antimony Inorganic materials 0.000 description 9
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 9
- 229910052785 arsenic Inorganic materials 0.000 description 9
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 9
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 9
- 229910052698 phosphorus Inorganic materials 0.000 description 9
- 239000011574 phosphorus Substances 0.000 description 9
- 150000003254 radicals Chemical class 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 239000011593 sulfur Substances 0.000 description 9
- 229910052717 sulfur Inorganic materials 0.000 description 9
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 229910052711 selenium Inorganic materials 0.000 description 8
- 239000011669 selenium Substances 0.000 description 8
- 229910052714 tellurium Inorganic materials 0.000 description 8
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052796 boron Inorganic materials 0.000 description 7
- 150000002118 epoxides Chemical group 0.000 description 7
- 229920005862 polyol Polymers 0.000 description 7
- 150000003077 polyols Chemical class 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 6
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 6
- WDECIBYCCFPHNR-UHFFFAOYSA-N chrysene Chemical compound C1=CC=CC2=CC=C3C4=CC=CC=C4C=CC3=C21 WDECIBYCCFPHNR-UHFFFAOYSA-N 0.000 description 6
- 229910052732 germanium Inorganic materials 0.000 description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 125000005442 diisocyanate group Chemical group 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 4
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 4
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- KEJOCWOXCDWNID-UHFFFAOYSA-N Nitrilooxonium Chemical compound [O+]#N KEJOCWOXCDWNID-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 4
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 4
- 150000001491 aromatic compounds Chemical class 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 4
- 125000002837 carbocyclic group Chemical group 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 230000000536 complexating effect Effects 0.000 description 4
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 4
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 4
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 4
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 4
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 4
- 125000000962 organic group Chemical group 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 238000000016 photochemical curing Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 239000011550 stock solution Substances 0.000 description 4
- 238000001029 thermal curing Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000005605 benzo group Chemical group 0.000 description 3
- UUZRATKFAUQBJJ-UHFFFAOYSA-N carbon monoxide;iron Chemical compound [Fe].[O+]#[C-].[O+]#[C-].[O+]#[C-] UUZRATKFAUQBJJ-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- XNMQEEKYCVKGBD-UHFFFAOYSA-N dimethylacetylene Natural products CC#CC XNMQEEKYCVKGBD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 150000002527 isonitriles Chemical class 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000006303 photolysis reaction Methods 0.000 description 3
- 230000015843 photosynthesis, light reaction Effects 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 229910052723 transition metal Inorganic materials 0.000 description 3
- 239000012991 xanthate Substances 0.000 description 3
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 2
- ZWVHTXAYIKBMEE-UHFFFAOYSA-N 2-hydroxyacetophenone Chemical compound OCC(=O)C1=CC=CC=C1 ZWVHTXAYIKBMEE-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 description 2
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910017048 AsF6 Inorganic materials 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical group [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- DBRZGNYIMPFKEV-UHFFFAOYSA-N FC(F)(F)C1(C=CSS1)C(F)(F)F Chemical compound FC(F)(F)C1(C=CSS1)C(F)(F)F DBRZGNYIMPFKEV-UHFFFAOYSA-N 0.000 description 2
- 239000004471 Glycine Substances 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical class ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 2
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 2
- KYIMHWNKQXQBDG-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCC Chemical compound N=C=O.N=C=O.CCCCCC KYIMHWNKQXQBDG-UHFFFAOYSA-N 0.000 description 2
- YIKSCQDJHCMVMK-UHFFFAOYSA-N Oxamide Chemical compound NC(=O)C(N)=O YIKSCQDJHCMVMK-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 235000004279 alanine Nutrition 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- IMHDGJOMLMDPJN-UHFFFAOYSA-N biphenyl-2,2'-diol Chemical group OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 2
- 125000000707 boryl group Chemical group B* 0.000 description 2
- 125000001246 bromo group Chemical group Br* 0.000 description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical compound CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 2
- LLCSWKVOHICRDD-UHFFFAOYSA-N buta-1,3-diyne Chemical group C#CC#C LLCSWKVOHICRDD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- JNZSJDBNBJWXMZ-UHFFFAOYSA-N carbon diselenide Chemical compound [Se]=C=[Se] JNZSJDBNBJWXMZ-UHFFFAOYSA-N 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 150000004292 cyclic ethers Chemical class 0.000 description 2
- UVJHQYIOXKWHFD-UHFFFAOYSA-N cyclohexa-1,4-diene Chemical compound C1C=CCC=C1 UVJHQYIOXKWHFD-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 150000001989 diazonium salts Chemical class 0.000 description 2
- PCERBVBQNKZCFS-UHFFFAOYSA-N dibenzylcarbamodithioic acid Chemical compound C=1C=CC=CC=1CN(C(=S)S)CC1=CC=CC=C1 PCERBVBQNKZCFS-UHFFFAOYSA-N 0.000 description 2
- 125000004989 dicarbonyl group Chemical group 0.000 description 2
- 125000005594 diketone group Chemical group 0.000 description 2
- JGUQDUKBUKFFRO-CIIODKQPSA-N dimethylglyoxime Chemical compound O/N=C(/C)\C(\C)=N\O JGUQDUKBUKFFRO-CIIODKQPSA-N 0.000 description 2
- 239000012990 dithiocarbamate Substances 0.000 description 2
- 150000004659 dithiocarbamates Chemical class 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 description 2
- 125000001905 inorganic group Chemical group 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000004310 lactic acid Substances 0.000 description 2
- 235000014655 lactic acid Nutrition 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- CKFGINPQOCXMAZ-UHFFFAOYSA-N methanediol Chemical compound OCO CKFGINPQOCXMAZ-UHFFFAOYSA-N 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- 125000003357 methylseleno group Chemical group [H]C([H])([H])[Se][*] 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 2
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 2
- 125000006678 phenoxycarbonyl group Chemical group 0.000 description 2
- RCIBIGQXGCBBCT-UHFFFAOYSA-N phenyl isocyanide Chemical compound [C-]#[N+]C1=CC=CC=C1 RCIBIGQXGCBBCT-UHFFFAOYSA-N 0.000 description 2
- 239000011941 photocatalyst Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- MWWATHDPGQKSAR-UHFFFAOYSA-N propyne Chemical group CC#C MWWATHDPGQKSAR-UHFFFAOYSA-N 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- PIILXFBHQILWPS-UHFFFAOYSA-N tributyltin Chemical compound CCCC[Sn](CCCC)CCCC PIILXFBHQILWPS-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- YWWDBCBWQNCYNR-UHFFFAOYSA-N trimethylphosphine Chemical compound CP(C)C YWWDBCBWQNCYNR-UHFFFAOYSA-N 0.000 description 2
- HVYVMSPIJIWUNA-UHFFFAOYSA-N triphenylstibine Chemical compound C1=CC=CC=C1[Sb](C=1C=CC=CC=1)C1=CC=CC=C1 HVYVMSPIJIWUNA-UHFFFAOYSA-N 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- WMKLZBNHZFHSNP-UHFFFAOYSA-N $l^{1}-phosphanylphosphane Chemical compound P[P] WMKLZBNHZFHSNP-UHFFFAOYSA-N 0.000 description 1
- ZFVHFEXIVQSRNV-QMDOQEJBSA-N (1z,5z)-cycloocta-1,5-diene;iridium;tetrafluoroborate Chemical compound [Ir].F[B-](F)(F)F.C\1C\C=C/CC\C=C/1.C\1C\C=C/CC\C=C/1 ZFVHFEXIVQSRNV-QMDOQEJBSA-N 0.000 description 1
- LGPAKRMZNPYPMG-UHFFFAOYSA-N (3-hydroxy-2-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C=CC(=O)OC(CO)COC(=O)C=C LGPAKRMZNPYPMG-UHFFFAOYSA-N 0.000 description 1
- OAKFFVBGTSPYEG-UHFFFAOYSA-N (4-prop-2-enoyloxycyclohexyl) prop-2-enoate Chemical compound C=CC(=O)OC1CCC(OC(=O)C=C)CC1 OAKFFVBGTSPYEG-UHFFFAOYSA-N 0.000 description 1
- JJZONEUCDUQVGR-WXUKJITCSA-N (NE)-N-[(2E)-2-hydroxyimino-1,2-diphenylethylidene]hydroxylamine Chemical compound c1ccccc1\C(=N/O)\C(=N\O)\c1ccccc1 JJZONEUCDUQVGR-WXUKJITCSA-N 0.000 description 1
- XTUXVDJHGIEBAA-BQYQJAHWSA-N (e)-3,4-dimethylhex-3-ene Chemical compound CC\C(C)=C(/C)CC XTUXVDJHGIEBAA-BQYQJAHWSA-N 0.000 description 1
- XGCDBGRZEKYHNV-UHFFFAOYSA-N 1,1-bis(diphenylphosphino)methane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)C1=CC=CC=C1 XGCDBGRZEKYHNV-UHFFFAOYSA-N 0.000 description 1
- ZWVMLYRJXORSEP-UHFFFAOYSA-N 1,2,6-Hexanetriol Chemical compound OCCCCC(O)CO ZWVMLYRJXORSEP-UHFFFAOYSA-N 0.000 description 1
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- XJKSTNDFUHDPQJ-UHFFFAOYSA-N 1,4-diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=C(C=2C=CC=CC=2)C=C1 XJKSTNDFUHDPQJ-UHFFFAOYSA-N 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 1
- QKKSKKMOIOGASY-UHFFFAOYSA-N 2,3-dibromobut-1-ene-1,1-diol Chemical compound CC(Br)C(Br)=C(O)O QKKSKKMOIOGASY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- QEPJZNUAPYIHOI-UHFFFAOYSA-N 2-(2-methylprop-2-enoylamino)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)NCCOC(=O)C(C)=C QEPJZNUAPYIHOI-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- PZEXNMSXAVGEAP-UHFFFAOYSA-N 2-diphenylarsanylethyl(diphenyl)arsane Chemical compound C=1C=CC=CC=1[As](C=1C=CC=CC=1)CC[As](C=1C=CC=CC=1)C1=CC=CC=C1 PZEXNMSXAVGEAP-UHFFFAOYSA-N 0.000 description 1
- NEAQRZUHTPSBBM-UHFFFAOYSA-N 2-hydroxy-3,3-dimethyl-7-nitro-4h-isoquinolin-1-one Chemical compound C1=C([N+]([O-])=O)C=C2C(=O)N(O)C(C)(C)CC2=C1 NEAQRZUHTPSBBM-UHFFFAOYSA-N 0.000 description 1
- TURITJIWSQEMDB-UHFFFAOYSA-N 2-methyl-n-[(2-methylprop-2-enoylamino)methyl]prop-2-enamide Chemical compound CC(=C)C(=O)NCNC(=O)C(C)=C TURITJIWSQEMDB-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- CXURGFRDGROIKG-UHFFFAOYSA-N 3,3-bis(chloromethyl)oxetane Chemical group ClCC1(CCl)COC1 CXURGFRDGROIKG-UHFFFAOYSA-N 0.000 description 1
- HTWRFCRQSLVESJ-UHFFFAOYSA-N 3-(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCOC(=O)C(C)=C HTWRFCRQSLVESJ-UHFFFAOYSA-N 0.000 description 1
- GFLJTEHFZZNCTR-UHFFFAOYSA-N 3-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OCCCOC(=O)C=C GFLJTEHFZZNCTR-UHFFFAOYSA-N 0.000 description 1
- RJWBTWIBUIGANW-UHFFFAOYSA-N 4-chlorobenzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=C(Cl)C=C1 RJWBTWIBUIGANW-UHFFFAOYSA-N 0.000 description 1
- CEZWFBJCEWZGHX-UHFFFAOYSA-N 4-isocyanato-n-(oxomethylidene)benzenesulfonamide Chemical class O=C=NC1=CC=C(S(=O)(=O)N=C=O)C=C1 CEZWFBJCEWZGHX-UHFFFAOYSA-N 0.000 description 1
- BXZMYXFIMCKTTQ-UHFFFAOYSA-N 4-methylbenzene-1,2,3,5-tetrol Chemical compound CC1=C(O)C=C(O)C(O)=C1O BXZMYXFIMCKTTQ-UHFFFAOYSA-N 0.000 description 1
- GLJFYGFBITUZOE-UHFFFAOYSA-N 4-phenylbutylbenzene Chemical compound C=1C=CC=CC=1CCCCC1=CC=CC=C1 GLJFYGFBITUZOE-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- BSFODEXXVBBYOC-UHFFFAOYSA-N 8-[4-(dimethylamino)butan-2-ylamino]quinolin-6-ol Chemical compound C1=CN=C2C(NC(CCN(C)C)C)=CC(O)=CC2=C1 BSFODEXXVBBYOC-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- 101150041968 CDC13 gene Proteins 0.000 description 1
- SMZFBEVRXRDDGE-UHFFFAOYSA-N CN(C)C1=C(C=CC=C1)[Sb](C1=CC=CC=C1)P(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound CN(C)C1=C(C=CC=C1)[Sb](C1=CC=CC=C1)P(C1=CC=CC=C1)C1=CC=CC=C1 SMZFBEVRXRDDGE-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- GXBYFVGCMPJVJX-UHFFFAOYSA-N Epoxybutene Chemical compound C=CC1CO1 GXBYFVGCMPJVJX-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 101100396546 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) tif-6 gene Proteins 0.000 description 1
- YWMAPNNZOCSAPF-UHFFFAOYSA-N Nickel(1+) Chemical compound [Ni+] YWMAPNNZOCSAPF-UHFFFAOYSA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 241000940835 Pales Species 0.000 description 1
- 206010033546 Pallor Diseases 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 1
- 101100409194 Rattus norvegicus Ppargc1b gene Proteins 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- GNZKCLSXDUXHNG-UHFFFAOYSA-N Vanadium cation Chemical compound [V+] GNZKCLSXDUXHNG-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- CWRYPZZKDGJXCA-UHFFFAOYSA-N acenaphthene Chemical compound C1=CC(CC2)=C3C2=CC=CC3=C1 CWRYPZZKDGJXCA-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- VQKFNUFAXTZWDK-UHFFFAOYSA-N alpha-methylfuran Natural products CC1=CC=CO1 VQKFNUFAXTZWDK-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000003899 bactericide agent Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical class N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- PIPBVABVQJZSAB-UHFFFAOYSA-N bis(ethenyl) benzene-1,2-dicarboxylate Chemical compound C=COC(=O)C1=CC=CC=C1C(=O)OC=C PIPBVABVQJZSAB-UHFFFAOYSA-N 0.000 description 1
- AJCHRUXIDGEWDK-UHFFFAOYSA-N bis(ethenyl) butanedioate Chemical compound C=COC(=O)CCC(=O)OC=C AJCHRUXIDGEWDK-UHFFFAOYSA-N 0.000 description 1
- JZQAAQZDDMEFGZ-UHFFFAOYSA-N bis(ethenyl) hexanedioate Chemical compound C=COC(=O)CCCCC(=O)OC=C JZQAAQZDDMEFGZ-UHFFFAOYSA-N 0.000 description 1
- AXYSDZQJEIAXBL-UHFFFAOYSA-N bis(oxomethylidene)iron Chemical compound O=C=[Fe]=C=O AXYSDZQJEIAXBL-UHFFFAOYSA-N 0.000 description 1
- OMVFGTABSHECNI-UHFFFAOYSA-N bis(oxomethylidene)manganese Chemical compound O=C=[Mn]=C=O OMVFGTABSHECNI-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- LMMDJMWIHPEQSJ-UHFFFAOYSA-N bis[(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)methyl] hexanedioate Chemical compound C1C2OC2CC(C)C1COC(=O)CCCCC(=O)OCC1CC2OC2CC1C LMMDJMWIHPEQSJ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010504 bond cleavage reaction Methods 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- YMQUHROOFPZMRB-UHFFFAOYSA-N butane-1,2,4-triol;2,3-dimethylbut-2-enoic acid Chemical compound OCCC(O)CO.CC(C)=C(C)C(O)=O YMQUHROOFPZMRB-UHFFFAOYSA-N 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- LGFPDDKHVBSPBT-UHFFFAOYSA-N butyl(methylidyne)azanium Chemical compound CCCC[N+]#C LGFPDDKHVBSPBT-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- DXHPZXWIPWDXHJ-UHFFFAOYSA-N carbon monosulfide Chemical compound [S+]#[C-] DXHPZXWIPWDXHJ-UHFFFAOYSA-N 0.000 description 1
- HAUXSVQKDKQHTF-UHFFFAOYSA-N carbon monoxide;chromium Chemical compound [Cr].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-] HAUXSVQKDKQHTF-UHFFFAOYSA-N 0.000 description 1
- FSXLZCNUCYUGCH-UHFFFAOYSA-N carbon monoxide;rhenium Chemical compound [Re].[O+]#[C-].[O+]#[C-].[O+]#[C-] FSXLZCNUCYUGCH-UHFFFAOYSA-N 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- KSDIHKMNSYWRFB-UHFFFAOYSA-N chrysen-2-amine Chemical compound C1=CC=CC2=CC=C3C4=CC=C(N)C=C4C=CC3=C21 KSDIHKMNSYWRFB-UHFFFAOYSA-N 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000003426 co-catalyst Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 1
- VKONPUDBRVKQLM-UHFFFAOYSA-N cyclohexane-1,4-diol Chemical compound OC1CCC(O)CC1 VKONPUDBRVKQLM-UHFFFAOYSA-N 0.000 description 1
- BOXSCYUXSBYGRD-UHFFFAOYSA-N cyclopenta-1,3-diene;iron(3+) Chemical class [Fe+3].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 BOXSCYUXSBYGRD-UHFFFAOYSA-N 0.000 description 1
- PYRZPBDTPRQYKG-UHFFFAOYSA-N cyclopentene-1-carboxylic acid Chemical group OC(=O)C1=CCCC1 PYRZPBDTPRQYKG-UHFFFAOYSA-N 0.000 description 1
- 230000000368 destabilizing effect Effects 0.000 description 1
- 150000001470 diamides Chemical class 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- BQQUFAMSJAKLNB-UHFFFAOYSA-N dicyclopentadiene diepoxide Chemical compound C12C(C3OC33)CC3C2CC2C1O2 BQQUFAMSJAKLNB-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229940116901 diethyldithiocarbamate Drugs 0.000 description 1
- LMBWSYZSUOEYSN-UHFFFAOYSA-N diethyldithiocarbamic acid Chemical compound CCN(CC)C(S)=S LMBWSYZSUOEYSN-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- WQGPPBHFCXJZLP-UHFFFAOYSA-N diphenylstibane Chemical compound C=1C=CC=CC=1[SbH]C1=CC=CC=C1 WQGPPBHFCXJZLP-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 150000002083 enediols Chemical class 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- ZOOODBUHSVUZEM-UHFFFAOYSA-N ethoxymethanedithioic acid Chemical compound CCOC(S)=S ZOOODBUHSVUZEM-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 229940093476 ethylene glycol Drugs 0.000 description 1
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000004434 industrial solvent Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 125000003010 ionic group Chemical group 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000001457 metallic cations Chemical class 0.000 description 1
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical group [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- MVBJSQCJPSRKSW-UHFFFAOYSA-N n-[1,3-dihydroxy-2-(hydroxymethyl)propan-2-yl]prop-2-enamide Chemical compound OCC(CO)(CO)NC(=O)C=C MVBJSQCJPSRKSW-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 1
- IRUCBBFNLDIMIK-UHFFFAOYSA-N oct-4-ene Chemical compound CCCC=CCCC IRUCBBFNLDIMIK-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- HVFSJXUIRWUHRG-UHFFFAOYSA-N oic acid Natural products C1CC2C3CC=C4CC(OC5C(C(O)C(O)C(CO)O5)O)CC(O)C4(C)C3CCC2(C)C1C(C)C(O)CC(C)=C(C)C(=O)OC1OC(COC(C)=O)C(O)C(O)C1OC(C(C1O)O)OC(COC(C)=O)C1OC1OC(CO)C(O)C(O)C1O HVFSJXUIRWUHRG-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229950006098 orthocaine Drugs 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 229930184652 p-Terphenyl Natural products 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- 229920003251 poly(α-methylstyrene) Polymers 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 229920003226 polyurethane urea Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012429 reaction media Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- ORIHZIZPTZTNCU-YVMONPNESA-N salicylaldoxime Chemical compound O\N=C/C1=CC=CC=C1O ORIHZIZPTZTNCU-YVMONPNESA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 238000005464 sample preparation method Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052713 technetium Inorganic materials 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- XTTGYFREQJCEML-UHFFFAOYSA-N tributyl phosphite Chemical compound CCCCOP(OCCCC)OCCCC XTTGYFREQJCEML-UHFFFAOYSA-N 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- AEOGRWUNSVGMMJ-UHFFFAOYSA-N trimethylgermane Chemical compound C[GeH](C)C AEOGRWUNSVGMMJ-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- BPLUKJNHPBNVQL-UHFFFAOYSA-N triphenylarsine Chemical compound C1=CC=CC=C1[As](C=1C=CC=CC=1)C1=CC=CC=C1 BPLUKJNHPBNVQL-UHFFFAOYSA-N 0.000 description 1
- LOFJKBAHPJENQS-UHFFFAOYSA-N tris(oxomethylidene)chromium Chemical compound O=C=[Cr](=C=O)=C=O LOFJKBAHPJENQS-UHFFFAOYSA-N 0.000 description 1
- YKSLVGGUXOMSLN-UHFFFAOYSA-N tris(oxomethylidene)tungsten Chemical compound O=C=[W](=C=O)=C=O YKSLVGGUXOMSLN-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical group NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/63—Block or graft polymers obtained by polymerising compounds having carbon-to-carbon double bonds on to polymers
- C08G18/637—Block or graft polymers obtained by polymerising compounds having carbon-to-carbon double bonds on to polymers characterised by the in situ polymerisation of the compounds having carbon-to-carbon double bonds in a reaction mixture of saturated polymers and isocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/04—Polymeric products of isocyanates or isothiocyanates with vinyl compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Epoxy Resins (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
A polymerizable composition comprises a polymeric precursor comprising an admixture of at least one ethylenically-unsaturated monomer, in combination with at least one epoxy monomer or polyurethane precursors, and a curing agent consisting essentially of an organometallic salt, the complex cation of the salt containing at least one carbon atom bonded to a transition metal atom. The compositions can be used as, for example, protective coatings, binders for magnetic media or abrasives, adhesives, and in graphic arts applications.
Description
ENERGY CURABLE COMPOSITIONS . SINGLE
COMPONENT CURING AGENTS
Field of the Invention 'this invention relates to an energy-polymerizab:le composition comprising an ethylenically-unsaturated monomer optionally in combination with polyurethane precursors or an epoxy monomer, and as curing agent an or~~anometallic salt. In another aspect, a process for providing the polymerized composition of the invention is disclosed. In a further aspect, cured articles comprising the compositions of the invention are disclosed.
The compositions are useful, for example, as protective coatings, binders for magnetic media or abrasives, adhesives, and in graphic arts applications.
Background Of The Invention ~Jarious polymeric coatings and articles are produced in processes involving the use of organic solvents. 'there is an intense effort by law makers, researchers, and industry to promote high and 100% solids formulation; to reduce or eliminate the use of such solvents and the attendent costs and environmental contamination. These processes require a latent catalyst or latent reaction promoter which can be activated in a controlled :fashion.
'thermal curing of polyurethane precursors using reaction promotors such as tin salts and tertiary amines is known in the art. Curing of polymerizable mixtures of polyisocyanates with polyols (referred to as polyurethane precursors) using thermally latent catalysts is known in the art (see for example U. S. Patent Nos. 4,521,545, and 4,582,861).
7?hotocuring of urethane (meth)acrylates is well known (see 'r. A. Speckhard, K.K.S. Hwang, S.B. Lin, S.Y.
Tsay, M. Ko;shiba, Y.S. Ding, S.L. Cooper J. Appl. Polymer 134~~1 ~~
-2_ Science, 19!35, _30, 647-666. C. Bluestein Polym.-Plast.
Technol. Enc~. 1981, 17 83-93). Photocuring of polyurethane precursors using diazonium salts, tertiary amine precursors, and organotin compounds is also known (see U.S.
Patent Nos. 4,544,466, 4,549,945, and EP 28,696, Derwent abstract). All of these methods suffer from one or more of the following disadvantages: sensitivity to oxygen, requirement of ultraviolet and/or high intensity light, the need for modified resins, loss or dilution of urethane properties, low activity, poor solubility, and poor potlife.
~Che prior art discloses processes for the polymerizat:LOn of epoxy materials. It is further known that a meta:Llocene, such as ferrocene, can be used as a curing acce:Lerator for epoxy materials (U.S. Patent No.
3,705,129). U.S. Patent Nos. 3,709,861, 3,714,006, 3,867,354 and 4,237,242 relate to the use of transition metal complexes in the reaction between polyepoxides and polyfunctional curing additives, but they do not teach the polymerization of epoxide group-containing compositions not containing ~~ curing additive. The polymerization of epoxide group-containing materials is also known. Among such processes are those in which the polymerization catalyst is a radiation-sensitive onium salt of a Lewis acid (e. g. diazonium salts as is described in U.S. Patent No. 3,794,5'76 and U.S. Patent No. 4,080,274; halonium salts as is disclosed in U.S. Patent No. 4,026,705; and the onium salts of Group VLA elements, particularly the sulfonium salts, as a:re disclosed in U.S. Patent No. 4,058,400), or a dicarbonyl chelate compound of a Group IIIA-VA element as is disclosed in U.S. Patent No. 4,086,091. These compositions are limited to ultraviolet radiation for polymerizat:LOn. Furthermore, the dicarbonyl chelates are moisture sensitive.
11.5. Patent No. 4,216,288 teaches the thermal curing of c<~tionally polymerizable compositions using onium salts and reducing agents.
Energy ~polymerizable compositions comprising ionic salts of organomertallic complex cations and cationically sensitive materials and the curing thereof has been taught (see U.S. Patent 4,868,288, Canadian Patent 1,300,307 and Canadian Patent Application Serial No. 440,864).
Neutral organometallic compounds have been used in combination with neutral halogenated compounds for the photocuring of ethylenically-unsaturated monomers. (G. Smets, Pure G. Appl. Chem-,, 53~ 611,615 (1981); H.M. Wagner, M.D.
Purbrick, J. Photograph Science, 29. 230-235 (1981).
Radiation dual curable compositions containing ethylenically unst~turated monomers and epoxy monomers have been described in U.S. Patent Nos. 4,156,035, 4,227,978, and 4,623,676. These compositions include onium salts combined with organic compounds .as the curing agent, but do not contain any organometalli<: compounds .
The dual curing of acrylate/polyurethane precursor mixtures is known but tlhese curing methods are not entirely photoactivated nor are any methods known that provide for the simultaneous curing of 'the polyurethane precursors and acrylates (see U.S. Patent No. 4,342,793 and Roesler, Modern Paint and Coatincx:3, April, 1986, pages 46-55).
U.S. Pat;ent No. 4,677,137 teaches the use of one of a supported onium salt or an ionic salt of organometallic complex as an initiator of the polymerization of cationically polymerizable matEarials. The reference does not teach that an ionic salt of an organometallic complex can be used to cure ~.~~~'~58 - 3a -ethylenically-unsF~turated monomers alone or in combination with epoxy monomers or polyurethane precursors.
U.S. Pat;ent N~o. 4,740,577 and EPO 0250 364 teach the use of an ionic sF~lt of an organometallic complex combined with polyurethane precursors in an energy polymerizable composition. U.S,~ Patent No. 4,707,432 teaches a free radically polymer:Lzable composition comprising a free radically polymer~Lzable material and a 4 ~340'~ ~~
photoinitiator sy:~tem comprising an alpha-cleavage or homolytic bond cleavage phot:oinit:iator and a ferrocenium salt.
United ~>tates Patent 5,073,476 and Canadian Patent 1,293,835 disclose hardE:nable composition, contains a radical and/or cationicall.y polymerizable material, or their mixtures and at least one ferrous-aromatic complex compound and at least one electron-acceptor as oxidising agent.
GB 21917_99A, published December 9, 1987, teaches the combination of an onium salt with the ionic salt of an organometallic complex iFOr polymerization of compositions by irradiating at two diffe rent wavelengths. The reference does not teach the simultaneous :initiation of the polymerization of two different polymerizable materials nor do they demonstrate the enhanced thermal atabil:ity derived from this composition. These references do not teach the polymerization of ethylenically unsaturated monomE;rs alone or in combination with epoxy monomers or polyurethane precursors using only organometallic salts as curing agents.
Summary of the Invention Briefly, the present invention provides an energy polymerizable composition comprising at least one ethylenically-unsaturated monomer optionally in combination with at least one polyurethane precursor or at least one epoxy monomer, and as curing agent an organomc:tallic salt (ionic salt of an organometallic complex cation). The compositions are useful as protective and decorative coatings, inks, adhesives, in restorative and sealant applications, and in imaging applications.
..
~~4p'~ ~~
- 4a -According to one aspect of the present invention there is provided a polymerizable composition comprising a polymeric precursor comprising an admixture of (a) at least one monomer or oligomer polymerizable by free radicals selected from acr;ylates, methacrylates, acrylamides, methacrylamides, and vinyl compounds, and polyurethane precursors comprising an admixture of at least one di- or polyisocyanate anc~ at least one compound bearing at least two isocyanate-reactive hydrogen atoms, or (b) at least one monomer or oligomer polymerizable by free radicals selected from acrylates, methacrylates, acrylamides, methacrylamides, and vinyl compounds, and at least one epoxy-containing monomer, and a single-component curing agent capable of effecting simultaneous initiation of said admixture consisting essentially of an organometallic salt, wherein said organometallic salt has the formula:
[((L1)(L2)M)b(L3)(L4))+eXf wherein M represents the same or different metals selected from the elements of Periodic Groups IVB, VB, VIB, VIIB, and VIII, with the proviso that Formula I
can represent an organo:metallic salt having a mono- or bimetallic cation;; L1 represents none, 1, 2, or 3 ligands cont ribut ing pi-e:Lect cons that can be the same or different ligand selected from substituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic aromatic and heterocyclic aromatic compounds, each c<~pable of contributing two to twelve pi-electrons to the valence shell of M; L2 represents none or 1 to 6 ligands contributing an even number of sigma-electrons 13~~ ~~$
- 4b -that can be the same or different selected from mono-, di-, and tri-dentate ligands~, each contributing 2, 4, or 6 sigma-electrons to the valence shell of M; L3 represents none, 1 or 2 bridging ligands contributing pi-electrons that can be the same or different ligan;d selected from substituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic aromatic and heterocyclic ,aromatic compounds, each capable of acting as a bridging ligand contributing 4 to 24 pi-electrons to the valence shells of two metal atoms simultaneously; L4 represents none, 1, 2 or 3 bridging ligands contributing an even number of sigma-electrons that can be the same or different selected from mono-, di-, and tri-dentate ligands, each donating 2, ~4, or 6 sigma-electrons to the valence shells of two M's simultt~neously; with the proviso that the total electronic charge contributed to M by the ligands L1, L2, L3 and L4 plus the product of ionic charge on M with b results in a residual net po:aitive charge of a to the cat ion; b is an integer having a value ~of 1 or 2; a is an integer having a value of 1 or 2, i:he residual electrical charge of the cation;
X is an anion selE~cted from organic sulfonate anions and halogen-containing complex anions of a metal of metalloid; f is an integer of J. or 2, the number of anions required to neutralize the chF~rge a on the cation; said composition being free of an oxidizj.ng agent .
According to a further aspect of the present invention there i~~ provided an abrasive article or a binder for a magnetic medium comprising a composition as defined above.
- 4c -When two polymerizable components are present they can be present in any proportion, preferably in the range of 0.1:99.9 to 99.9 :0.1 parts by weight, more preferably 1:99 to 99:1 parts by weight, and most preferably 2:98 to 98:2 parts by weight.
13~~'~ ~8 lahat is not taught in the prior art, but what is taught in this invention, is the use of organometallic salts for the photo- or accelerated particle-induced (e. g.
electron be~~m-induced) or thermal curing of ethylenically-unsaturated monomers alone or in combination with polyurethane precursors or epoxy monomers. When two different polymerizable materials are present, the instant invention composition and method relies on the simultaneous initiation of the polymerization of both materials. Only one irradiation step is utilized.
i~rdvantages of compositions of the present invention wizen utilized in 100% reactive coating composition: include:
inn industrial process innovation is disclosed that wall reduce, minimize, or eliminate the genera~;.ion of industrial solvent waste while reducing energy consumption.
radiation processing, particularly utilizing electron beam and photogenerated catalysts, has potential capability for penetrating and polymerizing thick <~nd pigmented coatings.
l~iore readily available monomers can be used in place of functionalized oligomers (used in the prior art) thereby resulting in lower viscosity monomer solutions which are easier to coat than more viscous oligomcsr solutions.
l;xpanding the scope of curable monomers to includes polyisocyanates/polyols and epoxides allows increa:aed flexibility in designing coatings with specific properties.
~~he photoinitiators provide increased thermal stability in combination with increased rate of cure.
7fn this application:
"energy-induced curing" means curing by means of at least onE~ of electromagnetic radiation (ultraviolet and visible) accelerated particles (including electron beam), and thermal (infrared and heat) means;
~~~~'~
"ethylenically-unsaturated monomer" means those monomers th~~t polymerize by a free-radical mechanism;
"catalytically-effective amount" means a quantity su:Eficient to effect polymerization of the curable composition to a polymerized product at least to a degree to cause an increase in the viscosity of the composition;
"organometallic salt" means one or more ionic salts of or~3anometallic complex cations wherein the cations contain at :Least one carbon atom of an organic group bonded to a metal ~~tom ("Basic Inorganic Chemistry", F.A. Cotton, G. Wilkinson, Wiley, New York, 1976, p. 497);
"polyurethane precursors" means a mixture of one or more monomers of the type including diisocyanates and polyisocyanates, and one or more monomers of the type including d:iols and polyols. Compounds bearing at least two isocyan~~te-reactive hydrogen atoms may be substituted for diols a~zd polyols; the ratio of isocyanate groups to isocyanate-reactive hydrogen atoms is 1:2 to 2:1;
"bridging ligand" means a ligand that bonds to two or more metals in the presence or absence of metal-metal bonds;
"polyisocyanate" means an aliphatic or aromatic isocyanate having 2 or more isocyanate groups;
"polyol" means an aliphatic or aromatic compound containing 2 or more hydroxyl groups; and "bireactive monomer" means a monomer which contains an ethylenically unsaturated group and at least one of an epoxy, an isocyanate, and an isocyanate-reactive group.
- ~ - 13~~'~~~
Detailed Disclosure of the Invention The present invention provides a photo and/or thermally polymerirable composition comprising at least one ethylenically-unsaturated monomer optionally in combination with at least one of po7_yuretlzane precursors or at least one epoxy monomer, and a curing agent, therefore, the curing agent preferably comprising an organometallic salt having the structure f ( (L1) (L2)M)b(L3) (L'~) l+e Xf I
wherein M represents a metal atom selected from the elements of Periodic Groups IVB, VB, VIB, VIIB, and VIIIB; with the proviso that formula I represents an organometallic salt having a mono- or bimetall.ic cat~ion;
L1 repre~~ents clone, 1, 2, or 3 ligands contributing pi-electrons that c:an be the same or different ligand selected from substituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic: aromatic and heterocyclic aromatic compounds, each ca~~able of contributing two to twelve pi-electrons to the valence shell of M;
L2 represents none, or 1 to 6 ligands contributing an even number of sigma-elects cons that can be the same or different selected from mono-, di-, and tri-dentate ligands, each donating 2, 4, or 6 sigma-electrons to the valence shell of M;
L3 represents none, 1 or 2 bridging ligands contributing pi-electron:> that can be the same or different ligand selected from sub:>tituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic: aromatic and heterocyclic aromatic compounds, each capable of acting as a bridging ligand _.
13~U~1~~
- 7a -contributing 4 to ~?4 pi-~alectrons to the valence shells of two metal atoms M, simultaneously;
L4 repre:~ents none, 1, 2, or 3 bridging ligands contributing an even number of sigma-electrons that can be _. -8- .,~.~.~f~ J
the same or different selected from mono-, di-, and tri-dentate ligands, each donating 2, 4 or 6 sigma-electrons to the valence shells of two metal atoms M, simultaneously; with the proviso that the total electronic charge contributed to M by the ligands L1, L~, L3, and L4 plus the product of the ionic charge on M with b results in a residual positive charge of a to the cation;
b is an integer having a value of 1 or 2;
a is an integer having a value of 1 or 2, the residual electrical charge of the cation;
X is an anion selected from organic sulfonate anions and :halogen-containing complex anions of a metal or metalloid;
f is an integer of 1 or 2, the number of anions required to neutralize the positive charge a on the cation.
I:n a preferred composition of the invention, the salts of the organometallic complex cation have the formula:
I (L5 ) (L6 )M~+. Xf II
wherein M represents a metal atom selected from elements of the Peri~~d Groups IVB, VB, VIB, VIIB, and VIIIB;
L'' represents none, one or two ligands that can be the same or different, contributing pi-electrons selected from the same groups of ligands from which ligand L1 of formu:La I is selected;
L'' represents none or 1 to 6 ligands that can be the same or different, contributing an even number of sigma-electrons selected from the same group of ligands from which :Ligand L~ of formula I is selected;
with the proviso that the total electronic charge contributed to M by LS and L6 plus the ionic charge on M
results in ~~ residual net posrive charge of a to the complex; and e, f, and X have the same definition as given in formula :C .
1340't~8 Salts of organometallic complex cations having formulae I and II are radiation sensitive in addition to being thermally sensitive or they can be cured in a two stage curing process using radiation followed by heat.
Ligands L1 to L6 are well known in the art of transition metal organometallic compounds.
Ligand L1 of general formula I and ligand LS of general formula II are provided by any monomeric or polymeric c~~mpound having an accessible unsaturated group, i.e., an etlhylenic, -~'~- group; acetylenic, -C=C- group;
or aromatic group which have accessible pi-electrons regardless of the total molecular weight of the compound.
By "accessible", it is meant that the compound (or precursor compound from which the accessible compound is prepared) bearing the unsaturated group is soluble in a reaction medium, such as an alcohol, e.g., methanol; a ketone, e.g., methyl ethyl ketone; an ester, e.g., amyl acetate; a halocarbon, e.g., trichloroethylene; an alkane, e.g., decal:in; an aromatic hydrocarbon, e.g., anisole; an ether, e.g., tetrahydrofuran; etc, or that the compound is divisible into very fine particles of high surface area so that the unsaturated group (including aromatic group) is sufficientl~,r close to a metal atom to form a pi-bond between than unsaturated group and the metal atom. By polymeric compound, is meant, as explained below, that the ligand can he a group on a polymeric chain.
Illustrative of ligands L1 and LS are the linear and cyclic olefinic and acetylenic compounds having less than 100 ca~:bon atoms, preferably having less than 60 carbon atoms, and from zero to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, arsenic, phosphorus, selenium, boron, antimony, tellurium, silicon, germanium, and tin, such as, for example, ethylene, acetylene, propylene, methylacetylene, 1-butene, 2-butene, diacetylene,, butadiene, 1,2-dimethylacetylene, cyclobutene, pentene, cyc:lopentene, hexene, cyclohexene, 1,3-cyclohexadiene, cyclopentadiene, 1,4-cyclohexadiene, cycloheptenea, 1-octene, 4-octene, 3,4-dimethyl-3-hexene, and 1-decen~e; eta3-allyl, eta3-pentenyl, norbornadiene, eta5-cycloh~exadienyl, etas-cycloheptatriene, eta8-cyclooctatetraene, and substituted and unsubstituted carbocyclic and heterocyclic aromatic ligands having up to 25 rings and up to 100 carbon atoms and up to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, boron, antimony, tellurium, silicon, germanium, and tin, such as, for example, etas-cyclopentadienyl, eta6-benzene, eta6-mesitylene, eta6-hexamethylbenzene, eta6-fluorene, eta6-naphthalene, eta6-anthracene, eta6-chrysene, eta6-pyrene, eta'-cycloheptatrienyl, etas-triphenylmethane, etalz-paracycloph~~ne, etal2-1,4-diphenylbutane, eta5-pyrrole, eta5-thiophene, eta5-furan, eta6-pyridine, etas-gamma-picoline, eta6-quinaldine, eta6-benzopyran, eta6-thioch:rome, eta6-benzoxazine, eta6-indole, eta6-acridine, eta6-carbazole, eta6-triphenylene, eta6-silabenzene, eta6-arsabenzene, eta6-stibabenzene, eta6-2,4,6-itriphenylphosphabenzene, eta5-selenophene, eta6-dibenzostannepine, eta5-tellurophene, eta6-phenothiarsine, eta6-selenanthrene, eta6-phenoxaphosphine, etas-phenar:~azine, eta6-phenatellurazine, and eta6-1-phen~,~lborabenzene. Other suitable aromatic compounds can be found by consulting any of many chemical handbooks.
As mentioned before, the ligand can be a unit of a polymer, ~Eor example, the phenyl group in polystyrene, poly(styrenE~-co-butadiene), polystyrene-co-methyl methacrylate), poly(alpha-methylstyrene), polyvinylcarbazole, and polymethylphenylsiloxane; the cyclopentadlene group in poly(vinylcyclopentadiene); the pyridine group in poly(vinylpyridine), etc. Polymers having a weight average molecular weight up to 1,000,000 or more can be used. It is preferable that 5 to 50 percent of the unsaturated or aromatic groups present in the polymer be complexed with metallic cations.
E~~ch of the ligands L1 and LS can be substituted by groups that do not interfere with the complexing of the ...... -11 _ ligand with the metal atom or which do not reduce the solubility of the ligand to the extent that complexing with the metal atom does not take place. Examples of substituting groups, all of which preferably have less than 30 carbon atoms and up to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, antimony, tellurium, silicon, germanium, tin, and boron, include hydrocarbyl groups such as methyl, ethyl, butyl, dodecyl, tetracosanyl, phenyl, benzyl, allyl, benzylidene, ethenyl, and ethynyl; hydrocarbyloxy groups such as metlhoxy, butoxy, and phenoxy; hydrocarbylmercapto groups such as methylmercapto (thiomethoxy), phenylmercapto (thiophenox:~); hydrocarbyloxycarbonyl such as methoxycarbonyl and phenoxycarbonyl; hydrocarbylcarbonyl such as formyl, acetyl, and benzoyl; hydrocarbylcarbonyloxy such as acetoxy, benzoxy, and cyclohexanecarbonyloxy;
hydrocarbylcarbonamido, e.g., acetamido, benzamido; azo, boryl; halo, e.g., chloro, iodo, bromo, and fluoro;
hydroxy; cy~~no; vitro; nitroso, oxo; dimethylamino;
diphenylpho;sphino, diphenylarsino; diphenylstibine;
trimethylge:rmane; tributyltin; methylseleno; ethyltelluro;
and trimeth;Tlsiloxy; condensed rings such as benzo, cyclopenta; naphtho, indeno; and the like.
L:igands LZ in formula I, and L6 in formula II are provided by monodentate and polydentate compounds preferably containing up to about 30 carbon atoms and up to 10 hetero ai:.oms selected from nitrogen, sulfur, non-peroxidic o:~ygen, phosphorus, arsenic, selenium, antimony, and tellurium, upon addition to the metal atom, following loss of zero, one, or two hydrogens, the polydentate compounds p~:eferably forming with the metal, M, a 4-, 5-, or 6-memberc~d saturated or unsaturated ring. Examples of suitable monodentate compounds or groups are carbon monoxide, c<~rbon sulfide, carbon selenide, carbon telluride, alcohols such as ethanol, butanol, and phenol;
nitrosonium (i.e., NO+); compounds of Group VA elements such as ammonia, phosphine, trimethylamine, trimethylphosphine, triphenylamine, triphenylphosphine, triphenylaraine, triphenylstibine, tributylphosphite, isonitriles such as phenylisonitrile, butylisonitrile;
carbene groups such as ethoxymethylcarbene, dithiometho:Kycarbene; alkylidenes such as methylidene, ethylidene; suitable polydentate compounds or groups include 1,2~-bis(diphenylphosphino)ethane, 1,2-bis(dipheny:larsino)ethane, bis(diphenylphosphino)methane, ethylenediamine, propylenediamine, diethylenetriamine, 1,3-diisocyanop:ropane, and hydridotripyrrazolyborate; the hydroxycarboxylic acids such as glycolic acid, lactic acid, salicylic acid; polyhydric phenols such as catechol and 2,2'-dihydroxybiphenyl; hydroxyamines such as ethanolamine, propanolamine, and 2-aminophenol; dithiocarbamates such as diethyldith:iocarbamate, dibenzyldithiocarbamate; xanthates such as ethyl xanthate, phenyl xanthate; the dithiolenes such as bis(perfluoromethyl)-1,2-dithiolene;
aminocarboxylic acids such as alanine, glycine and o-aminobenzoic acid; dicarboxylic diamines as oxalamide, biuret; diketones such as 2,4-pentanedione; hydroxyketones such as 2-hydroxyacetophenone; alpha-hydroxyoximes such as salicylaldo:~cime; ketoximes such as benzil oxime; and glyoximes such as dimethylglyoxime. Other suitable groups are the inorganic groups such as, for example, CN-, SCN-, F- , OH- , C1-- , Br- , I- , and H- and the organic groups such as, for example, acetoxy, formyloxy, benzoyloxy, etc. As mentioned before, the ligand can be a unit of a polymer, for example the amino group in poly(ethyleneamine); the phosphino group in poly(4-vinylphenyldiphenylphosphine);
the carboxy:Lic acid group in poly(acrylic acid); and the isonitrile ~~roup in poly(4-vinylphenylisonitrile).
L:igand L3 in Formula I is provided by any monomeric or polymeric compound having an accessible I
unsaturated group, such as any ethylenic -C-C- group or an acetylenic --C=C- group or an aromatic group which have accessible pi-electrons regardless of the total molecular we i ght of tile compound .
I:Llustrative of ligand L3 are the linear and cyclic dien<a and acetylenic compounds preferably having less than 60 carbon atoms and up to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, boron, antimony, tellurium, silicon, germanium, and tin, such as for example, acetylene, methylacetylene, diacetylene, butadiene, 1,2-dimethylacetylene, 1,3- cyclohexadiene, cyclopentadiene, and 1,4-cyclohexadiene; eta3-allyl, eta3-penten;yl, norbornadiene, etas-cyclohexadienyl, eta6-cycloheptatriene, etae-cyclooctatetraene, and substituted and unsubstituted carbocyclic and heterocylic aromatic li~gands having up to 25 rings and up to 100 carbon atoms and u;p to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, boron, antimony, tellurium, silicon, germanium, and tin, such as, for example, eta5-cyclopentadienyl, eta6-benzene, etas-mesitylene, etas-hexamethylbenzene, eta6-fluorene, eta6-naphthalene, eta6-anthracene, eta6-chrysene, eta6-pyrene, eta'-cycloheptatrienyl, eta6-triphenylmethane, eta5-pyrrole, etas-thiophene, eta5-furan, eta6-pyridine, etas-gamma-picoline, eta6 -quinaldine, etas -benzopyran, eta6 -thiochrome, etas -benzoxazine, etas-indole, eta6-acridine, eta6-carbazole, etas(1,2,3,~4,4a,12a)-etas-(7,8,9,10,10a,lOb)chrysene, eta6-triphenylene, eta6,eta6~-paracyclophane, etas,eta6~-:1,4-diphenylbutane, etas-silabenzene, etas-arsabenzene, eta6-stibabenzene, eta6-2,4,6-triphenylphosphabenzene, eta5-selenophene, etas-dibenzostannepine, eta5-tellurophene, etas-phenothiarsine, eta6-selenanthrene, etas-phenoxaphosphine, eta6-phenarsazine, etab-phenatellurazine, and eta6-1-phenylborabenzene. Other suitable aromatic compounds can be found by consulting any of many chemical handbooks.
E~~ch of the ligands L3 can be substituted by groups that do not interfere with the complexing of the ligand with the metal atom or which do not reduce the - solubility of the ligand to the extent that complexing with the metal atom does not take place. Examples of substituting groups, all of which preferably have less than .-. -14-30 carbon atoms and zero to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, antimony, tellurium, silicon, germanium, tin, and boron, include hydrocarbyl groups such as methyl, ethyl, butyl, dodecyl, tetracosanyl, phenyl, benzyl, allyl, benzylidene, ethenyl, and ethynyl; hydrocarbyloxy groups such as methoxy, butoxy, and phenoxy; hydrocarbylmercapto groups such as methylmercapto (thiomethoxy), phenylmercapto (thiophenox:y); hydrocarbyloxycarbonyl such as methoxycarb~cnyl and phenoxycarbonyl; hydrocarbylcarbonyl such as formyl, acetyl, and benzoyl; hydrocarbylcarbonyloxy such as acetoxy, benzoxy, and cyclohexanecarbonyloxy;
hydrocarbylcarbonamido, e.g., acetamido, benzamido; azo;
boryl; halo, e.g., chloro, iodo, bromo, and fluoro, hydroxy; cy~ano; vitro; nitroso, oxo; dimethylamino, diphenylphosphino, diphenylstibine; trimethylgermane;
tributyltin; methylseleno; ethyltelluro; and trimethylsiloxy; condensed rings such as benzo, cyclopenta;
naphtho, indeno; and the like.
Ligand L4 is provided by monodentate and polydentate compounds preferably containing up to about 30 carbon atoms and zero to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, antimony, and tellurium. Examples of suitable mondentate compounds or groups are carbon monoxide, carbon sulfide, carbon selenide, carbon telluride, ,alcohols such as ethanol, butanol, and phenol;
nitrosonium (i.e., NO+); compounds of Group VA elements such as trilphenylamine, triphenylphosphine, triphenylarsine, triphenylstibine, isonitriles such as phenylisonitrile; suitable polydentate compounds or groups include 1,2~-bis(diphenylphosphino)-ethane, 1,2-bis(diphenylarsino)ethane, bis(dipheny;lphosphino)methane, ethylenediamine, propylenedi~amine, diethylenetriamine, .- 1,3-diisocyanopropane, and hydridotripyrazolylborate; the hydroxycarboxylic acids such as glycolic acid, lactic acid, salicyclic .acid; polyhydric phenols such as catechol and -15- 134~'~ ~~
2,2'-dihydr~oxybiphenyl; hydroxyamines such as ethanolamine, propanolami;ne, and 2-aminophenol; dithiocarbamates such as diethyldithiocarbamate, dibenzyldithiocarbamate; xanthates such as bis(perfluoromethyl)-1,2-dithiolene;
aminocarbox;ylic acids such as alanine, glycine and o-aminobenz~oic acid; dicarboxylic diamides such as oxalamide, :biuret; diketones such as 2,4-pentanedione;
hydroxyketo:nes such as 2-hydroxyacetophenone;
alpha-hydro:xyoximes such as salicylaldoxime; ketoximes such as benzil o:xime; and glyoximes such as dimethylglyoxime.
Other suitalble groups are the inorganic groups such as, for example, CN~, SCN , F , OH , C1 , Br , I , and H and the organic groups such as, for example, acetoxy, formyloxy, benzoyloxy, etc.
M can be any element from the Periodic Groups IVB, VB, VI1B, VIIB, and VIIIB, such as, for example, Ti, Zr, Hf, V, lVb, Ta, Cr, Mo, W, Mn, Tc, Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd and Pt. , Suitable anions, X, in formulas I and II, of use as the counterion in the ionic salts of the organometallic complex cation in the preferred radiation-sensitive compositions of the invention are those in which X has the formula DZ=, wherein D is a metal from Groups IB to VIIIB
or a metal or metalloid from Groups IIIA to VA of the periodic Chart of Elements, Z is a halogen atom or a hydroxy gro~sp, and r is an integer~having a value of 1 to 6. Preferably, the metals are copper, zinc, titanium, vanadium, chromium, manganese, iron, cobalt, or nickel and the metalloids preferably are boron, aluminum, antimony, tin, arsenic, and phosphorus. Preferably, the halogen, Z, of formula :II, is chlorine or fluorine. Illustrative of suitable anions are BF9 , PF6 , As F6 , SbF6 , FeCl9 , SnCls , SbF,~ , A1 F6 , GaCl9 , InF9 , TiF6 , ZrF6 , etc.
Preferably,. the anions are BF4-, PF6-, SbF6-, SbF50H-, AsF6 - , and SbCl6 - .
Additional suitable anions, X, in formulae I and II, of use ~~s the counterion in the ionic salts of the organometal:lic complex cations include those in which X is _. -16-an organic sulfonate. Illustrative of suitable sulfonate-containing anions are CH3 S03 , CF3 S03 , C6H5S03-, p-toluenesulfonate, p-chlorobenzenesulfonate and related isomers and the like.
There are restrictions on the sum of electrons donated by the ligands, L1 , L~ , L3 , and L' , of formula I
and L5 and G6 of formula II, and the valence electrons possessed b;y the metal. For most complex compounds not involving i;ntramolecular metal-metal bonding, this sum is governed by the "eighteen electron rule" [see ,1. Chem. Ed., 46, 811 (1969)]. This rule is sometimes called the "nine orbital rule", "the effective number rule", or the "rare gas rule". This rule states that the most stable organometallic compounds tend to be those compounds in which the sum of the electrons donated by the ligands and the metal is eighteen. Those skilled in the art, however, know that there are exceptions to this rule and that organometallic complex compounds having a sum of 16, 17, 19, and 20 electrons are also known. Some of these complexes are transient. Therefore, ionic salts of organometallic complex cations not including intramolecular metal-metal bonding, described by formulas I and II in which the c~omplexed metal has a sum of 16, 17, 18, 19, or 20 electrons in the valence shell and a residual net positive charge of 1 or 2, are included within the scope of the invention.
For complex compounds described in formula I in which intramolecular metal-metal bonding exists serious departure from the "eighteen electron rule" can occur. It has been proposed [J. Amer. Chem. Soc. 100, 5305 (1978)]
that the departure from the "eighteen electron rule" in these transition metal complexes is due to the metal-metal interactions destabilizing the metal p orbitals to an extent to cause them to be unavailable for ligand bonding.
Hence, rather than count electrons around each metal separately in a metal_cluster, cluster valence electrons (CVE) are counted. A binuclear complex, MM, is seen to have 34 CVEs. Therefore, ionic salts of binuclear 1344'~5~
organometallic complex cations are described by formula I
in which the complexed metal cluster, MM, has a sum of 34 CVEs in the valence shell and a residual net positive charge of 1 or 2 are included within the scope of this invention.
Suitable organometallic complex ionic salts described by formulae I or II of use in the compositions of the invention are those salts that upon application of sufficient energy, thermal, accelerated particle (electron beam), or electromagnetic radiation having a wavelength from about 200 to 800 nm, will generate an active species capable of catalyzing the polymerization of the compositions of the invention. The level of catalytic activity will, of course, depend on the choice of metal, ligands, and counterions in the salt.
Examples of suitable salts of organometallfc complex cations useful in the composition of the invention include the following (proposed structures of typical compounds are shown at the end of the list):
(eta5-cyclopentadienyl)tricarbonyliron(1+) hexafluorophosphate~a~
(etas-cyclopentadienyl)dicarbonylthiocarbonyliron(1+) tetrafluoroborate (etas-cyclopentadienyl)carbonylbis-(triphenylstibine)iron(1+) hexafluorophosphate (eta5-cyclo:pentadienyl)tricarbonylruthenium(1+) tetrachloroferrate (eta5-cyclo;pentadienyl)dicarbonyltriphenylstibineiron(1+) hexafluoroa:ntimonate (eta5- _methylcyclopentadienyl)dicarbonylnitrosyl-manganese(1~+) hexafluoroantimonate~b~
(etas-methylcyclopentadienyl)(eta3-allyl)dicarbonyl-manganese(1+) tetrafluoroborate~'~
(etas-cyclopentadienyl)tetracarbonylmolybdenum(1+) hexafluorophosphate (eta5-pentadienyl)tricarbonyliron(1+) tetrafluoroborate (eta5-cyclohexadienyl)tricarbonyliron(1+) hexafluoroarsenate~a~
(eta5-cyclohexadienyl)(ethylidene)carbonyltriphenyl-phosphineiron(1+) tetrafluoroborate (eta5-cyclopentadienyl)(ethoxymethylcarbene)carbonyl-triphenylphosphineiron(1+) tetrafluoroborate (eta5-cyclopentadienyl)(dithiomethoxycarbene)-dicarbonyliron(1+) hexafluorophosphate (eta5-cyclopentadienyl)dicarbonylmethylisonitrileiron(1+) hexafluoroarsenate (etas-toluene)tricarbonylmanganese(1+) hexafluoroantimonate~'~
(eta6-mesitylene)tricarbonylrhenium(1+) hexafluoroa:ntimonate (eta'-cyclo:heptatrienyl)tricarbonylchromium(1+) hexafluorop:hosphate (eta'-cyclo:heptatrienyl)tricarbonyltungsten(1+) hexafluoroarsenate~f~
(eta5-cyclolpentadienyl)(eta2-1-pentene)dicarbonyliron(1+) tetrafluoroborate "'. -19-(eta6-benzene)(eta5-cyclopentadienyl)iron(1+) hexafluorophosphate (eta6-mesitylene)(etas-cyclopentadienyl)iron(1+) tetrafluoroborate (eta6-naphthalene)(eta5-cyclopentadienyl)iron(1+) hexafluoroantimonate (eta6-acetophenone)(eta5-methylcyclopentadienyl)iron(1+) hexafluoroarsenate bis(etas-cyclopentadienyl)cobalt(1+) hexafluorophosphate bis(eta5-cyclopentadienyl)iron(1+) hexafluoroantimonate bis(eta5-chlorocyclopentadienyl)nickel(1+) hexafluorop:hosphate bis(eta6-be:nzene)chromium(1+) hexafluoroantimonate~9~
bis(eta6-he:xamethylbenzene)cobalt(2+) hexafluoroarsenate bis(etas-he:xamethylbenzene)nickel(2+) hexafluoroantimonate tetracarbon;Yltriphenylphosphinecobalt(1+) hexafluoroplhosphate tricarbonyllbis(triphenylphosphine)iridium(1+) hexafluorophosphate (eta3-allyl)pentacarbonylchromium(1+) tetrafluoroborate pentacarbon:~lnitrosylmolybdenum(1+) hexafluorophosphate (eta3-allyl)tetracarbonyliron(1+) hexafluoroantimonate hexacarbony:lrhenium(1+) hexafluoroantimonate -- -20- 134i~'~J8 bis(eta6-mesitylene)iron(2+) hexafluoroantimonate~h~
bis(eta6-hexamethylbenzene)manganese(1+) tetrafluoroborate bis(eta6-mesitylene)vanadium(1+) hexafluorophosphate (eta~-cycloheptatrienyl)(eta5-cyclopentadienyl)manganese-(1+) hexafluoroarsenate (etae-cyclooctatetraenyl)(eta5-cyclopentadienyl)chromium-(1+) hexafluorophosphate (eta6-fluorene)(eta5-cyclopentadienyl)iron(1+) hexafluorophosphate~l~
(eta6-1-phenylborabenzene)(eta5-cyclopentadienyl)cobalt(1+) hexafluorophosphate (eta5-cyclopentadienyl)(eta5-N-methylpyrrolyl)iron(1+) hexafluorophosphate (etas-2,3,4,5-tetrathiomethoxybenzene)(eta5-cyclopentadienyl)iron(1+) hexafluoroarsenate [(eta6-1,2,3,4,5,6)(eta6-7,8,9,10,11,12)biphenyl]-bis(eta5-cyclopentadienyl)diiron(2+) tetrafluoroborate [(etas-1,2,3,4,4a,9a)(eta6-5,6,7,8,8a,5a)fluorene]-bis(etas-cyclopentadienyl)diiron(2+) hexafluorophosphate [(eta6-1,2,3,4,4a,12a)(eta6-7,8,9,10,10a,6a)chrysene]-bis(eta6-benzene)dichromium(2+) hexafluoroantimonate dicarbonyl[Ibis(diphenylphosphino)ethane]bis(etas-cyclopentad.ienyl)diiron(1+) hexafluorophosphate [(eta6-4,5,!~a,28c,28b,3a)(eta6-8a,8b,20d,22a,22b,24c)-1H,14H-dipyrano(3,4,5-gh: 3',4',5'-g'h')anthra(2",1",9":
-21- 1~~~~~~
4,5,6;6",5",10":4',5',6')diisoquino(2,1-a:2',1'-al)-diperimidine]bis(eta5-cyclopentadienyl)diiron(2+) hexafluoroantimonate [(eta6-1,2,3,3a,13b,13a)benzo(10,11)chryseno(2,3-d)(1,3)-dioxole](eta5-methylcyclopentadienyl)iron(1+) hexafluorophosphate [(eta6-1,2,3,3a,16c,16b)-(eta6-9,10,11,11a,13c,8b)cycloocta(1,2,3,4-def:5,6,7,8-d'e'f')diphenanthrene]bis-(etas-acetylcyclopentadienyl)diiron(2+) tetrafluoroborate bis(etas-acetylcyclopentadienyl)iron(1+) tetrafluoroborate (eta3-1-methylallyl)tetracarbonyliron(+1) hexafluorophosphate (eta3-1,3-dimethylallyl)tetracarbonyliron(+1) hexachloroantimonate ~.~4fl~5~
(a) (b) ;e~\ PF6 /M \ SbFs _ lli I i ~~~ li%
s o 0 0 0 0 0 + ~+
l0 (c) ~ (d) /M BFI ~~e~ AsF6 _ C ~ 'C ~ ~
/// ~ -'~ ~ O// Ilol + ~ +
(e) (f) C~Mn~ C SbFs /C' As F6 _ /.
o// ~I ~o o//~ b + ~ 2+
(9) (h) Cr SbFs _ Fe 2 SbF6 _ V' V
(i) Fe ~ PF6 Organomet=allic salts are known in the art and can be prepared as disclo:~ed in, for example, EPO Nos. 109,851, 094,914, 094,915 and 126,712. In addition to the compounds of formulae I and II, all o:f the organometallic salts disclosed in these references are use:Eul in the present invention.
The curing agent can be present in an effective amount which is generally in the range of 0.01 to 20, preferably 0.1 to weight percent of the total composition.
The present invention also provides a process for the 10 polymerization of ~i composition comprising one of ethylenically-unsaturated monomers optionally in combination with polyurethane precursors or epox~~ monorners comprising the steps of:
(a) providing said at least one ethylenically unsaturated monomer optionally in combination with polyurethane precursors or epoxy monomers, (b) adding to said composition a catalytically effective amount of a curing agent comprising an organometallic: salt (and all permutations of the order of mixing the afc>rement=Toned components), thereby forming a polymerizable mixture, and (c) allowing the mixture to polymerize or adding energy to the mixture to affect polymerization.
In a further aspect, there is also a provided method for preparing coated articles containing the cured composition of the invention comprising the steps of:
(a) providing a substrate, (b) coating an energy polymerizable mixture as described above onto at least one surface of said substrate by methods known in the art, such as bar, knife, reverse roll, knurled roll, curtain, or spin coatings, or by dipping, spraying, brushing, and the like, with or without a coating solvent, and r. - 23a -(c) app_Lying ~=nergy (after evaporation of solvent if present) and =Lf des.ired to the article to cause the polymerization of the coating.
._ _24_ 13 4 0 ~l ~ 8 In a still further aspect, there are also provided shaped articles comprising the polymerizable mixture of the invention. The articles can be provided, for example, by techniques such as molding, injection molding, casting, and extrusion. Applying energy to the mixture causes polymerization and provides the cured shaped article.
It may be desirable to add solvent to solubilize components and aid in processing. Solvent, preferably organic solvent, in an amount up to 99 weight percent, but preferably in the range of 0 to 90 weight percent, most preferably .in the range of 0 to 75 weight percent, of the polymerizab:Le composition can be used.
~~ wide variety of monomers can be energy polymerized using the curing agent of the invention.
Suitable compounds containing at least one ethylenically-unsaturated double bond, can be monomers and/or oligomers such as (meth)acrylates, (meth)acrylamides, and vinyl compounds, ~~nd are capable of undergoing free radical polymerization. Such monomers include mono-, di-, or poly-acrylates and methacrylates such as methyl acrylate, methyl methacrylat~~, ethyl acrylate, isopropyl methacrylate, isooctyl acrylate, acrylic acid, n-hexyl acrylate, stearyl acrylate, a:Llyl acrylate, glycerol diacrylate, glycerol triacrylate,, ethyleneglycol diacrylate, diethyleneglycol diacrylate, triethyleneglycol dimethacrylate, 1,3-propanediol diacrylate, 1,3-propanediol dimethacrylate, trimethylolpropane triacrylate, 1,2,4-butanetriol trimethylacrylate, 1,4-cyclohexanediol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol t~etramethacrylate, sorbitol hexacrylate, bis[1-(2-acryloxy)]-p-ethoxyphenyl-dimethylmethane, bis[1-(3-acryloxy~-2-hydroxy)]-p-propoxyphenyl-dimethylmethane, Iris-hydroxyethyl-isocyanurate trimethacryJ.ate; the bis-acrylates and bis-methacrylates of polyethylene glycols of molecular weight 200-500, copolymerizable mixtures of acrylated monomers such as those of U.S. Patent No. 4,652,274, and acrylated oligomers -25- 1340'x;8 such as those of U.S. Patent No. 4,642,126; bireactive monomers such as epoxy (meth)acrylates, isocyanato (meth)acrylates, and hydroxy (meth)acrylates, preferred examples including hydroxyethyl (meth)acrylate, hydroxyprop;yl (meth)acrylate, isocyanatoethyl (meth)acryl~ate, glycidyl (meth)acrylate, and m-isopropen;yl-alpha, alpha-dimethylbenzyl isocyanate;
unsaturated amides such as acrylamide, methylene bis-acrylamide, methylene bis-methacrylamide, 1,6-hexametlhylene bis-acrylamide, diethylene triamine tris-acrylamide and beta-methacrylaminoethyl methacrylate;
and vinyl compounds such as styrene, divinylbenzene diallyl phthalate, divinyl succinate, divinyl adipate, divinyl phthalate, sand vinyl azlactones as disclosed in U.S. Patent No. 4,304,7~~5. Mixtures of two or more monomers can be used if desired. Bireactive monomers are particularly useful in crosslinking two different polymerizable species.
'rhe polyisocyanate component of the polyurethane precursors 'that can be cured or polymerized in the present invention m~~y be any aliphatic, cycloaliphatic, araliphatic, aromatic, or heterocyclic polyisocyanate, or any combination of such polyisocyanates. Particularly suitable po:lyisocyanates correspond to the formula Q(NCO)p III
in which p :is an integer 2 to 4, and Q represents an aliphatic h~~drocarbon di-, tri-, or tetra-radical containing :From 2 to 100 carbon atoms, and zero to 50 heteroatoms, a cycloaliphatic hydrocarbon radical containing :From 4 to 100 carbon atoms and zero to 50 heteroatoms, an aromatic hydrocarbon radical or heterocyclic: aromatic radical containing from 5 to 15 carbon atoms and zero to 10 heteroatoms, or an araliphatic hydrocarbon radical containing from 8 to 100 carbon atoms and zero to 50 heteroatoms. The hete.roatoms that can be present in S~ include non-peroxidic oxygen, sulfur, non-amino nitrogen, halogen, silicon, and non-phosphino phosphorus.
._ ~3~~~~58 Examples of po:lyisocyanates are as follows: ethylene diisocyanate, 1,4-t:etramethylene diisocyanate, 1,6-hexamethylene diisocyanate, trimethyl lzexamethylene diisocyanate, 1,12-dodecane diisocyanate, cyclobutane-1,3-diisocyanate, cyclohexane-1,3- and -1,4-diisocyanate and mixtures of these isomers, 1-isocyan~~to-3,:3,5-triemethyl-5-isocyanatomethyl cyclohexane (see German Auslegenschrift No. 1,202,785, U.S.
Patent No. 3,401,1~~0), 2,,4- and 2,6-hexahydrotolylene diisocyanate and mixtures of these isomers, hexahydro-1,3-and/or -1,4-phenylme di:isocyanate, perhydro-2,4'- and/or -4,4'-diphenylmethane dii_socyanate, 1,3- and 1,4-phenylene diisocyanate, 2,4- and 2,,6-tolylene diisocyanate and mixtures of these isomers, diphenylmethane-2,4'- and/or -4,4'-diisocyanate, naphthylene-1,5-dii.socyanate, and the reaction products of four equivalents of the aforernentioned isocyanate-containing compounds with compounds containing two isocyanate-reactive groups.
According to the present invention, it is also possible, for example, to use triphenyl methane-4,4',4"-triisocyanate, polyphenyl polymethylene polyisocyanates described in Briti~;h Patent Nos. 874,430 and 848,671, m- and p-isocyanatophenyl sulphonyl isocyanates according to U.S. Patent No. 3,454,606, perc:hlorinated aryl polyisocyanates of the type described, for example, in German Auslegenschrift No. 1,157,601 (U. S. Pat. No. 3,277,138), polyisocyanates containing carbodiimide groups. of the type described in U.S. Patent No.
COMPONENT CURING AGENTS
Field of the Invention 'this invention relates to an energy-polymerizab:le composition comprising an ethylenically-unsaturated monomer optionally in combination with polyurethane precursors or an epoxy monomer, and as curing agent an or~~anometallic salt. In another aspect, a process for providing the polymerized composition of the invention is disclosed. In a further aspect, cured articles comprising the compositions of the invention are disclosed.
The compositions are useful, for example, as protective coatings, binders for magnetic media or abrasives, adhesives, and in graphic arts applications.
Background Of The Invention ~Jarious polymeric coatings and articles are produced in processes involving the use of organic solvents. 'there is an intense effort by law makers, researchers, and industry to promote high and 100% solids formulation; to reduce or eliminate the use of such solvents and the attendent costs and environmental contamination. These processes require a latent catalyst or latent reaction promoter which can be activated in a controlled :fashion.
'thermal curing of polyurethane precursors using reaction promotors such as tin salts and tertiary amines is known in the art. Curing of polymerizable mixtures of polyisocyanates with polyols (referred to as polyurethane precursors) using thermally latent catalysts is known in the art (see for example U. S. Patent Nos. 4,521,545, and 4,582,861).
7?hotocuring of urethane (meth)acrylates is well known (see 'r. A. Speckhard, K.K.S. Hwang, S.B. Lin, S.Y.
Tsay, M. Ko;shiba, Y.S. Ding, S.L. Cooper J. Appl. Polymer 134~~1 ~~
-2_ Science, 19!35, _30, 647-666. C. Bluestein Polym.-Plast.
Technol. Enc~. 1981, 17 83-93). Photocuring of polyurethane precursors using diazonium salts, tertiary amine precursors, and organotin compounds is also known (see U.S.
Patent Nos. 4,544,466, 4,549,945, and EP 28,696, Derwent abstract). All of these methods suffer from one or more of the following disadvantages: sensitivity to oxygen, requirement of ultraviolet and/or high intensity light, the need for modified resins, loss or dilution of urethane properties, low activity, poor solubility, and poor potlife.
~Che prior art discloses processes for the polymerizat:LOn of epoxy materials. It is further known that a meta:Llocene, such as ferrocene, can be used as a curing acce:Lerator for epoxy materials (U.S. Patent No.
3,705,129). U.S. Patent Nos. 3,709,861, 3,714,006, 3,867,354 and 4,237,242 relate to the use of transition metal complexes in the reaction between polyepoxides and polyfunctional curing additives, but they do not teach the polymerization of epoxide group-containing compositions not containing ~~ curing additive. The polymerization of epoxide group-containing materials is also known. Among such processes are those in which the polymerization catalyst is a radiation-sensitive onium salt of a Lewis acid (e. g. diazonium salts as is described in U.S. Patent No. 3,794,5'76 and U.S. Patent No. 4,080,274; halonium salts as is disclosed in U.S. Patent No. 4,026,705; and the onium salts of Group VLA elements, particularly the sulfonium salts, as a:re disclosed in U.S. Patent No. 4,058,400), or a dicarbonyl chelate compound of a Group IIIA-VA element as is disclosed in U.S. Patent No. 4,086,091. These compositions are limited to ultraviolet radiation for polymerizat:LOn. Furthermore, the dicarbonyl chelates are moisture sensitive.
11.5. Patent No. 4,216,288 teaches the thermal curing of c<~tionally polymerizable compositions using onium salts and reducing agents.
Energy ~polymerizable compositions comprising ionic salts of organomertallic complex cations and cationically sensitive materials and the curing thereof has been taught (see U.S. Patent 4,868,288, Canadian Patent 1,300,307 and Canadian Patent Application Serial No. 440,864).
Neutral organometallic compounds have been used in combination with neutral halogenated compounds for the photocuring of ethylenically-unsaturated monomers. (G. Smets, Pure G. Appl. Chem-,, 53~ 611,615 (1981); H.M. Wagner, M.D.
Purbrick, J. Photograph Science, 29. 230-235 (1981).
Radiation dual curable compositions containing ethylenically unst~turated monomers and epoxy monomers have been described in U.S. Patent Nos. 4,156,035, 4,227,978, and 4,623,676. These compositions include onium salts combined with organic compounds .as the curing agent, but do not contain any organometalli<: compounds .
The dual curing of acrylate/polyurethane precursor mixtures is known but tlhese curing methods are not entirely photoactivated nor are any methods known that provide for the simultaneous curing of 'the polyurethane precursors and acrylates (see U.S. Patent No. 4,342,793 and Roesler, Modern Paint and Coatincx:3, April, 1986, pages 46-55).
U.S. Pat;ent No. 4,677,137 teaches the use of one of a supported onium salt or an ionic salt of organometallic complex as an initiator of the polymerization of cationically polymerizable matEarials. The reference does not teach that an ionic salt of an organometallic complex can be used to cure ~.~~~'~58 - 3a -ethylenically-unsF~turated monomers alone or in combination with epoxy monomers or polyurethane precursors.
U.S. Pat;ent N~o. 4,740,577 and EPO 0250 364 teach the use of an ionic sF~lt of an organometallic complex combined with polyurethane precursors in an energy polymerizable composition. U.S,~ Patent No. 4,707,432 teaches a free radically polymer:Lzable composition comprising a free radically polymer~Lzable material and a 4 ~340'~ ~~
photoinitiator sy:~tem comprising an alpha-cleavage or homolytic bond cleavage phot:oinit:iator and a ferrocenium salt.
United ~>tates Patent 5,073,476 and Canadian Patent 1,293,835 disclose hardE:nable composition, contains a radical and/or cationicall.y polymerizable material, or their mixtures and at least one ferrous-aromatic complex compound and at least one electron-acceptor as oxidising agent.
GB 21917_99A, published December 9, 1987, teaches the combination of an onium salt with the ionic salt of an organometallic complex iFOr polymerization of compositions by irradiating at two diffe rent wavelengths. The reference does not teach the simultaneous :initiation of the polymerization of two different polymerizable materials nor do they demonstrate the enhanced thermal atabil:ity derived from this composition. These references do not teach the polymerization of ethylenically unsaturated monomE;rs alone or in combination with epoxy monomers or polyurethane precursors using only organometallic salts as curing agents.
Summary of the Invention Briefly, the present invention provides an energy polymerizable composition comprising at least one ethylenically-unsaturated monomer optionally in combination with at least one polyurethane precursor or at least one epoxy monomer, and as curing agent an organomc:tallic salt (ionic salt of an organometallic complex cation). The compositions are useful as protective and decorative coatings, inks, adhesives, in restorative and sealant applications, and in imaging applications.
..
~~4p'~ ~~
- 4a -According to one aspect of the present invention there is provided a polymerizable composition comprising a polymeric precursor comprising an admixture of (a) at least one monomer or oligomer polymerizable by free radicals selected from acr;ylates, methacrylates, acrylamides, methacrylamides, and vinyl compounds, and polyurethane precursors comprising an admixture of at least one di- or polyisocyanate anc~ at least one compound bearing at least two isocyanate-reactive hydrogen atoms, or (b) at least one monomer or oligomer polymerizable by free radicals selected from acrylates, methacrylates, acrylamides, methacrylamides, and vinyl compounds, and at least one epoxy-containing monomer, and a single-component curing agent capable of effecting simultaneous initiation of said admixture consisting essentially of an organometallic salt, wherein said organometallic salt has the formula:
[((L1)(L2)M)b(L3)(L4))+eXf wherein M represents the same or different metals selected from the elements of Periodic Groups IVB, VB, VIB, VIIB, and VIII, with the proviso that Formula I
can represent an organo:metallic salt having a mono- or bimetallic cation;; L1 represents none, 1, 2, or 3 ligands cont ribut ing pi-e:Lect cons that can be the same or different ligand selected from substituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic aromatic and heterocyclic aromatic compounds, each c<~pable of contributing two to twelve pi-electrons to the valence shell of M; L2 represents none or 1 to 6 ligands contributing an even number of sigma-electrons 13~~ ~~$
- 4b -that can be the same or different selected from mono-, di-, and tri-dentate ligands~, each contributing 2, 4, or 6 sigma-electrons to the valence shell of M; L3 represents none, 1 or 2 bridging ligands contributing pi-electrons that can be the same or different ligan;d selected from substituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic aromatic and heterocyclic ,aromatic compounds, each capable of acting as a bridging ligand contributing 4 to 24 pi-electrons to the valence shells of two metal atoms simultaneously; L4 represents none, 1, 2 or 3 bridging ligands contributing an even number of sigma-electrons that can be the same or different selected from mono-, di-, and tri-dentate ligands, each donating 2, ~4, or 6 sigma-electrons to the valence shells of two M's simultt~neously; with the proviso that the total electronic charge contributed to M by the ligands L1, L2, L3 and L4 plus the product of ionic charge on M with b results in a residual net po:aitive charge of a to the cat ion; b is an integer having a value ~of 1 or 2; a is an integer having a value of 1 or 2, i:he residual electrical charge of the cation;
X is an anion selE~cted from organic sulfonate anions and halogen-containing complex anions of a metal of metalloid; f is an integer of J. or 2, the number of anions required to neutralize the chF~rge a on the cation; said composition being free of an oxidizj.ng agent .
According to a further aspect of the present invention there i~~ provided an abrasive article or a binder for a magnetic medium comprising a composition as defined above.
- 4c -When two polymerizable components are present they can be present in any proportion, preferably in the range of 0.1:99.9 to 99.9 :0.1 parts by weight, more preferably 1:99 to 99:1 parts by weight, and most preferably 2:98 to 98:2 parts by weight.
13~~'~ ~8 lahat is not taught in the prior art, but what is taught in this invention, is the use of organometallic salts for the photo- or accelerated particle-induced (e. g.
electron be~~m-induced) or thermal curing of ethylenically-unsaturated monomers alone or in combination with polyurethane precursors or epoxy monomers. When two different polymerizable materials are present, the instant invention composition and method relies on the simultaneous initiation of the polymerization of both materials. Only one irradiation step is utilized.
i~rdvantages of compositions of the present invention wizen utilized in 100% reactive coating composition: include:
inn industrial process innovation is disclosed that wall reduce, minimize, or eliminate the genera~;.ion of industrial solvent waste while reducing energy consumption.
radiation processing, particularly utilizing electron beam and photogenerated catalysts, has potential capability for penetrating and polymerizing thick <~nd pigmented coatings.
l~iore readily available monomers can be used in place of functionalized oligomers (used in the prior art) thereby resulting in lower viscosity monomer solutions which are easier to coat than more viscous oligomcsr solutions.
l;xpanding the scope of curable monomers to includes polyisocyanates/polyols and epoxides allows increa:aed flexibility in designing coatings with specific properties.
~~he photoinitiators provide increased thermal stability in combination with increased rate of cure.
7fn this application:
"energy-induced curing" means curing by means of at least onE~ of electromagnetic radiation (ultraviolet and visible) accelerated particles (including electron beam), and thermal (infrared and heat) means;
~~~~'~
"ethylenically-unsaturated monomer" means those monomers th~~t polymerize by a free-radical mechanism;
"catalytically-effective amount" means a quantity su:Eficient to effect polymerization of the curable composition to a polymerized product at least to a degree to cause an increase in the viscosity of the composition;
"organometallic salt" means one or more ionic salts of or~3anometallic complex cations wherein the cations contain at :Least one carbon atom of an organic group bonded to a metal ~~tom ("Basic Inorganic Chemistry", F.A. Cotton, G. Wilkinson, Wiley, New York, 1976, p. 497);
"polyurethane precursors" means a mixture of one or more monomers of the type including diisocyanates and polyisocyanates, and one or more monomers of the type including d:iols and polyols. Compounds bearing at least two isocyan~~te-reactive hydrogen atoms may be substituted for diols a~zd polyols; the ratio of isocyanate groups to isocyanate-reactive hydrogen atoms is 1:2 to 2:1;
"bridging ligand" means a ligand that bonds to two or more metals in the presence or absence of metal-metal bonds;
"polyisocyanate" means an aliphatic or aromatic isocyanate having 2 or more isocyanate groups;
"polyol" means an aliphatic or aromatic compound containing 2 or more hydroxyl groups; and "bireactive monomer" means a monomer which contains an ethylenically unsaturated group and at least one of an epoxy, an isocyanate, and an isocyanate-reactive group.
- ~ - 13~~'~~~
Detailed Disclosure of the Invention The present invention provides a photo and/or thermally polymerirable composition comprising at least one ethylenically-unsaturated monomer optionally in combination with at least one of po7_yuretlzane precursors or at least one epoxy monomer, and a curing agent, therefore, the curing agent preferably comprising an organometallic salt having the structure f ( (L1) (L2)M)b(L3) (L'~) l+e Xf I
wherein M represents a metal atom selected from the elements of Periodic Groups IVB, VB, VIB, VIIB, and VIIIB; with the proviso that formula I represents an organometallic salt having a mono- or bimetall.ic cat~ion;
L1 repre~~ents clone, 1, 2, or 3 ligands contributing pi-electrons that c:an be the same or different ligand selected from substituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic: aromatic and heterocyclic aromatic compounds, each ca~~able of contributing two to twelve pi-electrons to the valence shell of M;
L2 represents none, or 1 to 6 ligands contributing an even number of sigma-elects cons that can be the same or different selected from mono-, di-, and tri-dentate ligands, each donating 2, 4, or 6 sigma-electrons to the valence shell of M;
L3 represents none, 1 or 2 bridging ligands contributing pi-electron:> that can be the same or different ligand selected from sub:>tituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic: aromatic and heterocyclic aromatic compounds, each capable of acting as a bridging ligand _.
13~U~1~~
- 7a -contributing 4 to ~?4 pi-~alectrons to the valence shells of two metal atoms M, simultaneously;
L4 repre:~ents none, 1, 2, or 3 bridging ligands contributing an even number of sigma-electrons that can be _. -8- .,~.~.~f~ J
the same or different selected from mono-, di-, and tri-dentate ligands, each donating 2, 4 or 6 sigma-electrons to the valence shells of two metal atoms M, simultaneously; with the proviso that the total electronic charge contributed to M by the ligands L1, L~, L3, and L4 plus the product of the ionic charge on M with b results in a residual positive charge of a to the cation;
b is an integer having a value of 1 or 2;
a is an integer having a value of 1 or 2, the residual electrical charge of the cation;
X is an anion selected from organic sulfonate anions and :halogen-containing complex anions of a metal or metalloid;
f is an integer of 1 or 2, the number of anions required to neutralize the positive charge a on the cation.
I:n a preferred composition of the invention, the salts of the organometallic complex cation have the formula:
I (L5 ) (L6 )M~+. Xf II
wherein M represents a metal atom selected from elements of the Peri~~d Groups IVB, VB, VIB, VIIB, and VIIIB;
L'' represents none, one or two ligands that can be the same or different, contributing pi-electrons selected from the same groups of ligands from which ligand L1 of formu:La I is selected;
L'' represents none or 1 to 6 ligands that can be the same or different, contributing an even number of sigma-electrons selected from the same group of ligands from which :Ligand L~ of formula I is selected;
with the proviso that the total electronic charge contributed to M by LS and L6 plus the ionic charge on M
results in ~~ residual net posrive charge of a to the complex; and e, f, and X have the same definition as given in formula :C .
1340't~8 Salts of organometallic complex cations having formulae I and II are radiation sensitive in addition to being thermally sensitive or they can be cured in a two stage curing process using radiation followed by heat.
Ligands L1 to L6 are well known in the art of transition metal organometallic compounds.
Ligand L1 of general formula I and ligand LS of general formula II are provided by any monomeric or polymeric c~~mpound having an accessible unsaturated group, i.e., an etlhylenic, -~'~- group; acetylenic, -C=C- group;
or aromatic group which have accessible pi-electrons regardless of the total molecular weight of the compound.
By "accessible", it is meant that the compound (or precursor compound from which the accessible compound is prepared) bearing the unsaturated group is soluble in a reaction medium, such as an alcohol, e.g., methanol; a ketone, e.g., methyl ethyl ketone; an ester, e.g., amyl acetate; a halocarbon, e.g., trichloroethylene; an alkane, e.g., decal:in; an aromatic hydrocarbon, e.g., anisole; an ether, e.g., tetrahydrofuran; etc, or that the compound is divisible into very fine particles of high surface area so that the unsaturated group (including aromatic group) is sufficientl~,r close to a metal atom to form a pi-bond between than unsaturated group and the metal atom. By polymeric compound, is meant, as explained below, that the ligand can he a group on a polymeric chain.
Illustrative of ligands L1 and LS are the linear and cyclic olefinic and acetylenic compounds having less than 100 ca~:bon atoms, preferably having less than 60 carbon atoms, and from zero to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, arsenic, phosphorus, selenium, boron, antimony, tellurium, silicon, germanium, and tin, such as, for example, ethylene, acetylene, propylene, methylacetylene, 1-butene, 2-butene, diacetylene,, butadiene, 1,2-dimethylacetylene, cyclobutene, pentene, cyc:lopentene, hexene, cyclohexene, 1,3-cyclohexadiene, cyclopentadiene, 1,4-cyclohexadiene, cycloheptenea, 1-octene, 4-octene, 3,4-dimethyl-3-hexene, and 1-decen~e; eta3-allyl, eta3-pentenyl, norbornadiene, eta5-cycloh~exadienyl, etas-cycloheptatriene, eta8-cyclooctatetraene, and substituted and unsubstituted carbocyclic and heterocyclic aromatic ligands having up to 25 rings and up to 100 carbon atoms and up to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, boron, antimony, tellurium, silicon, germanium, and tin, such as, for example, etas-cyclopentadienyl, eta6-benzene, eta6-mesitylene, eta6-hexamethylbenzene, eta6-fluorene, eta6-naphthalene, eta6-anthracene, eta6-chrysene, eta6-pyrene, eta'-cycloheptatrienyl, etas-triphenylmethane, etalz-paracycloph~~ne, etal2-1,4-diphenylbutane, eta5-pyrrole, eta5-thiophene, eta5-furan, eta6-pyridine, etas-gamma-picoline, eta6-quinaldine, eta6-benzopyran, eta6-thioch:rome, eta6-benzoxazine, eta6-indole, eta6-acridine, eta6-carbazole, eta6-triphenylene, eta6-silabenzene, eta6-arsabenzene, eta6-stibabenzene, eta6-2,4,6-itriphenylphosphabenzene, eta5-selenophene, eta6-dibenzostannepine, eta5-tellurophene, eta6-phenothiarsine, eta6-selenanthrene, eta6-phenoxaphosphine, etas-phenar:~azine, eta6-phenatellurazine, and eta6-1-phen~,~lborabenzene. Other suitable aromatic compounds can be found by consulting any of many chemical handbooks.
As mentioned before, the ligand can be a unit of a polymer, ~Eor example, the phenyl group in polystyrene, poly(styrenE~-co-butadiene), polystyrene-co-methyl methacrylate), poly(alpha-methylstyrene), polyvinylcarbazole, and polymethylphenylsiloxane; the cyclopentadlene group in poly(vinylcyclopentadiene); the pyridine group in poly(vinylpyridine), etc. Polymers having a weight average molecular weight up to 1,000,000 or more can be used. It is preferable that 5 to 50 percent of the unsaturated or aromatic groups present in the polymer be complexed with metallic cations.
E~~ch of the ligands L1 and LS can be substituted by groups that do not interfere with the complexing of the ...... -11 _ ligand with the metal atom or which do not reduce the solubility of the ligand to the extent that complexing with the metal atom does not take place. Examples of substituting groups, all of which preferably have less than 30 carbon atoms and up to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, antimony, tellurium, silicon, germanium, tin, and boron, include hydrocarbyl groups such as methyl, ethyl, butyl, dodecyl, tetracosanyl, phenyl, benzyl, allyl, benzylidene, ethenyl, and ethynyl; hydrocarbyloxy groups such as metlhoxy, butoxy, and phenoxy; hydrocarbylmercapto groups such as methylmercapto (thiomethoxy), phenylmercapto (thiophenox:~); hydrocarbyloxycarbonyl such as methoxycarbonyl and phenoxycarbonyl; hydrocarbylcarbonyl such as formyl, acetyl, and benzoyl; hydrocarbylcarbonyloxy such as acetoxy, benzoxy, and cyclohexanecarbonyloxy;
hydrocarbylcarbonamido, e.g., acetamido, benzamido; azo, boryl; halo, e.g., chloro, iodo, bromo, and fluoro;
hydroxy; cy~~no; vitro; nitroso, oxo; dimethylamino;
diphenylpho;sphino, diphenylarsino; diphenylstibine;
trimethylge:rmane; tributyltin; methylseleno; ethyltelluro;
and trimeth;Tlsiloxy; condensed rings such as benzo, cyclopenta; naphtho, indeno; and the like.
L:igands LZ in formula I, and L6 in formula II are provided by monodentate and polydentate compounds preferably containing up to about 30 carbon atoms and up to 10 hetero ai:.oms selected from nitrogen, sulfur, non-peroxidic o:~ygen, phosphorus, arsenic, selenium, antimony, and tellurium, upon addition to the metal atom, following loss of zero, one, or two hydrogens, the polydentate compounds p~:eferably forming with the metal, M, a 4-, 5-, or 6-memberc~d saturated or unsaturated ring. Examples of suitable monodentate compounds or groups are carbon monoxide, c<~rbon sulfide, carbon selenide, carbon telluride, alcohols such as ethanol, butanol, and phenol;
nitrosonium (i.e., NO+); compounds of Group VA elements such as ammonia, phosphine, trimethylamine, trimethylphosphine, triphenylamine, triphenylphosphine, triphenylaraine, triphenylstibine, tributylphosphite, isonitriles such as phenylisonitrile, butylisonitrile;
carbene groups such as ethoxymethylcarbene, dithiometho:Kycarbene; alkylidenes such as methylidene, ethylidene; suitable polydentate compounds or groups include 1,2~-bis(diphenylphosphino)ethane, 1,2-bis(dipheny:larsino)ethane, bis(diphenylphosphino)methane, ethylenediamine, propylenediamine, diethylenetriamine, 1,3-diisocyanop:ropane, and hydridotripyrrazolyborate; the hydroxycarboxylic acids such as glycolic acid, lactic acid, salicylic acid; polyhydric phenols such as catechol and 2,2'-dihydroxybiphenyl; hydroxyamines such as ethanolamine, propanolamine, and 2-aminophenol; dithiocarbamates such as diethyldith:iocarbamate, dibenzyldithiocarbamate; xanthates such as ethyl xanthate, phenyl xanthate; the dithiolenes such as bis(perfluoromethyl)-1,2-dithiolene;
aminocarboxylic acids such as alanine, glycine and o-aminobenzoic acid; dicarboxylic diamines as oxalamide, biuret; diketones such as 2,4-pentanedione; hydroxyketones such as 2-hydroxyacetophenone; alpha-hydroxyoximes such as salicylaldo:~cime; ketoximes such as benzil oxime; and glyoximes such as dimethylglyoxime. Other suitable groups are the inorganic groups such as, for example, CN-, SCN-, F- , OH- , C1-- , Br- , I- , and H- and the organic groups such as, for example, acetoxy, formyloxy, benzoyloxy, etc. As mentioned before, the ligand can be a unit of a polymer, for example the amino group in poly(ethyleneamine); the phosphino group in poly(4-vinylphenyldiphenylphosphine);
the carboxy:Lic acid group in poly(acrylic acid); and the isonitrile ~~roup in poly(4-vinylphenylisonitrile).
L:igand L3 in Formula I is provided by any monomeric or polymeric compound having an accessible I
unsaturated group, such as any ethylenic -C-C- group or an acetylenic --C=C- group or an aromatic group which have accessible pi-electrons regardless of the total molecular we i ght of tile compound .
I:Llustrative of ligand L3 are the linear and cyclic dien<a and acetylenic compounds preferably having less than 60 carbon atoms and up to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, boron, antimony, tellurium, silicon, germanium, and tin, such as for example, acetylene, methylacetylene, diacetylene, butadiene, 1,2-dimethylacetylene, 1,3- cyclohexadiene, cyclopentadiene, and 1,4-cyclohexadiene; eta3-allyl, eta3-penten;yl, norbornadiene, etas-cyclohexadienyl, eta6-cycloheptatriene, etae-cyclooctatetraene, and substituted and unsubstituted carbocyclic and heterocylic aromatic li~gands having up to 25 rings and up to 100 carbon atoms and u;p to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, boron, antimony, tellurium, silicon, germanium, and tin, such as, for example, eta5-cyclopentadienyl, eta6-benzene, etas-mesitylene, etas-hexamethylbenzene, eta6-fluorene, eta6-naphthalene, eta6-anthracene, eta6-chrysene, eta6-pyrene, eta'-cycloheptatrienyl, eta6-triphenylmethane, eta5-pyrrole, etas-thiophene, eta5-furan, eta6-pyridine, etas-gamma-picoline, eta6 -quinaldine, etas -benzopyran, eta6 -thiochrome, etas -benzoxazine, etas-indole, eta6-acridine, eta6-carbazole, etas(1,2,3,~4,4a,12a)-etas-(7,8,9,10,10a,lOb)chrysene, eta6-triphenylene, eta6,eta6~-paracyclophane, etas,eta6~-:1,4-diphenylbutane, etas-silabenzene, etas-arsabenzene, eta6-stibabenzene, eta6-2,4,6-triphenylphosphabenzene, eta5-selenophene, etas-dibenzostannepine, eta5-tellurophene, etas-phenothiarsine, eta6-selenanthrene, etas-phenoxaphosphine, eta6-phenarsazine, etab-phenatellurazine, and eta6-1-phenylborabenzene. Other suitable aromatic compounds can be found by consulting any of many chemical handbooks.
E~~ch of the ligands L3 can be substituted by groups that do not interfere with the complexing of the ligand with the metal atom or which do not reduce the - solubility of the ligand to the extent that complexing with the metal atom does not take place. Examples of substituting groups, all of which preferably have less than .-. -14-30 carbon atoms and zero to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, antimony, tellurium, silicon, germanium, tin, and boron, include hydrocarbyl groups such as methyl, ethyl, butyl, dodecyl, tetracosanyl, phenyl, benzyl, allyl, benzylidene, ethenyl, and ethynyl; hydrocarbyloxy groups such as methoxy, butoxy, and phenoxy; hydrocarbylmercapto groups such as methylmercapto (thiomethoxy), phenylmercapto (thiophenox:y); hydrocarbyloxycarbonyl such as methoxycarb~cnyl and phenoxycarbonyl; hydrocarbylcarbonyl such as formyl, acetyl, and benzoyl; hydrocarbylcarbonyloxy such as acetoxy, benzoxy, and cyclohexanecarbonyloxy;
hydrocarbylcarbonamido, e.g., acetamido, benzamido; azo;
boryl; halo, e.g., chloro, iodo, bromo, and fluoro, hydroxy; cy~ano; vitro; nitroso, oxo; dimethylamino, diphenylphosphino, diphenylstibine; trimethylgermane;
tributyltin; methylseleno; ethyltelluro; and trimethylsiloxy; condensed rings such as benzo, cyclopenta;
naphtho, indeno; and the like.
Ligand L4 is provided by monodentate and polydentate compounds preferably containing up to about 30 carbon atoms and zero to 10 hetero atoms selected from nitrogen, sulfur, non-peroxidic oxygen, phosphorus, arsenic, selenium, antimony, and tellurium. Examples of suitable mondentate compounds or groups are carbon monoxide, carbon sulfide, carbon selenide, carbon telluride, ,alcohols such as ethanol, butanol, and phenol;
nitrosonium (i.e., NO+); compounds of Group VA elements such as trilphenylamine, triphenylphosphine, triphenylarsine, triphenylstibine, isonitriles such as phenylisonitrile; suitable polydentate compounds or groups include 1,2~-bis(diphenylphosphino)-ethane, 1,2-bis(diphenylarsino)ethane, bis(dipheny;lphosphino)methane, ethylenediamine, propylenedi~amine, diethylenetriamine, .- 1,3-diisocyanopropane, and hydridotripyrazolylborate; the hydroxycarboxylic acids such as glycolic acid, lactic acid, salicyclic .acid; polyhydric phenols such as catechol and -15- 134~'~ ~~
2,2'-dihydr~oxybiphenyl; hydroxyamines such as ethanolamine, propanolami;ne, and 2-aminophenol; dithiocarbamates such as diethyldithiocarbamate, dibenzyldithiocarbamate; xanthates such as bis(perfluoromethyl)-1,2-dithiolene;
aminocarbox;ylic acids such as alanine, glycine and o-aminobenz~oic acid; dicarboxylic diamides such as oxalamide, :biuret; diketones such as 2,4-pentanedione;
hydroxyketo:nes such as 2-hydroxyacetophenone;
alpha-hydro:xyoximes such as salicylaldoxime; ketoximes such as benzil o:xime; and glyoximes such as dimethylglyoxime.
Other suitalble groups are the inorganic groups such as, for example, CN~, SCN , F , OH , C1 , Br , I , and H and the organic groups such as, for example, acetoxy, formyloxy, benzoyloxy, etc.
M can be any element from the Periodic Groups IVB, VB, VI1B, VIIB, and VIIIB, such as, for example, Ti, Zr, Hf, V, lVb, Ta, Cr, Mo, W, Mn, Tc, Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd and Pt. , Suitable anions, X, in formulas I and II, of use as the counterion in the ionic salts of the organometallic complex cation in the preferred radiation-sensitive compositions of the invention are those in which X has the formula DZ=, wherein D is a metal from Groups IB to VIIIB
or a metal or metalloid from Groups IIIA to VA of the periodic Chart of Elements, Z is a halogen atom or a hydroxy gro~sp, and r is an integer~having a value of 1 to 6. Preferably, the metals are copper, zinc, titanium, vanadium, chromium, manganese, iron, cobalt, or nickel and the metalloids preferably are boron, aluminum, antimony, tin, arsenic, and phosphorus. Preferably, the halogen, Z, of formula :II, is chlorine or fluorine. Illustrative of suitable anions are BF9 , PF6 , As F6 , SbF6 , FeCl9 , SnCls , SbF,~ , A1 F6 , GaCl9 , InF9 , TiF6 , ZrF6 , etc.
Preferably,. the anions are BF4-, PF6-, SbF6-, SbF50H-, AsF6 - , and SbCl6 - .
Additional suitable anions, X, in formulae I and II, of use ~~s the counterion in the ionic salts of the organometal:lic complex cations include those in which X is _. -16-an organic sulfonate. Illustrative of suitable sulfonate-containing anions are CH3 S03 , CF3 S03 , C6H5S03-, p-toluenesulfonate, p-chlorobenzenesulfonate and related isomers and the like.
There are restrictions on the sum of electrons donated by the ligands, L1 , L~ , L3 , and L' , of formula I
and L5 and G6 of formula II, and the valence electrons possessed b;y the metal. For most complex compounds not involving i;ntramolecular metal-metal bonding, this sum is governed by the "eighteen electron rule" [see ,1. Chem. Ed., 46, 811 (1969)]. This rule is sometimes called the "nine orbital rule", "the effective number rule", or the "rare gas rule". This rule states that the most stable organometallic compounds tend to be those compounds in which the sum of the electrons donated by the ligands and the metal is eighteen. Those skilled in the art, however, know that there are exceptions to this rule and that organometallic complex compounds having a sum of 16, 17, 19, and 20 electrons are also known. Some of these complexes are transient. Therefore, ionic salts of organometallic complex cations not including intramolecular metal-metal bonding, described by formulas I and II in which the c~omplexed metal has a sum of 16, 17, 18, 19, or 20 electrons in the valence shell and a residual net positive charge of 1 or 2, are included within the scope of the invention.
For complex compounds described in formula I in which intramolecular metal-metal bonding exists serious departure from the "eighteen electron rule" can occur. It has been proposed [J. Amer. Chem. Soc. 100, 5305 (1978)]
that the departure from the "eighteen electron rule" in these transition metal complexes is due to the metal-metal interactions destabilizing the metal p orbitals to an extent to cause them to be unavailable for ligand bonding.
Hence, rather than count electrons around each metal separately in a metal_cluster, cluster valence electrons (CVE) are counted. A binuclear complex, MM, is seen to have 34 CVEs. Therefore, ionic salts of binuclear 1344'~5~
organometallic complex cations are described by formula I
in which the complexed metal cluster, MM, has a sum of 34 CVEs in the valence shell and a residual net positive charge of 1 or 2 are included within the scope of this invention.
Suitable organometallic complex ionic salts described by formulae I or II of use in the compositions of the invention are those salts that upon application of sufficient energy, thermal, accelerated particle (electron beam), or electromagnetic radiation having a wavelength from about 200 to 800 nm, will generate an active species capable of catalyzing the polymerization of the compositions of the invention. The level of catalytic activity will, of course, depend on the choice of metal, ligands, and counterions in the salt.
Examples of suitable salts of organometallfc complex cations useful in the composition of the invention include the following (proposed structures of typical compounds are shown at the end of the list):
(eta5-cyclopentadienyl)tricarbonyliron(1+) hexafluorophosphate~a~
(etas-cyclopentadienyl)dicarbonylthiocarbonyliron(1+) tetrafluoroborate (etas-cyclopentadienyl)carbonylbis-(triphenylstibine)iron(1+) hexafluorophosphate (eta5-cyclo:pentadienyl)tricarbonylruthenium(1+) tetrachloroferrate (eta5-cyclo;pentadienyl)dicarbonyltriphenylstibineiron(1+) hexafluoroa:ntimonate (eta5- _methylcyclopentadienyl)dicarbonylnitrosyl-manganese(1~+) hexafluoroantimonate~b~
(etas-methylcyclopentadienyl)(eta3-allyl)dicarbonyl-manganese(1+) tetrafluoroborate~'~
(etas-cyclopentadienyl)tetracarbonylmolybdenum(1+) hexafluorophosphate (eta5-pentadienyl)tricarbonyliron(1+) tetrafluoroborate (eta5-cyclohexadienyl)tricarbonyliron(1+) hexafluoroarsenate~a~
(eta5-cyclohexadienyl)(ethylidene)carbonyltriphenyl-phosphineiron(1+) tetrafluoroborate (eta5-cyclopentadienyl)(ethoxymethylcarbene)carbonyl-triphenylphosphineiron(1+) tetrafluoroborate (eta5-cyclopentadienyl)(dithiomethoxycarbene)-dicarbonyliron(1+) hexafluorophosphate (eta5-cyclopentadienyl)dicarbonylmethylisonitrileiron(1+) hexafluoroarsenate (etas-toluene)tricarbonylmanganese(1+) hexafluoroantimonate~'~
(eta6-mesitylene)tricarbonylrhenium(1+) hexafluoroa:ntimonate (eta'-cyclo:heptatrienyl)tricarbonylchromium(1+) hexafluorop:hosphate (eta'-cyclo:heptatrienyl)tricarbonyltungsten(1+) hexafluoroarsenate~f~
(eta5-cyclolpentadienyl)(eta2-1-pentene)dicarbonyliron(1+) tetrafluoroborate "'. -19-(eta6-benzene)(eta5-cyclopentadienyl)iron(1+) hexafluorophosphate (eta6-mesitylene)(etas-cyclopentadienyl)iron(1+) tetrafluoroborate (eta6-naphthalene)(eta5-cyclopentadienyl)iron(1+) hexafluoroantimonate (eta6-acetophenone)(eta5-methylcyclopentadienyl)iron(1+) hexafluoroarsenate bis(etas-cyclopentadienyl)cobalt(1+) hexafluorophosphate bis(eta5-cyclopentadienyl)iron(1+) hexafluoroantimonate bis(eta5-chlorocyclopentadienyl)nickel(1+) hexafluorop:hosphate bis(eta6-be:nzene)chromium(1+) hexafluoroantimonate~9~
bis(eta6-he:xamethylbenzene)cobalt(2+) hexafluoroarsenate bis(etas-he:xamethylbenzene)nickel(2+) hexafluoroantimonate tetracarbon;Yltriphenylphosphinecobalt(1+) hexafluoroplhosphate tricarbonyllbis(triphenylphosphine)iridium(1+) hexafluorophosphate (eta3-allyl)pentacarbonylchromium(1+) tetrafluoroborate pentacarbon:~lnitrosylmolybdenum(1+) hexafluorophosphate (eta3-allyl)tetracarbonyliron(1+) hexafluoroantimonate hexacarbony:lrhenium(1+) hexafluoroantimonate -- -20- 134i~'~J8 bis(eta6-mesitylene)iron(2+) hexafluoroantimonate~h~
bis(eta6-hexamethylbenzene)manganese(1+) tetrafluoroborate bis(eta6-mesitylene)vanadium(1+) hexafluorophosphate (eta~-cycloheptatrienyl)(eta5-cyclopentadienyl)manganese-(1+) hexafluoroarsenate (etae-cyclooctatetraenyl)(eta5-cyclopentadienyl)chromium-(1+) hexafluorophosphate (eta6-fluorene)(eta5-cyclopentadienyl)iron(1+) hexafluorophosphate~l~
(eta6-1-phenylborabenzene)(eta5-cyclopentadienyl)cobalt(1+) hexafluorophosphate (eta5-cyclopentadienyl)(eta5-N-methylpyrrolyl)iron(1+) hexafluorophosphate (etas-2,3,4,5-tetrathiomethoxybenzene)(eta5-cyclopentadienyl)iron(1+) hexafluoroarsenate [(eta6-1,2,3,4,5,6)(eta6-7,8,9,10,11,12)biphenyl]-bis(eta5-cyclopentadienyl)diiron(2+) tetrafluoroborate [(etas-1,2,3,4,4a,9a)(eta6-5,6,7,8,8a,5a)fluorene]-bis(etas-cyclopentadienyl)diiron(2+) hexafluorophosphate [(eta6-1,2,3,4,4a,12a)(eta6-7,8,9,10,10a,6a)chrysene]-bis(eta6-benzene)dichromium(2+) hexafluoroantimonate dicarbonyl[Ibis(diphenylphosphino)ethane]bis(etas-cyclopentad.ienyl)diiron(1+) hexafluorophosphate [(eta6-4,5,!~a,28c,28b,3a)(eta6-8a,8b,20d,22a,22b,24c)-1H,14H-dipyrano(3,4,5-gh: 3',4',5'-g'h')anthra(2",1",9":
-21- 1~~~~~~
4,5,6;6",5",10":4',5',6')diisoquino(2,1-a:2',1'-al)-diperimidine]bis(eta5-cyclopentadienyl)diiron(2+) hexafluoroantimonate [(eta6-1,2,3,3a,13b,13a)benzo(10,11)chryseno(2,3-d)(1,3)-dioxole](eta5-methylcyclopentadienyl)iron(1+) hexafluorophosphate [(eta6-1,2,3,3a,16c,16b)-(eta6-9,10,11,11a,13c,8b)cycloocta(1,2,3,4-def:5,6,7,8-d'e'f')diphenanthrene]bis-(etas-acetylcyclopentadienyl)diiron(2+) tetrafluoroborate bis(etas-acetylcyclopentadienyl)iron(1+) tetrafluoroborate (eta3-1-methylallyl)tetracarbonyliron(+1) hexafluorophosphate (eta3-1,3-dimethylallyl)tetracarbonyliron(+1) hexachloroantimonate ~.~4fl~5~
(a) (b) ;e~\ PF6 /M \ SbFs _ lli I i ~~~ li%
s o 0 0 0 0 0 + ~+
l0 (c) ~ (d) /M BFI ~~e~ AsF6 _ C ~ 'C ~ ~
/// ~ -'~ ~ O// Ilol + ~ +
(e) (f) C~Mn~ C SbFs /C' As F6 _ /.
o// ~I ~o o//~ b + ~ 2+
(9) (h) Cr SbFs _ Fe 2 SbF6 _ V' V
(i) Fe ~ PF6 Organomet=allic salts are known in the art and can be prepared as disclo:~ed in, for example, EPO Nos. 109,851, 094,914, 094,915 and 126,712. In addition to the compounds of formulae I and II, all o:f the organometallic salts disclosed in these references are use:Eul in the present invention.
The curing agent can be present in an effective amount which is generally in the range of 0.01 to 20, preferably 0.1 to weight percent of the total composition.
The present invention also provides a process for the 10 polymerization of ~i composition comprising one of ethylenically-unsaturated monomers optionally in combination with polyurethane precursors or epox~~ monorners comprising the steps of:
(a) providing said at least one ethylenically unsaturated monomer optionally in combination with polyurethane precursors or epoxy monomers, (b) adding to said composition a catalytically effective amount of a curing agent comprising an organometallic: salt (and all permutations of the order of mixing the afc>rement=Toned components), thereby forming a polymerizable mixture, and (c) allowing the mixture to polymerize or adding energy to the mixture to affect polymerization.
In a further aspect, there is also a provided method for preparing coated articles containing the cured composition of the invention comprising the steps of:
(a) providing a substrate, (b) coating an energy polymerizable mixture as described above onto at least one surface of said substrate by methods known in the art, such as bar, knife, reverse roll, knurled roll, curtain, or spin coatings, or by dipping, spraying, brushing, and the like, with or without a coating solvent, and r. - 23a -(c) app_Lying ~=nergy (after evaporation of solvent if present) and =Lf des.ired to the article to cause the polymerization of the coating.
._ _24_ 13 4 0 ~l ~ 8 In a still further aspect, there are also provided shaped articles comprising the polymerizable mixture of the invention. The articles can be provided, for example, by techniques such as molding, injection molding, casting, and extrusion. Applying energy to the mixture causes polymerization and provides the cured shaped article.
It may be desirable to add solvent to solubilize components and aid in processing. Solvent, preferably organic solvent, in an amount up to 99 weight percent, but preferably in the range of 0 to 90 weight percent, most preferably .in the range of 0 to 75 weight percent, of the polymerizab:Le composition can be used.
~~ wide variety of monomers can be energy polymerized using the curing agent of the invention.
Suitable compounds containing at least one ethylenically-unsaturated double bond, can be monomers and/or oligomers such as (meth)acrylates, (meth)acrylamides, and vinyl compounds, ~~nd are capable of undergoing free radical polymerization. Such monomers include mono-, di-, or poly-acrylates and methacrylates such as methyl acrylate, methyl methacrylat~~, ethyl acrylate, isopropyl methacrylate, isooctyl acrylate, acrylic acid, n-hexyl acrylate, stearyl acrylate, a:Llyl acrylate, glycerol diacrylate, glycerol triacrylate,, ethyleneglycol diacrylate, diethyleneglycol diacrylate, triethyleneglycol dimethacrylate, 1,3-propanediol diacrylate, 1,3-propanediol dimethacrylate, trimethylolpropane triacrylate, 1,2,4-butanetriol trimethylacrylate, 1,4-cyclohexanediol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol t~etramethacrylate, sorbitol hexacrylate, bis[1-(2-acryloxy)]-p-ethoxyphenyl-dimethylmethane, bis[1-(3-acryloxy~-2-hydroxy)]-p-propoxyphenyl-dimethylmethane, Iris-hydroxyethyl-isocyanurate trimethacryJ.ate; the bis-acrylates and bis-methacrylates of polyethylene glycols of molecular weight 200-500, copolymerizable mixtures of acrylated monomers such as those of U.S. Patent No. 4,652,274, and acrylated oligomers -25- 1340'x;8 such as those of U.S. Patent No. 4,642,126; bireactive monomers such as epoxy (meth)acrylates, isocyanato (meth)acrylates, and hydroxy (meth)acrylates, preferred examples including hydroxyethyl (meth)acrylate, hydroxyprop;yl (meth)acrylate, isocyanatoethyl (meth)acryl~ate, glycidyl (meth)acrylate, and m-isopropen;yl-alpha, alpha-dimethylbenzyl isocyanate;
unsaturated amides such as acrylamide, methylene bis-acrylamide, methylene bis-methacrylamide, 1,6-hexametlhylene bis-acrylamide, diethylene triamine tris-acrylamide and beta-methacrylaminoethyl methacrylate;
and vinyl compounds such as styrene, divinylbenzene diallyl phthalate, divinyl succinate, divinyl adipate, divinyl phthalate, sand vinyl azlactones as disclosed in U.S. Patent No. 4,304,7~~5. Mixtures of two or more monomers can be used if desired. Bireactive monomers are particularly useful in crosslinking two different polymerizable species.
'rhe polyisocyanate component of the polyurethane precursors 'that can be cured or polymerized in the present invention m~~y be any aliphatic, cycloaliphatic, araliphatic, aromatic, or heterocyclic polyisocyanate, or any combination of such polyisocyanates. Particularly suitable po:lyisocyanates correspond to the formula Q(NCO)p III
in which p :is an integer 2 to 4, and Q represents an aliphatic h~~drocarbon di-, tri-, or tetra-radical containing :From 2 to 100 carbon atoms, and zero to 50 heteroatoms, a cycloaliphatic hydrocarbon radical containing :From 4 to 100 carbon atoms and zero to 50 heteroatoms, an aromatic hydrocarbon radical or heterocyclic: aromatic radical containing from 5 to 15 carbon atoms and zero to 10 heteroatoms, or an araliphatic hydrocarbon radical containing from 8 to 100 carbon atoms and zero to 50 heteroatoms. The hete.roatoms that can be present in S~ include non-peroxidic oxygen, sulfur, non-amino nitrogen, halogen, silicon, and non-phosphino phosphorus.
._ ~3~~~~58 Examples of po:lyisocyanates are as follows: ethylene diisocyanate, 1,4-t:etramethylene diisocyanate, 1,6-hexamethylene diisocyanate, trimethyl lzexamethylene diisocyanate, 1,12-dodecane diisocyanate, cyclobutane-1,3-diisocyanate, cyclohexane-1,3- and -1,4-diisocyanate and mixtures of these isomers, 1-isocyan~~to-3,:3,5-triemethyl-5-isocyanatomethyl cyclohexane (see German Auslegenschrift No. 1,202,785, U.S.
Patent No. 3,401,1~~0), 2,,4- and 2,6-hexahydrotolylene diisocyanate and mixtures of these isomers, hexahydro-1,3-and/or -1,4-phenylme di:isocyanate, perhydro-2,4'- and/or -4,4'-diphenylmethane dii_socyanate, 1,3- and 1,4-phenylene diisocyanate, 2,4- and 2,,6-tolylene diisocyanate and mixtures of these isomers, diphenylmethane-2,4'- and/or -4,4'-diisocyanate, naphthylene-1,5-dii.socyanate, and the reaction products of four equivalents of the aforernentioned isocyanate-containing compounds with compounds containing two isocyanate-reactive groups.
According to the present invention, it is also possible, for example, to use triphenyl methane-4,4',4"-triisocyanate, polyphenyl polymethylene polyisocyanates described in Briti~;h Patent Nos. 874,430 and 848,671, m- and p-isocyanatophenyl sulphonyl isocyanates according to U.S. Patent No. 3,454,606, perc:hlorinated aryl polyisocyanates of the type described, for example, in German Auslegenschrift No. 1,157,601 (U. S. Pat. No. 3,277,138), polyisocyanates containing carbodiimide groups. of the type described in U.S. Patent No.
3,152,162 and in German 0ffenlegungsschrift Nos. 2,504,400, 2,537,685 and 2,552,350, norbornane diisocyanates according to U.S. Patent No. 3,492,330, polyisocyanates containing allophanate groups of the type described, for example, in British Patent No. 994,890, in Belgian Pat. No. 761,626 and in U.S. Patent No. 3,764,318, polyisocyanates containing - 26a - 134"r~8 isocyanurate groups of t:he type described, for example in U.S.
Patent No. 3,001,9'13, in German Patent Nos. 1,022,789, 1,222,067 and 1,027,394 and German Offenlegungsschrift Nos. 1,929,034 _27_ 1~~~~1 ~~
and 2,004,048, polyisocyanates containing urethane groups of the type described, for example, in Belgian Patent No.
752,261 or in U.S. Patent Nos. 3,394,164 and 3,644,457, polyisocyanates containing acrylated urea groups according to German Patent No. 1,230,778, polyisocyanates containing biuret groups of the type described, for example, in U.S.
Patent Nos. 3,124,605, 3,201,372 and 3,124,605 and in British Pa tent No. 889.050, polyisocyanates produced by telomerization reactions of the type described for example in U.S. Patent No. 3,654,106, polyisocyanates containing ester groupie of the type described, for example, in British Patent Nos. 965,474 and 1,072,956, in U.S. Patent No.
3,567,763 a~zd in German Patent No. 1,231,688, reaction products of the above-mentioned diisocyanates with acetals according to German Patent 1,072,385 and polyisocyanates containing polymeric fatty acid esters according to U.S.
Patent No. :3,455,883.
:Lt is also possible to use distillation residues having isocyanate groups obtained in the commercial production of isocyanates, optionally in solution in one or more of the above-mentioned polyisocyanates. It is also possible to use any mixtures of the above-mentioned polyi socyan<~tes .
1?referred polyisocyanates are hexamethylene diisocyanate, its isocyanurate and its biuret;
Patent No. 3,001,9'13, in German Patent Nos. 1,022,789, 1,222,067 and 1,027,394 and German Offenlegungsschrift Nos. 1,929,034 _27_ 1~~~~1 ~~
and 2,004,048, polyisocyanates containing urethane groups of the type described, for example, in Belgian Patent No.
752,261 or in U.S. Patent Nos. 3,394,164 and 3,644,457, polyisocyanates containing acrylated urea groups according to German Patent No. 1,230,778, polyisocyanates containing biuret groups of the type described, for example, in U.S.
Patent Nos. 3,124,605, 3,201,372 and 3,124,605 and in British Pa tent No. 889.050, polyisocyanates produced by telomerization reactions of the type described for example in U.S. Patent No. 3,654,106, polyisocyanates containing ester groupie of the type described, for example, in British Patent Nos. 965,474 and 1,072,956, in U.S. Patent No.
3,567,763 a~zd in German Patent No. 1,231,688, reaction products of the above-mentioned diisocyanates with acetals according to German Patent 1,072,385 and polyisocyanates containing polymeric fatty acid esters according to U.S.
Patent No. :3,455,883.
:Lt is also possible to use distillation residues having isocyanate groups obtained in the commercial production of isocyanates, optionally in solution in one or more of the above-mentioned polyisocyanates. It is also possible to use any mixtures of the above-mentioned polyi socyan<~tes .
1?referred polyisocyanates are hexamethylene diisocyanate, its isocyanurate and its biuret;
4,4'-methylE~nebis(cyclohexylisocyariate); 1-isocyanato-3,3,5-trimei:hyl-5-isocyanatomethyl cyclohexane (isophorone diisocyanatE~); the tolylene diisocyanates and their isocyanuratE~s; the mixed isocyanurate of tolylene diisocyanatE~ and :hexamethylene diisocyanate; the reaction product of 7l mol ~of trimethylol propane and 3 mole of tolylene dii~socyanate and also crude diphenyl methane di i socyanate~ .
also useful are blocked polyisocyanates, which are known in the art and are commercially available, wherein the blocking group can be, for example, phenol, _ epsilon-caprolactam, hydroxamic acid ester, ketoxime, t-butyl acet:oacetate, and others described in Z.W. Wicks, Jr., "Progress in Organic Coatings", 9 pp. 3-28 (1981).
-28- 1340"l ~~
Suitable compounds containing at least 2 isocyanate-reactive hydrogen atoms can be high or low molecular weight compounds, having a weight average molecular weight, generally from about 50 to 50,000. In addition to compounds containing amino groups, thiol groups or carboxyl groups, are, preferably, compounds containing hydroxyl gr~~ups, particularly compounds containing from about 2 to 50 hydroxyl groups and above all, compounds having a weight average molecular weight of from about 500 to 25000, preferably from about 700 to 2000, for example, polyesters, polyethers, polythioethers, polyacetals, polycarbonates, poly(meth)acrylates, and polyester amides, containing ~~t least 2, generally from about 2 to 8, but preferably :from about 2 to 4 hydroxyl groups, or even hydroxyl-containing prepolymers of these compounds and a less than e~3uivalent quantity of polyisocyanate, of the type known :for the production of polyurethanes.
lZepresentatives of the above-mentioned compounds used in accordance with the present invention are described, :for example, in High Polymers, Vol. XVI, "Polyurethanes, Chemistry and Technology", By Saunders and Frisch, Interscience Publishers, New York/London, and Vol.
I, 1962, pales 32 to 42 and pages 44 to 54 and Vol. II, 1964, pages 5-6 and 198-199, and in "Kunststoff-Handbuch", Vol. VII, V:ieweg-Hochtlen, Carl-HanserVerlag, Munich, 1966, for example,, on pages 45 to 71. It is, of course, possible to use mixtures of the above-mentioned compounds containing at least two isoc;yanate-reactive hydrogen atoms and having a molecular weight of from about 50 to 50,000 for example, mixtures of polyethers and polyesters.
7Cn some cases, it is particularly advantageous to combine 7Low-melting and high-melting polyhydroxyl containing compounds with one another (German Offenlegungsschrift No. 2,706,297).
how molecular weight compounds containing at least two isocyanate-reactive hydrogen atoms (molecular weight from about 50 to 400) suitable for use in accordance with the present invention are compounds preferably containing hydroxyl groups and generally containing from about 2 to 8, preferably from about 2 to 4 isocyanate-reactive hydrogen atoms. It is also possible to use mixtures of different compounds containing at least two isocyanate-reactive hydrogen atoms and having a molecular weight in t:he range of from about 50 to 400. Examples of such compounds are ethylene glycol, 1,2- and 1,3-propylene glycol, 1,4~- and 2,3-butylene glycol, 1,5-pentane diol, 1,6-hexane diol, 1,8-octane diol, neopentyl glycol, 1,4-bis-hydroxymethyl cyclohexane, 2-methyl-1,3-propane diol, dibromobutene diol (U. S. Patent No. 3,723,392), glycerol, trimethylolpropane, 1,2,6-hexanetriol, trimethylol~~thane, pentaerythritol, quinitol, mannitol, sorbitol, d.iethylene glycol, triethylene glycol, tetraethylene glycol, higher polyethylene glycols, dipropylene glycol, higher polypropylene glycols, dibutylene ~31yco1, higher polybutylene glycols, 4,4'-dihydroxy diphenyl propane and dihydroxy methyl hydroquinone.
Other polyols suitable for the purposes of the present invention are the mixtures of hydroxy aldehydes and hydroxy ketones ("formose") or the polyhydric alcohols obtained therefrom by reduction ("formitol") which are formed in the autocondensation of formaldehyde hydrate in the presence of metal compounds as catalysts and compounds capable of enediol formation as co-catalysts (German Offenlegungsschrift Nos. 2,639,084, 2,714,084, 2,714,104, 2,721,186, x,738,154 and 2,738,512). Solutions of polyisocyanate polyaddition products, particularly solutions of polyurethane ureas containing ionic groups and/or solui:ions of polyhydrazodicarbonamides, in low molecular wESight polyhydric alcohols may also be used as the polyol component in accordance with the present invention ((serman Offenlegungsschrift No. 2,638,759).
Many other compounds containing isocyanate-reactive hydrogen atoms and polyisocyanates are useful in the present invention, and are obvious to those skilled in the art of polyurethane science and technology.
_ -30- 1340~1~8 Epoxy compounds that can be cured or polymerized by the curing agents of this invention, using the latter in a catalytically effective amount, are those known to undergo cationic polymerization and include 1,2-, 1,3-, and 1,4-cyclic ethers (also designated as 1,2-, 1,3-, and 1,4-epoxides). The 1,2-cyclic ethers are preferred.
'The cyclic ethers which can be polymerized in accordance 'with this invention include those described in "Ring-Opening Polymerizations", Vol. 2, by Frisch and Reegan, Marvel Dekker, Inc. (1969). Suitable 1,2-cyclic ethers are the monomeric and polymeric types of epoxides.
They can be aliphatic, cycloaliphatic, aromatic, or heterocycli~~ and will typically have an epoxy equivalency of from 1 to 6, preferably 1 to 3. Particularly useful are the aliphatic, cycloaliphatic, and glycidyl ether type 1,2-epoxide;s such as propylene oxide, epichlorohydrin, styrene oxide, vinylcyclohexene oxide, cyclohexeneoxide, vinylcyclohexene dioxide, glycidol, butadiene oxide, glycidyl methacrylate, diglycidyl ether of bisphenol A, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-6--methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate, bis(3,4-epo:cy-6-methylcyclohexylmethyl)adipate, dicyclopentadiene dioxide, epoxidized polybutadiene, 1,4-butaned:iol diglycidyl ether, polyglycidyl ether of phenolforma:Ldehyde resole or novolak resin, resorcinol diglycidyl Ether, and epoxy silicones, e.g., dimethylsiloxanes having cycloaliphatic epoxide or glycidyl ether groups.
~~ wide variety of commercial epoxy resins are available and listed in "Handbook of Epoxy Resins" by Lee and Neville,, McGraw Hill Book Company, New York (1967) and in "Epoxy Resin Technology" by P. F. Bruins, John Wiley &
Sons, New York (1968). Representative of the 1,3- and 1,4-cyclic ethers which can be polymerized in accordance with this invention are oxetane, _ 3,3-bis(chloromethyl)oxetane, and tetrahydrofuran.
In particular, cyclic ethers which are readily available include propylene oxide, oxetane, epichlorohydrin, tetrahydrofuran, styrene oxide, cyclohexeneoxide, vinylcyclohexene oxide, qlycidol, glycidyl methacrylate, octylene oxide, phenyl g7_ycidyl ether, 1,2-butane oxide, digylcidyl ether of bisphenol A (e.g., "Epon*828" and "DER*331"), vinylcyclohe~;ene dioxide (e. g., "ERL*-4206"), 3,4-epoxycyclohexylmethyl-3,~!-epoxycyclohexanecarboxylate (e. g.,"ERL-4221"), 3,4-epoxy-6-methylcyclohexanecarboxylate (e. g.,"ERL-4201"), bis(3,4-epoxy-6-methylcyclohexylmethyl) adipate (e. g.,"ERL-4289"), aliphatic epoxy modified with polypropylene glycol (e.g., "ERL-4050" and "ERL-4052"), dipentene dioxide (e. g., "ERL-4269"), epoxidized polybutadiene (e. g., "Oxiron 2001"), silicone epoxy (e. g. "Syl-Kem*90"), 1,4-butanediol diglycid.yl ether (e. g., Araldite*RD-2), polyglycidyl ether of phenolformaldehyde novolak (e. g., "DER-431", "Epi-Rez*521" and "DER-438"), resorcinol diglycidyl ether (e. g., "Kopoxite*"), polyglycol diepoxide (e.g., "DER 736"), polyacrylate epoxid.e (e. g., "Epocryl*U-14"), urethane modified epoxide (e. g., "QX*3599"), polyfunctional flexible epoxides (e.g., "Flexibilizer*151"), and mixtures thereof as well as mixtures thereof with co--curatives, curing agents, or hardeners which also are well known (see Lee and Neville and Bruins, supra). Representative of the co-curatives of hardeners which can be used are acid anhydrides such as nadic methyl anhydride, cyclopentanetetraca.rboxy7_ic dianhyrdride, pyromellitic anhydride, cis-1,2-cyclohexanedicarboxylic anhydride, and mixtures thereof.
Where etr.ylenic:ally-unsaturated compounds are used in combination with ar. epoxy monomer or a polyurethane precursor, the polymerizable c:omponE:nts can be present in any proportion, prferably 0.1:99 to 99.9:Ø1, more preferably 1:99 to 99:1, most preferably 2:98 to 98:2 parts by weight.
*Trade-mark 7:n general, radiation-induced polymerization of ethylenical7.y-unsaturated monomers, optionally in combination with polyurethane precursors or epoxy monomers with latent curing agents comprising an organometallic salt can be carried out at room temperature for the majority of energy curable compositions, although low temperature (e.g., -10°c:) or elevated temperature (e.g., 30 to 400°C, preferably 50 to 300°C) can be used to subdue the exotherm of polymerisation or to accelerate the polymerization, respectively. Temperature of polymerization and amount of catalyst wi:il vary and be dependent on the particular curable composition used and the desired application of the polymerized or cured product. The amount of curing agent to be used :in this invention should be sufficient to effect polymerization of the monomers or precursors (i.e., a catalytical:iy-effective amount) under the desired use conditions. Such amount generally will be in the range of about 0.01 to 20 weight percent, and preferably 0.1 to 10.0 weight percent, based on the weight of curable composition.
Solvents, preferably organic, can be used to assist in dissolution of the curing agent in the ethylenical:iy-unsaturated monomer, or in the combination of ethylenical:Ly-unsaturated monomers) and polyurethane precursors or with epoxy monomers, and as a processing aid.
Representative solvents include acetone, methyl ethyl ketone, cyc:lopentanone, methyl cellosolve acetate, methylene clnloride, nitromethane, methyl formate, acetonitrile, gamma-butyrolactone, and 1,2-dimethoxyethane (glyme). In some applications, it may be advantageous to adsorb the ~~uring agents onto an inert support such as silica, alu~nina, clays, etc., as described in U.S. Patent No. 4,677,137.
For those compositions of the invention which are radiati~cn-sensitive, i.e., any source of radiation including accelerated particles (e. g. electron beam radiation) .and radiation sources emitting active radiation in the ultraviolet and visible region of the spectrum (e. g., about 200 to 800 nm) can be used. Suitable sources _33- 13~0~1~8 of radiation include mercury vapor discharge lamps, carbon arcs, tungsi~en lamps, xenon lamps, lasers, sunlight, etc.
The required amount of exposure to effect polymerization is dependent upon such factors as the identity and concentrations of the organometallic salt, the particular ethylenical:iy unsaturated monomer, polyurethane precursors, or epoxy monomers, the thickness of the exposed material, type of sub;~trate, intensity of the radiation source and amount of heat associated with the radiation.
optionally, it is within the scope of this invention t« include photosensitizers or photoaccelerators in the radiation-sensitive compositions. Use of photosensit:izers or photoaccelerators alters the wavelength sensitivity of radiation-sensitive compositions employing the latent catalysts of this invention. This is particularl~,~ advantageous when the latent catalyst does not strongly absorb the incident radiation. Use of a photosensit:izer or photoaccelerator increases the radiation sensitivity, allowing shorter exposure times and/or use of less powerful sources of radiation. Any photosensitizer or photoaccele:rator may be useful if its triplet energy is at least 45 ki:Localories per mole. Examples of such photosensit:izers are given in Table 2-1 of the reference, Steven L. Murov, Handbook of Photochemistry, Marcel Dekker Inc., NY, 2'7-35 (1973), and include pyrene, fluoranthrene, xanthone, tlaioxanthone, benzophenone, acetophenone, benzil, benzoin and ethers of benzoin, chrysene, p-terphenyl, acenaphthene, naphthalene, phenanthrene, biphenyl, substituted derivatives of the preceding compounds, and the like. When present, the amount of photosensitizer or photoaccele:rator used in the practice of the present invention i;s generally in the range of 0.01 to 10 parts, and preferably 0.1 to 1.0 parts, by weight of photosensit:izer or photoaccelerator per part of organometal:iic salt.
'thermal polymerization using direct heating or infrared electromagnetic radiation, as is known in the art, can be used to cure the compositions according to the teachings o:E this invention.
-34- 1340"l~~
7:t is Yaithin the scope of this invention to include two--stage polymerization (curing), by first activating t:he curing agent by irradiating the curable compositions and subsequently thermally curing the activated precursors so obtained, the irradiation temperature being below the temperature employed for the subsequent heat-curing. The activated precursors may normally be cured at temperatures which are substantially lower than i:hose required for the direct thermal curing, with an advantage in some cases in the range from 50 to 110°C. This two-stage curing also makes it possible to control the polymerization in a particularly simple and advantageous manner.
~~djuvants such as solvents, pigments, abrasive granules, stabilizers, light stabilizers, antioxidants, flow agents,, bodying agents, flatting agents, colorants, inert fillers, binders, blowing agents, fungicides, bacteriocides, surfactants, plasticizers, and other additives as known to those skilled in the art can be added to the compositions of this invention. These can be added in an amouni~ effective for their intended purpose.
Compositions of this invention are useful for coatings, foams, shaped articles, adhesives, filled or reinforced composites, abrasives, caulking and sealing compounds, casting and molding compounds, potting and encapsulated compounds, impregnating and coating compounds, and other applications which are known to those skilled in the art.
Compositions of this invention may be applied, preferably ~~s a liquid, to a substrate such as steel, aluminum, copper, cadmium, zinc, ceramic, glass, paper, wood, or various plastic films such as polyethylene terephthalate), plasticized poly(vinylchloride), poly(propylene), poly(ethylene), and the like, and irradiated. By polymerizing part of the coating, as by irradiation through a mask, those sections which have not been exposed may be washed with a solvent to remove the unpolymerized portions while leaving the photopolymerized, .~34Q~1~8 insoluble portions in place. Thus, compositions of this invention may be 'used in the production of articles useful in the graphic arts such as printing plates and printed circuits. r2ethods of producing printing plates and printed circuits from photopolymerizing compositions are well known in the art i;see for example British Patent Specification No. 1, 495, 7~~6 ) .
t)bjects and advantages of this invention are further illustrated by the following examples, but the particular materials and amounts thereof recited in these examples, as well as other conditions and details, should not be consi:.rued to unduly limit this invention. In the examples, a:Ll parts are parts by weight unless indicated otherwise. All examples were prepared in ambient atmosphere (in the presence of oxygen and water vapor) unless indicated otherwise.
cunHror.~ 1 'this example demonstrates the simultaneous curing of ethylenically unsaturated and epoxy monomers in a crosslinkab:le system. The curable composition consisted of methyl acry:late, cyclohexene oxide and glycidyl acrylate.
If only epo:Ky (comparative) or acrylate cure were initiated, then this system produced a soluble polymer. If both epoxy ~~nd acrylate cure were initiated then a crosslinked insoluble polymer was produced.
Sample preparations were carried out under subdued lights (below the level necessary to initiate polymerization). The polymerizable mixture consisted of 1.0 g glycidyl acrylate, 5.0 g methyl acrylate and 5.0 g cyclohexene oxide. In all cases there was added to the polymerizable compositions 0.1 g of the desired organometallic salt. A 3 g portion of the composition was placed in a glass vial and irradiated between two 15 watt G.E. daylig:ht fluorescent bulbs using an Ultraviolet Products lamp holder (lamp separation distance 4 cm). The sample was ;purged with nitrogen for one minute preceding and continuously during photolysis. The irradiation time required to produce a polymer insoluble in chloroform was recorded, a;nd is noted in Table I.
-36- 1340r1 ~8 Alternatively, these compositions can be cured thermally or in a two-stage process.
TABLE I
Simultaneous Photoinitiation of Free Radical and Epoxy Cure in a Crosslinkable System Cure Compound Time ( etas -mesit~tlene ) ( eta5 -cyclopentadienyl )- 70 iron(1+) hexafluorophosphate (eta6-mesitlrlene)(etas-cyclopentadienyl)- 35 iron(1+) hexafluoroantimonate (eta6-naphthalene)(eta5-cyclopentadienyl)- 90 iron(1+) hexafluorophosphateb (eta6-naphthalene)(eta5-cyclopentadienyl)- 40 iron(1+) hexafluoroantimonate (eta6-1,2,3,4,4a,9a-(9-cinnamylidenefluorene))- 340 (eta5-cyclopentadienyl)iron(1+) hexafluorophosphate (eta5-cyclo~~entadienyl)dicarbonyl- 600 tripheny:lphosphineiron(1+) hexafluorophosphate (etas-cyclo~pentadienyl)dicarbonyl- 600 tripheny;lphosphineiron(1+) hexafluoroarsenate (etas-cyclo~pentadienyl)dicarbonyl- 95 tripheny:larsineiron(1+) hexafluoroarsenate (etas-cyclo~pentadienyl)dicarbonyl- 160 triphenylarsineiron(1+) hexafluoroantimonate (eta5-cyclo;pentadienyl)dicarbonyl- 120 triphenylstibineiron(1+) hexafluoroantimonate -37- 134U'l58 a Time in :>econds to produce insoluble crosslinked system.
Diphenyliodonium hexafluorophosphate (comparative) alone under these conditions did not produce a crosslinked system ai:ter 20 minutes of irradiation.
b 0.2 g of gamma-butyrolactone added to completely solubilize this compound.
CYnMDT.F 7 Curing trials using cationic organometallic salts as photoinit~iators for free radical were conducted in the following manner: exposures were made on a hot plate to keep the temperature constant. The light source was a 275 watt Sylvan:ia sunlamp positioned 10 cm above the sample.
For free radical polymerization, a stock solution was prepared from of 0.1 g cationic organometallic salt, 2 g gamma-butyrolactone, 10 g of pentaerythritol tetraacrylate.
Approximately 0.2 g of this curable composition was placed in an aluminum pan and the time to produce a hard cure was recorded at the specified temperature. The trials were conducted in air. The results of these trials are presented in Table II.
-38- 1340~1~8 mnnr.F Tr Acrylate Cure Times Cure Catalyst System Time' Temperature (eta6-mesit!Tlene)(eta5-cyclopentadienyl)- 60 53C
iron(1+) hexafluoroantimonate (eta6-mesit~,~lene)(eta5-cyclopentadienyl)- 60 53C
iron(1+) hexafluorophosphate (etas-cyclopentadienyl)dicarbonyl- 60 53C
tripheny:Lphosphineiron(1+) hexafluo:roantimonate (eta6-mesit;~lene)(eta5-cyclopentadienyl)- 20 78C
iron(1+) hexafluoroantimonate (etas-mesit:~rlene)(etas-cyclopentadienyl)- 20 78C
iron(1+) hexafluorophosphate (eta5-cyclo~pentadienyl)dicarbonyl- 20 78C
tripheny:lphosphineiron(1+) hexafluoroantimonate (eta6-mesit;Ylene)(eta5-cyclopentadienyl)- 15 102C
iron(1+) hexafluoroantimonate (eta6-mesit;Ylene)(eta5-cyclopentadienyl)- 15 102C
iron(1+) hexafluorophosphate (eta5-cyclo~pentadienyl)dicarbonyl- 15 102C
tripheny.lphosphineiron(1+) hexafluoroantimonate Cure time in seconds T;he data of TABLE II show that organometallic salts are efficient photoinitiators of free radical polymerization.
More quantitative information on the relative activity of 1) organometallic salt and 2) the combination organometallic salt and onium salt (comparative) and 3) onium salt (comparative) as initiator was obtained from a series of nmr trials carried out to measure the degree of .~ -39- 1340r~58 conversion from monomer to polymer. The results of these trials are F~resented in Table III. The trial which produced then results in Table IiI was carried out in the following manner: A 1/1, w/w, mixture of methyl acrylate/cyc:lohexene oxide was prepared. To a lOg sample of this mixture was added O.lg of the desired cationic organometalT.ic salt and/or O.lg of diphenyliodonium hexafluorophosphate. In a small vial was placed 2g of the sample and it was purged with nitrogen for 1 min before and continually during irradiation. The light source was two watt Syl~rania daylight fluorescent bulbs. irradiation time was 3 minutes. immediately after completion of the photolysis, the nmr was taken in CDC13. The amount of polymerization was determined by the ratio of the peak 15 intensity oiE the polymer to that of polymer plus monomer.
mrar c' TTr Percent Conversion to Polymer from NMR Study' _Catalyst System Epoxy Acrylate (etas-mesit7Tlene)(etas-cyclopentadienyl)- 97.5% 58.5%
iron(1+) hexafluoroantimonate (eta6-mesit~Tlene)(etas-cyclopentadienyl)- 53.5% 47.3%
iron(1+) hexafluoroantimonate/IODONIUMb ( comparative ) (eta6-mesit:~lene)(eta5-cyclopentadienyl)- 47.7% 41.8%
iron(1+) hexafluorophosphate (etas-mesit;~rlene)(eta5-cyclopentadienyl)- 47.6% 49.1%
iron(1+) hexafluorophosphate/IODONIUM
( comparative ) IODONIUM (comparative) <0.5% 5.3%
Nmrs to ken on a 400 MHz instrument '' IODONIUM in all Examples is diphenyliodonium hexafluorophosphate Tlhe data in Table III show that an organometallic salt is an .efficient photocuring agent for the combination free radical and epoxy polymerization.
-4~- 1340r158 More quantitative information on the relative activity of different initiators was obtained from a series of nmr triaJ.s carried out to measure the degree of conversion i:rom monomer to polymer. The results of these trials are presented in Table IV. The trial which produced the results in Table Iv was carried out in the following manner: A 1,~1, w/w, mixture of methyl acrylate/cyc:lohexeneoxide was prepared. To a S.Og sample of this mixi:ure was added 0.046g of the desired cationic orgnaometal:Lic salt and/or 0.030g of diphenyliodonium hexafluorophosphate. In a small vial was placed lg of the sample and it was purged with nitrogen for 1 min before and continually during irradiation. The light source was two 15 watt G.E. blacklite bulbs. Irradiation time was 4 minutes. Immediately after completion of the photolysis, the nmr was taken in DCD13. The amount of polymerization was determined by the ratio of the peak intensity of the polymer to 'that of polymer plus monomer.
mrar a Ttf Percent Conversion to Polymer from NMR Study°
Catalyst System E ox Acrylate (eta5-cyclo~pentadienyl)dicarbonyl- 26% 28%
tripheny:lphosphineiron(1+) hexafluoroarsenate (eta5-cyclo~pentadienyl)dicarbonyl- 35% 36%
tripheny.lphosphineiron(1+) hexafluoroarsenate/IODONIUM (comparative) IODONIUM (c~~mparative) 22% 27%
Nmrs taken on a 400 MHz instrument T:he data in Table IV show that the organometallic salt is a useful photoinitiation system for the combination of~free radical and epoxy polymerization.
1340l1~$
,r. -41-L~VTMDf T. C.
This example demonstrates the simultaneous photocuring of two-part polyurethanes and acrylates using different initiators.
A stock solution was prepared containing 1.5 parts hexane diisocyanate (Aldrich Chemical Co., Milwaukee, Wisconsin), 3.5g polyethylene glycol) (CarbowaxR 400, Union Carbide, Danbury, Connecticut, molecular weight 400), and 5 parts distilled methyl acrylate (Aldrich). Four samples were prepared from l.lg stock solution and initiator combination shown in TABLE V below. Sample 1 was left in the dark at room temperature. Samples 2, 3, and 4 were placed in a water bath at 73 + 1°C, and irradiated with a Kodalc CarouselTM Projector containing a 360 nm cutoff filter for 5.0 minutes. The samples were left in the water b~~th in the dark for an additional 2.0 minutes, then analyzed for percent conversion of monomer to polymer by 400 MHz '~H nmr. The results are listed in Table V
below.
TABLE V
Dual Cure of Urethane and Acryl ate Co_ mpo:5ition Percent Conversion fromNMR
Study Sample No. Photocata_lyst (weight %) Urethane Acrylate 1 None (0%) (comparative) ~ 0% 0%
2 IODONIUM (1%) (comparative) 0% 2%
3 (eta~5-mesitylene)(eta5-cyclopenta- 94% 54%
di~enyl)iron(1+) he:xafluorophosphate (1%)/
IO;DONIUM (1%) (comparative) 4 (eta'S-mesitylene)(eta5-cyclopenta- 76% 32%
dienyl)iron(1+) hexafluorophosphate (1%) The data of TABLE V show that the organometallic salt is an efficient curing agent for combination free radical and polyurethane precursor compositions.
._ -42- 1340~1~~
A stock solution was prepared from 2 parts hexane diisocyanatE~, 3.5 parts polyethylene glycol) (molecular weight 400),, 5 parts methyl acrylate, and 0.3 parts hydroxyethy:l acrylate (Aldrich Chemical Co.). To 3.0 g aliquots waes added sufficient photocatalyst to reach the concentration shown in TABLE Vi. Samples were placed in an open vial in a water bath maintained at 70~2°C and irradiated using a Kodak Carousel projector containing a 360 nm cuto:Ef filter at a distance of 16 cm. At 1 minute intervals a:Liquots (1/4 ml) of the irradiated sample were added to 1/:Z ml chloroform With stirring. The gel time was the earliest time at which the aliquot failed to dissolve in the chloroform, and is recorded in TABLE VI.
mnnr ~ vT
Gel times for Dual Curing Systems Catalyst (wt. %) Gel Time (eta6-mesit;~lene)(etas-cyclopentadienyl)- 7 min iron(+) lhexafluorophosphate (1%)/IODONIUM
( 1% ) ( comlparative ) (eta6-mesit;ylene)(etas-cyclopentadienyl- 9 min iron(+) lhexafluorophosphate (1%) IODONIUM (1%)(comparative) >20 min (eta5-cyclo;pentadienyl)dicarbonyl-~ 4-5 min triphenylphosphineiron(+) hexafluorophosphate (1%)/IODONIUM (1%) (comparative) (etas-cyclo;pentadienyl)dicarbonyl- 10 min triphenylphosphineiron(+) hexafluorophosphate (1%) The data of TABLE VI show that the organometallic salt is a useful curing agent for combination free radical and polyurethane precursor compositions.
.~ -43- 1340r158 V<~rious modifications and alterations of this invention wall become apparent to those skilled in the art without departing from the scope and spirit of this invention, ~~nd it should be understood that this invention is not to be unduly limited to the illustrative embodiments set forth herein.
also useful are blocked polyisocyanates, which are known in the art and are commercially available, wherein the blocking group can be, for example, phenol, _ epsilon-caprolactam, hydroxamic acid ester, ketoxime, t-butyl acet:oacetate, and others described in Z.W. Wicks, Jr., "Progress in Organic Coatings", 9 pp. 3-28 (1981).
-28- 1340"l ~~
Suitable compounds containing at least 2 isocyanate-reactive hydrogen atoms can be high or low molecular weight compounds, having a weight average molecular weight, generally from about 50 to 50,000. In addition to compounds containing amino groups, thiol groups or carboxyl groups, are, preferably, compounds containing hydroxyl gr~~ups, particularly compounds containing from about 2 to 50 hydroxyl groups and above all, compounds having a weight average molecular weight of from about 500 to 25000, preferably from about 700 to 2000, for example, polyesters, polyethers, polythioethers, polyacetals, polycarbonates, poly(meth)acrylates, and polyester amides, containing ~~t least 2, generally from about 2 to 8, but preferably :from about 2 to 4 hydroxyl groups, or even hydroxyl-containing prepolymers of these compounds and a less than e~3uivalent quantity of polyisocyanate, of the type known :for the production of polyurethanes.
lZepresentatives of the above-mentioned compounds used in accordance with the present invention are described, :for example, in High Polymers, Vol. XVI, "Polyurethanes, Chemistry and Technology", By Saunders and Frisch, Interscience Publishers, New York/London, and Vol.
I, 1962, pales 32 to 42 and pages 44 to 54 and Vol. II, 1964, pages 5-6 and 198-199, and in "Kunststoff-Handbuch", Vol. VII, V:ieweg-Hochtlen, Carl-HanserVerlag, Munich, 1966, for example,, on pages 45 to 71. It is, of course, possible to use mixtures of the above-mentioned compounds containing at least two isoc;yanate-reactive hydrogen atoms and having a molecular weight of from about 50 to 50,000 for example, mixtures of polyethers and polyesters.
7Cn some cases, it is particularly advantageous to combine 7Low-melting and high-melting polyhydroxyl containing compounds with one another (German Offenlegungsschrift No. 2,706,297).
how molecular weight compounds containing at least two isocyanate-reactive hydrogen atoms (molecular weight from about 50 to 400) suitable for use in accordance with the present invention are compounds preferably containing hydroxyl groups and generally containing from about 2 to 8, preferably from about 2 to 4 isocyanate-reactive hydrogen atoms. It is also possible to use mixtures of different compounds containing at least two isocyanate-reactive hydrogen atoms and having a molecular weight in t:he range of from about 50 to 400. Examples of such compounds are ethylene glycol, 1,2- and 1,3-propylene glycol, 1,4~- and 2,3-butylene glycol, 1,5-pentane diol, 1,6-hexane diol, 1,8-octane diol, neopentyl glycol, 1,4-bis-hydroxymethyl cyclohexane, 2-methyl-1,3-propane diol, dibromobutene diol (U. S. Patent No. 3,723,392), glycerol, trimethylolpropane, 1,2,6-hexanetriol, trimethylol~~thane, pentaerythritol, quinitol, mannitol, sorbitol, d.iethylene glycol, triethylene glycol, tetraethylene glycol, higher polyethylene glycols, dipropylene glycol, higher polypropylene glycols, dibutylene ~31yco1, higher polybutylene glycols, 4,4'-dihydroxy diphenyl propane and dihydroxy methyl hydroquinone.
Other polyols suitable for the purposes of the present invention are the mixtures of hydroxy aldehydes and hydroxy ketones ("formose") or the polyhydric alcohols obtained therefrom by reduction ("formitol") which are formed in the autocondensation of formaldehyde hydrate in the presence of metal compounds as catalysts and compounds capable of enediol formation as co-catalysts (German Offenlegungsschrift Nos. 2,639,084, 2,714,084, 2,714,104, 2,721,186, x,738,154 and 2,738,512). Solutions of polyisocyanate polyaddition products, particularly solutions of polyurethane ureas containing ionic groups and/or solui:ions of polyhydrazodicarbonamides, in low molecular wESight polyhydric alcohols may also be used as the polyol component in accordance with the present invention ((serman Offenlegungsschrift No. 2,638,759).
Many other compounds containing isocyanate-reactive hydrogen atoms and polyisocyanates are useful in the present invention, and are obvious to those skilled in the art of polyurethane science and technology.
_ -30- 1340~1~8 Epoxy compounds that can be cured or polymerized by the curing agents of this invention, using the latter in a catalytically effective amount, are those known to undergo cationic polymerization and include 1,2-, 1,3-, and 1,4-cyclic ethers (also designated as 1,2-, 1,3-, and 1,4-epoxides). The 1,2-cyclic ethers are preferred.
'The cyclic ethers which can be polymerized in accordance 'with this invention include those described in "Ring-Opening Polymerizations", Vol. 2, by Frisch and Reegan, Marvel Dekker, Inc. (1969). Suitable 1,2-cyclic ethers are the monomeric and polymeric types of epoxides.
They can be aliphatic, cycloaliphatic, aromatic, or heterocycli~~ and will typically have an epoxy equivalency of from 1 to 6, preferably 1 to 3. Particularly useful are the aliphatic, cycloaliphatic, and glycidyl ether type 1,2-epoxide;s such as propylene oxide, epichlorohydrin, styrene oxide, vinylcyclohexene oxide, cyclohexeneoxide, vinylcyclohexene dioxide, glycidol, butadiene oxide, glycidyl methacrylate, diglycidyl ether of bisphenol A, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-6--methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate, bis(3,4-epo:cy-6-methylcyclohexylmethyl)adipate, dicyclopentadiene dioxide, epoxidized polybutadiene, 1,4-butaned:iol diglycidyl ether, polyglycidyl ether of phenolforma:Ldehyde resole or novolak resin, resorcinol diglycidyl Ether, and epoxy silicones, e.g., dimethylsiloxanes having cycloaliphatic epoxide or glycidyl ether groups.
~~ wide variety of commercial epoxy resins are available and listed in "Handbook of Epoxy Resins" by Lee and Neville,, McGraw Hill Book Company, New York (1967) and in "Epoxy Resin Technology" by P. F. Bruins, John Wiley &
Sons, New York (1968). Representative of the 1,3- and 1,4-cyclic ethers which can be polymerized in accordance with this invention are oxetane, _ 3,3-bis(chloromethyl)oxetane, and tetrahydrofuran.
In particular, cyclic ethers which are readily available include propylene oxide, oxetane, epichlorohydrin, tetrahydrofuran, styrene oxide, cyclohexeneoxide, vinylcyclohexene oxide, qlycidol, glycidyl methacrylate, octylene oxide, phenyl g7_ycidyl ether, 1,2-butane oxide, digylcidyl ether of bisphenol A (e.g., "Epon*828" and "DER*331"), vinylcyclohe~;ene dioxide (e. g., "ERL*-4206"), 3,4-epoxycyclohexylmethyl-3,~!-epoxycyclohexanecarboxylate (e. g.,"ERL-4221"), 3,4-epoxy-6-methylcyclohexanecarboxylate (e. g.,"ERL-4201"), bis(3,4-epoxy-6-methylcyclohexylmethyl) adipate (e. g.,"ERL-4289"), aliphatic epoxy modified with polypropylene glycol (e.g., "ERL-4050" and "ERL-4052"), dipentene dioxide (e. g., "ERL-4269"), epoxidized polybutadiene (e. g., "Oxiron 2001"), silicone epoxy (e. g. "Syl-Kem*90"), 1,4-butanediol diglycid.yl ether (e. g., Araldite*RD-2), polyglycidyl ether of phenolformaldehyde novolak (e. g., "DER-431", "Epi-Rez*521" and "DER-438"), resorcinol diglycidyl ether (e. g., "Kopoxite*"), polyglycol diepoxide (e.g., "DER 736"), polyacrylate epoxid.e (e. g., "Epocryl*U-14"), urethane modified epoxide (e. g., "QX*3599"), polyfunctional flexible epoxides (e.g., "Flexibilizer*151"), and mixtures thereof as well as mixtures thereof with co--curatives, curing agents, or hardeners which also are well known (see Lee and Neville and Bruins, supra). Representative of the co-curatives of hardeners which can be used are acid anhydrides such as nadic methyl anhydride, cyclopentanetetraca.rboxy7_ic dianhyrdride, pyromellitic anhydride, cis-1,2-cyclohexanedicarboxylic anhydride, and mixtures thereof.
Where etr.ylenic:ally-unsaturated compounds are used in combination with ar. epoxy monomer or a polyurethane precursor, the polymerizable c:omponE:nts can be present in any proportion, prferably 0.1:99 to 99.9:Ø1, more preferably 1:99 to 99:1, most preferably 2:98 to 98:2 parts by weight.
*Trade-mark 7:n general, radiation-induced polymerization of ethylenical7.y-unsaturated monomers, optionally in combination with polyurethane precursors or epoxy monomers with latent curing agents comprising an organometallic salt can be carried out at room temperature for the majority of energy curable compositions, although low temperature (e.g., -10°c:) or elevated temperature (e.g., 30 to 400°C, preferably 50 to 300°C) can be used to subdue the exotherm of polymerisation or to accelerate the polymerization, respectively. Temperature of polymerization and amount of catalyst wi:il vary and be dependent on the particular curable composition used and the desired application of the polymerized or cured product. The amount of curing agent to be used :in this invention should be sufficient to effect polymerization of the monomers or precursors (i.e., a catalytical:iy-effective amount) under the desired use conditions. Such amount generally will be in the range of about 0.01 to 20 weight percent, and preferably 0.1 to 10.0 weight percent, based on the weight of curable composition.
Solvents, preferably organic, can be used to assist in dissolution of the curing agent in the ethylenical:iy-unsaturated monomer, or in the combination of ethylenical:Ly-unsaturated monomers) and polyurethane precursors or with epoxy monomers, and as a processing aid.
Representative solvents include acetone, methyl ethyl ketone, cyc:lopentanone, methyl cellosolve acetate, methylene clnloride, nitromethane, methyl formate, acetonitrile, gamma-butyrolactone, and 1,2-dimethoxyethane (glyme). In some applications, it may be advantageous to adsorb the ~~uring agents onto an inert support such as silica, alu~nina, clays, etc., as described in U.S. Patent No. 4,677,137.
For those compositions of the invention which are radiati~cn-sensitive, i.e., any source of radiation including accelerated particles (e. g. electron beam radiation) .and radiation sources emitting active radiation in the ultraviolet and visible region of the spectrum (e. g., about 200 to 800 nm) can be used. Suitable sources _33- 13~0~1~8 of radiation include mercury vapor discharge lamps, carbon arcs, tungsi~en lamps, xenon lamps, lasers, sunlight, etc.
The required amount of exposure to effect polymerization is dependent upon such factors as the identity and concentrations of the organometallic salt, the particular ethylenical:iy unsaturated monomer, polyurethane precursors, or epoxy monomers, the thickness of the exposed material, type of sub;~trate, intensity of the radiation source and amount of heat associated with the radiation.
optionally, it is within the scope of this invention t« include photosensitizers or photoaccelerators in the radiation-sensitive compositions. Use of photosensit:izers or photoaccelerators alters the wavelength sensitivity of radiation-sensitive compositions employing the latent catalysts of this invention. This is particularl~,~ advantageous when the latent catalyst does not strongly absorb the incident radiation. Use of a photosensit:izer or photoaccelerator increases the radiation sensitivity, allowing shorter exposure times and/or use of less powerful sources of radiation. Any photosensitizer or photoaccele:rator may be useful if its triplet energy is at least 45 ki:Localories per mole. Examples of such photosensit:izers are given in Table 2-1 of the reference, Steven L. Murov, Handbook of Photochemistry, Marcel Dekker Inc., NY, 2'7-35 (1973), and include pyrene, fluoranthrene, xanthone, tlaioxanthone, benzophenone, acetophenone, benzil, benzoin and ethers of benzoin, chrysene, p-terphenyl, acenaphthene, naphthalene, phenanthrene, biphenyl, substituted derivatives of the preceding compounds, and the like. When present, the amount of photosensitizer or photoaccele:rator used in the practice of the present invention i;s generally in the range of 0.01 to 10 parts, and preferably 0.1 to 1.0 parts, by weight of photosensit:izer or photoaccelerator per part of organometal:iic salt.
'thermal polymerization using direct heating or infrared electromagnetic radiation, as is known in the art, can be used to cure the compositions according to the teachings o:E this invention.
-34- 1340"l~~
7:t is Yaithin the scope of this invention to include two--stage polymerization (curing), by first activating t:he curing agent by irradiating the curable compositions and subsequently thermally curing the activated precursors so obtained, the irradiation temperature being below the temperature employed for the subsequent heat-curing. The activated precursors may normally be cured at temperatures which are substantially lower than i:hose required for the direct thermal curing, with an advantage in some cases in the range from 50 to 110°C. This two-stage curing also makes it possible to control the polymerization in a particularly simple and advantageous manner.
~~djuvants such as solvents, pigments, abrasive granules, stabilizers, light stabilizers, antioxidants, flow agents,, bodying agents, flatting agents, colorants, inert fillers, binders, blowing agents, fungicides, bacteriocides, surfactants, plasticizers, and other additives as known to those skilled in the art can be added to the compositions of this invention. These can be added in an amouni~ effective for their intended purpose.
Compositions of this invention are useful for coatings, foams, shaped articles, adhesives, filled or reinforced composites, abrasives, caulking and sealing compounds, casting and molding compounds, potting and encapsulated compounds, impregnating and coating compounds, and other applications which are known to those skilled in the art.
Compositions of this invention may be applied, preferably ~~s a liquid, to a substrate such as steel, aluminum, copper, cadmium, zinc, ceramic, glass, paper, wood, or various plastic films such as polyethylene terephthalate), plasticized poly(vinylchloride), poly(propylene), poly(ethylene), and the like, and irradiated. By polymerizing part of the coating, as by irradiation through a mask, those sections which have not been exposed may be washed with a solvent to remove the unpolymerized portions while leaving the photopolymerized, .~34Q~1~8 insoluble portions in place. Thus, compositions of this invention may be 'used in the production of articles useful in the graphic arts such as printing plates and printed circuits. r2ethods of producing printing plates and printed circuits from photopolymerizing compositions are well known in the art i;see for example British Patent Specification No. 1, 495, 7~~6 ) .
t)bjects and advantages of this invention are further illustrated by the following examples, but the particular materials and amounts thereof recited in these examples, as well as other conditions and details, should not be consi:.rued to unduly limit this invention. In the examples, a:Ll parts are parts by weight unless indicated otherwise. All examples were prepared in ambient atmosphere (in the presence of oxygen and water vapor) unless indicated otherwise.
cunHror.~ 1 'this example demonstrates the simultaneous curing of ethylenically unsaturated and epoxy monomers in a crosslinkab:le system. The curable composition consisted of methyl acry:late, cyclohexene oxide and glycidyl acrylate.
If only epo:Ky (comparative) or acrylate cure were initiated, then this system produced a soluble polymer. If both epoxy ~~nd acrylate cure were initiated then a crosslinked insoluble polymer was produced.
Sample preparations were carried out under subdued lights (below the level necessary to initiate polymerization). The polymerizable mixture consisted of 1.0 g glycidyl acrylate, 5.0 g methyl acrylate and 5.0 g cyclohexene oxide. In all cases there was added to the polymerizable compositions 0.1 g of the desired organometallic salt. A 3 g portion of the composition was placed in a glass vial and irradiated between two 15 watt G.E. daylig:ht fluorescent bulbs using an Ultraviolet Products lamp holder (lamp separation distance 4 cm). The sample was ;purged with nitrogen for one minute preceding and continuously during photolysis. The irradiation time required to produce a polymer insoluble in chloroform was recorded, a;nd is noted in Table I.
-36- 1340r1 ~8 Alternatively, these compositions can be cured thermally or in a two-stage process.
TABLE I
Simultaneous Photoinitiation of Free Radical and Epoxy Cure in a Crosslinkable System Cure Compound Time ( etas -mesit~tlene ) ( eta5 -cyclopentadienyl )- 70 iron(1+) hexafluorophosphate (eta6-mesitlrlene)(etas-cyclopentadienyl)- 35 iron(1+) hexafluoroantimonate (eta6-naphthalene)(eta5-cyclopentadienyl)- 90 iron(1+) hexafluorophosphateb (eta6-naphthalene)(eta5-cyclopentadienyl)- 40 iron(1+) hexafluoroantimonate (eta6-1,2,3,4,4a,9a-(9-cinnamylidenefluorene))- 340 (eta5-cyclopentadienyl)iron(1+) hexafluorophosphate (eta5-cyclo~~entadienyl)dicarbonyl- 600 tripheny:lphosphineiron(1+) hexafluorophosphate (etas-cyclo~pentadienyl)dicarbonyl- 600 tripheny;lphosphineiron(1+) hexafluoroarsenate (etas-cyclo~pentadienyl)dicarbonyl- 95 tripheny:larsineiron(1+) hexafluoroarsenate (etas-cyclo~pentadienyl)dicarbonyl- 160 triphenylarsineiron(1+) hexafluoroantimonate (eta5-cyclo;pentadienyl)dicarbonyl- 120 triphenylstibineiron(1+) hexafluoroantimonate -37- 134U'l58 a Time in :>econds to produce insoluble crosslinked system.
Diphenyliodonium hexafluorophosphate (comparative) alone under these conditions did not produce a crosslinked system ai:ter 20 minutes of irradiation.
b 0.2 g of gamma-butyrolactone added to completely solubilize this compound.
CYnMDT.F 7 Curing trials using cationic organometallic salts as photoinit~iators for free radical were conducted in the following manner: exposures were made on a hot plate to keep the temperature constant. The light source was a 275 watt Sylvan:ia sunlamp positioned 10 cm above the sample.
For free radical polymerization, a stock solution was prepared from of 0.1 g cationic organometallic salt, 2 g gamma-butyrolactone, 10 g of pentaerythritol tetraacrylate.
Approximately 0.2 g of this curable composition was placed in an aluminum pan and the time to produce a hard cure was recorded at the specified temperature. The trials were conducted in air. The results of these trials are presented in Table II.
-38- 1340~1~8 mnnr.F Tr Acrylate Cure Times Cure Catalyst System Time' Temperature (eta6-mesit!Tlene)(eta5-cyclopentadienyl)- 60 53C
iron(1+) hexafluoroantimonate (eta6-mesit~,~lene)(eta5-cyclopentadienyl)- 60 53C
iron(1+) hexafluorophosphate (etas-cyclopentadienyl)dicarbonyl- 60 53C
tripheny:Lphosphineiron(1+) hexafluo:roantimonate (eta6-mesit;~lene)(eta5-cyclopentadienyl)- 20 78C
iron(1+) hexafluoroantimonate (etas-mesit:~rlene)(etas-cyclopentadienyl)- 20 78C
iron(1+) hexafluorophosphate (eta5-cyclo~pentadienyl)dicarbonyl- 20 78C
tripheny:lphosphineiron(1+) hexafluoroantimonate (eta6-mesit;Ylene)(eta5-cyclopentadienyl)- 15 102C
iron(1+) hexafluoroantimonate (eta6-mesit;Ylene)(eta5-cyclopentadienyl)- 15 102C
iron(1+) hexafluorophosphate (eta5-cyclo~pentadienyl)dicarbonyl- 15 102C
tripheny.lphosphineiron(1+) hexafluoroantimonate Cure time in seconds T;he data of TABLE II show that organometallic salts are efficient photoinitiators of free radical polymerization.
More quantitative information on the relative activity of 1) organometallic salt and 2) the combination organometallic salt and onium salt (comparative) and 3) onium salt (comparative) as initiator was obtained from a series of nmr trials carried out to measure the degree of .~ -39- 1340r~58 conversion from monomer to polymer. The results of these trials are F~resented in Table III. The trial which produced then results in Table IiI was carried out in the following manner: A 1/1, w/w, mixture of methyl acrylate/cyc:lohexene oxide was prepared. To a lOg sample of this mixture was added O.lg of the desired cationic organometalT.ic salt and/or O.lg of diphenyliodonium hexafluorophosphate. In a small vial was placed 2g of the sample and it was purged with nitrogen for 1 min before and continually during irradiation. The light source was two watt Syl~rania daylight fluorescent bulbs. irradiation time was 3 minutes. immediately after completion of the photolysis, the nmr was taken in CDC13. The amount of polymerization was determined by the ratio of the peak 15 intensity oiE the polymer to that of polymer plus monomer.
mrar c' TTr Percent Conversion to Polymer from NMR Study' _Catalyst System Epoxy Acrylate (etas-mesit7Tlene)(etas-cyclopentadienyl)- 97.5% 58.5%
iron(1+) hexafluoroantimonate (eta6-mesit~Tlene)(etas-cyclopentadienyl)- 53.5% 47.3%
iron(1+) hexafluoroantimonate/IODONIUMb ( comparative ) (eta6-mesit:~lene)(eta5-cyclopentadienyl)- 47.7% 41.8%
iron(1+) hexafluorophosphate (etas-mesit;~rlene)(eta5-cyclopentadienyl)- 47.6% 49.1%
iron(1+) hexafluorophosphate/IODONIUM
( comparative ) IODONIUM (comparative) <0.5% 5.3%
Nmrs to ken on a 400 MHz instrument '' IODONIUM in all Examples is diphenyliodonium hexafluorophosphate Tlhe data in Table III show that an organometallic salt is an .efficient photocuring agent for the combination free radical and epoxy polymerization.
-4~- 1340r158 More quantitative information on the relative activity of different initiators was obtained from a series of nmr triaJ.s carried out to measure the degree of conversion i:rom monomer to polymer. The results of these trials are presented in Table IV. The trial which produced the results in Table Iv was carried out in the following manner: A 1,~1, w/w, mixture of methyl acrylate/cyc:lohexeneoxide was prepared. To a S.Og sample of this mixi:ure was added 0.046g of the desired cationic orgnaometal:Lic salt and/or 0.030g of diphenyliodonium hexafluorophosphate. In a small vial was placed lg of the sample and it was purged with nitrogen for 1 min before and continually during irradiation. The light source was two 15 watt G.E. blacklite bulbs. Irradiation time was 4 minutes. Immediately after completion of the photolysis, the nmr was taken in DCD13. The amount of polymerization was determined by the ratio of the peak intensity of the polymer to 'that of polymer plus monomer.
mrar a Ttf Percent Conversion to Polymer from NMR Study°
Catalyst System E ox Acrylate (eta5-cyclo~pentadienyl)dicarbonyl- 26% 28%
tripheny:lphosphineiron(1+) hexafluoroarsenate (eta5-cyclo~pentadienyl)dicarbonyl- 35% 36%
tripheny.lphosphineiron(1+) hexafluoroarsenate/IODONIUM (comparative) IODONIUM (c~~mparative) 22% 27%
Nmrs taken on a 400 MHz instrument T:he data in Table IV show that the organometallic salt is a useful photoinitiation system for the combination of~free radical and epoxy polymerization.
1340l1~$
,r. -41-L~VTMDf T. C.
This example demonstrates the simultaneous photocuring of two-part polyurethanes and acrylates using different initiators.
A stock solution was prepared containing 1.5 parts hexane diisocyanate (Aldrich Chemical Co., Milwaukee, Wisconsin), 3.5g polyethylene glycol) (CarbowaxR 400, Union Carbide, Danbury, Connecticut, molecular weight 400), and 5 parts distilled methyl acrylate (Aldrich). Four samples were prepared from l.lg stock solution and initiator combination shown in TABLE V below. Sample 1 was left in the dark at room temperature. Samples 2, 3, and 4 were placed in a water bath at 73 + 1°C, and irradiated with a Kodalc CarouselTM Projector containing a 360 nm cutoff filter for 5.0 minutes. The samples were left in the water b~~th in the dark for an additional 2.0 minutes, then analyzed for percent conversion of monomer to polymer by 400 MHz '~H nmr. The results are listed in Table V
below.
TABLE V
Dual Cure of Urethane and Acryl ate Co_ mpo:5ition Percent Conversion fromNMR
Study Sample No. Photocata_lyst (weight %) Urethane Acrylate 1 None (0%) (comparative) ~ 0% 0%
2 IODONIUM (1%) (comparative) 0% 2%
3 (eta~5-mesitylene)(eta5-cyclopenta- 94% 54%
di~enyl)iron(1+) he:xafluorophosphate (1%)/
IO;DONIUM (1%) (comparative) 4 (eta'S-mesitylene)(eta5-cyclopenta- 76% 32%
dienyl)iron(1+) hexafluorophosphate (1%) The data of TABLE V show that the organometallic salt is an efficient curing agent for combination free radical and polyurethane precursor compositions.
._ -42- 1340~1~~
A stock solution was prepared from 2 parts hexane diisocyanatE~, 3.5 parts polyethylene glycol) (molecular weight 400),, 5 parts methyl acrylate, and 0.3 parts hydroxyethy:l acrylate (Aldrich Chemical Co.). To 3.0 g aliquots waes added sufficient photocatalyst to reach the concentration shown in TABLE Vi. Samples were placed in an open vial in a water bath maintained at 70~2°C and irradiated using a Kodak Carousel projector containing a 360 nm cuto:Ef filter at a distance of 16 cm. At 1 minute intervals a:Liquots (1/4 ml) of the irradiated sample were added to 1/:Z ml chloroform With stirring. The gel time was the earliest time at which the aliquot failed to dissolve in the chloroform, and is recorded in TABLE VI.
mnnr ~ vT
Gel times for Dual Curing Systems Catalyst (wt. %) Gel Time (eta6-mesit;~lene)(etas-cyclopentadienyl)- 7 min iron(+) lhexafluorophosphate (1%)/IODONIUM
( 1% ) ( comlparative ) (eta6-mesit;ylene)(etas-cyclopentadienyl- 9 min iron(+) lhexafluorophosphate (1%) IODONIUM (1%)(comparative) >20 min (eta5-cyclo;pentadienyl)dicarbonyl-~ 4-5 min triphenylphosphineiron(+) hexafluorophosphate (1%)/IODONIUM (1%) (comparative) (etas-cyclo;pentadienyl)dicarbonyl- 10 min triphenylphosphineiron(+) hexafluorophosphate (1%) The data of TABLE VI show that the organometallic salt is a useful curing agent for combination free radical and polyurethane precursor compositions.
.~ -43- 1340r158 V<~rious modifications and alterations of this invention wall become apparent to those skilled in the art without departing from the scope and spirit of this invention, ~~nd it should be understood that this invention is not to be unduly limited to the illustrative embodiments set forth herein.
Claims (10)
1. A polymerizable composition comprising a polymeric precursor comprising an. admixture of (a) at least one monomer or oligomer polymerizable by free radicals selected from acrylates, methacrylates, acrylamides, methacrylamides, and vinyl compounds, and polyurethane precursors comprising an admixture of at least one di- or polyisocyanate and at least one compound bearing at least two isocyanate-reactive hydrogen atoms, or (b) at least one monomer or oligomer polymerizable by free radicals selected from acrylates, methacrylates, acrylamides, meth,acrylamides, and vinyl compounds, and at least one epoxy-containing monomer, and a single-component curing agent capable of effect ing simultaneous initiation of said admixture consisting essentially of an organometallic salt, wherein said organometallic salt has the formula:
L((L1)(L2)M)b(L3)(L4)+e X f wherein M represents the same or different metals selected from the elements of Periodic Groups IVB, VB, VIB, VIIB, and VIII, with the proviso that Formula I can represent an organometallic salt having a mono- or bimetallic cation;
L1 represents none, 1, 2, or 3 ligands contributing pi-electrons that can be the same or different ligand selected from substituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic aromatic and heterocyclic aromatic compounds, each capable of contributing two to twelve pi-electrons to the valence shell of M;
L2 represents none or 1 to 6 ligands contributing an even number of sigma-electrons that can be the same or different selected from mono-, di-, and tri-dentate ligands, each contributing 2, 4, or 6 sigma-electrons to the valence shell of M;
L3 represents none, 1 or 2 bridging ligands contributing pi-electrons that can be the same or different ligand selected from substituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic aromatic and heterocyclic aromatic compounds, each capable of acting as a bridging ligand contributing 4 to 24 pi-electrons to the valence shells of two metal atoms simultaneously;
L4 represents none, 1, 2 or 3 bridging ligands contributing an even number of sigma-electrons that can be the same or different selected from mono-, di-, and tri-dentate ligands, each donating 2, 4, or 6 sigma-electrons to the valence shells of two M's simultaneously;
with the proviso that the total electronic charge contributed to M by the ligands L1, L2, L3 and L4 plus the product of ionic charge on M with b results in a residual net positive charge of a to the cation;
b is an integer having a value of 1 or 2;
e is an integer having a value of 1 or 2, the residual electrical charge of the cation;
X is an anion selected from organic sulfonate anions and halogen-containing complex anions of a metal of metalloid;
f is an integer of 1 or 2, the number of anions required to neutralize the charge a on the cation;
said composition being free of an oxidizing agent.
L((L1)(L2)M)b(L3)(L4)+e X f wherein M represents the same or different metals selected from the elements of Periodic Groups IVB, VB, VIB, VIIB, and VIII, with the proviso that Formula I can represent an organometallic salt having a mono- or bimetallic cation;
L1 represents none, 1, 2, or 3 ligands contributing pi-electrons that can be the same or different ligand selected from substituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic aromatic and heterocyclic aromatic compounds, each capable of contributing two to twelve pi-electrons to the valence shell of M;
L2 represents none or 1 to 6 ligands contributing an even number of sigma-electrons that can be the same or different selected from mono-, di-, and tri-dentate ligands, each contributing 2, 4, or 6 sigma-electrons to the valence shell of M;
L3 represents none, 1 or 2 bridging ligands contributing pi-electrons that can be the same or different ligand selected from substituted and unsubstituted acyclic and cyclic unsaturated compounds and groups and substituted and unsubstituted carbocyclic aromatic and heterocyclic aromatic compounds, each capable of acting as a bridging ligand contributing 4 to 24 pi-electrons to the valence shells of two metal atoms simultaneously;
L4 represents none, 1, 2 or 3 bridging ligands contributing an even number of sigma-electrons that can be the same or different selected from mono-, di-, and tri-dentate ligands, each donating 2, 4, or 6 sigma-electrons to the valence shells of two M's simultaneously;
with the proviso that the total electronic charge contributed to M by the ligands L1, L2, L3 and L4 plus the product of ionic charge on M with b results in a residual net positive charge of a to the cation;
b is an integer having a value of 1 or 2;
e is an integer having a value of 1 or 2, the residual electrical charge of the cation;
X is an anion selected from organic sulfonate anions and halogen-containing complex anions of a metal of metalloid;
f is an integer of 1 or 2, the number of anions required to neutralize the charge a on the cation;
said composition being free of an oxidizing agent.
2. The polymerizable composition according to claim 1 wherein the polymeric precursor comprises a) polyurethane precursors, and b) at least one ethylenically-unsaturated monomer other than a polyurethane precursor.
3. The polymerizable composition according to claim 1 wherein the polymeric precursor comprises a) an epoxy-containing monomer, and b) at least one ethylenically-unsaturated monomer other than an epoxy-containing monomer.
4. The composition according to any one of claims 1 to 3 wherein said organometallic salt is selected from (eta6-mesitylene)(eta5cyclopentadienyl)-iron(1+) hexafluoroantimonate, (eta6-mesitylene) (eta5cyclopentadienyl)iron(1+)hexafluorophosphate, (eta6-naphthalene)(eta5cyclopentadienyl)iron(1+)hexafluoro-antimonate, (eta6-naphthalene)(eta5cyclopentadienyl)iron(1+) hexafluorophosphate, (eta5cyclopentadienyl) dicarbonyltriphenylphosphineiron(1+) hexafluorophosphate, and (eta5-cydopentadienyl)dicarbonyl-triphenylphosphineiron(1+) hexafluoroantimonate.
5. The composition according to any one of claims 1 to 4 which has been subjected to sufficient energy to effect polymerization and provide a cured composition.
6. A shaped article or a layered structure comprising the composition according to any one of claims 1 to 5.
7. An article comprising a substate having on at least one surface thereof a layer of the composition according to any one of claims 1 to 5 the polymerizable composition being a protective coating or an adhesive layer.
8. A method for preparing the polymerized composition according to claim 5 comprising the steps of a) providing the polymerizable composition according to any one of claims 1 to 4, and b) allowing said admixture to polymerize or adding energy to said admixture, in the form of at least one of electromagnetic radiation, accelerated particles, and thermal energy, to effect polymerization.
9. An abrasive article or a binder for a magnetic medium comprising the composition according to any one of claims 1 to 5.
10. The abrasive article or binder for a magnetic medium according to claim 9 further comprising an effective amount of a photosensitizer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US20105888A | 1988-06-01 | 1988-06-01 | |
| US07/201,058 | 1988-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1340758C true CA1340758C (en) | 1999-09-21 |
Family
ID=22744307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000597247A Expired - Fee Related CA1340758C (en) | 1988-06-01 | 1989-04-20 | Energy curable compositions: single component curing agents |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0344911B1 (en) |
| JP (1) | JPH0220509A (en) |
| KR (1) | KR0144577B1 (en) |
| CA (1) | CA1340758C (en) |
| DE (1) | DE68928290T2 (en) |
| ES (1) | ES2104561T3 (en) |
| ZA (1) | ZA894116B (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991016387A1 (en) * | 1990-04-23 | 1991-10-31 | Minnesota Mining And Manufacturing Company | Energy curable cationically and free-radically polymerizable pressure-sensitive compositions |
| US5102924A (en) * | 1990-08-16 | 1992-04-07 | Minnesota Mining And Manufacturing Company | Polymeric mixtures and process therefor |
| US5238744A (en) * | 1990-08-16 | 1993-08-24 | Minnesota Mining And Manufacturing Company | Tough polymeric mixtures |
| CA2048232A1 (en) * | 1990-09-05 | 1992-03-06 | Jerry W. Williams | Energy curable pressure-sensitive compositions |
| DE69131158T2 (en) * | 1990-11-22 | 1999-12-16 | Canon K.K., Tokio/Tokyo | Volume phase hologram containing photosensitive recording medium and method for producing a volume phase hologram with this medium |
| JP2873126B2 (en) * | 1991-04-17 | 1999-03-24 | 日本ペイント株式会社 | Photosensitive composition for volume hologram recording |
| DE4207258A1 (en) * | 1992-03-07 | 1993-09-09 | Ruetgerswerke Ag | ABRASIVE |
| US5212210A (en) * | 1992-03-18 | 1993-05-18 | Minnesota Mining And Manufacturing Company | Energy curable compositions having improved cure speeds |
| US5744557A (en) * | 1993-06-16 | 1998-04-28 | Minnesota Mining And Manufacturing Company | Energy-curable cyanate/ethylenically unsaturated compositions |
| US5856022A (en) * | 1994-06-15 | 1999-01-05 | Minnesota Mining And Manufacturing Company | Energy-curable cyanate/ethylenically unsaturated compositions |
| WO1997013183A1 (en) * | 1995-10-06 | 1997-04-10 | Polaroid Corporation | Holographic medium and process |
| US7713604B2 (en) | 2002-06-17 | 2010-05-11 | 3M Innovative Properties Company | Curable adhesive articles having topographical features therein |
| FR2904321B1 (en) * | 2006-07-25 | 2008-09-05 | Rhodia Recherches Et Technologies Sas | POLYMERIZABLE AND / OR CROSS-LINKABLE COMPOSITION UNDER CATIONIC AND / OR RADICAL IRRADIATION |
| CN118055960A (en) | 2021-10-27 | 2024-05-17 | Sika技术股份公司 | (Meth) acrylate compounds as reactive diluents for polyaddition systems |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3369398D1 (en) * | 1982-05-19 | 1987-02-26 | Ciba Geigy Ag | Curable compositions containing metallocen complexes, activated primers obtained therefrom and their use |
| US5089536A (en) * | 1982-11-22 | 1992-02-18 | Minnesota Mining And Manufacturing Company | Energy polmerizable compositions containing organometallic initiators |
| US5073476A (en) * | 1983-05-18 | 1991-12-17 | Ciba-Geigy Corporation | Curable composition and the use thereof |
| US4677137A (en) * | 1985-05-31 | 1987-06-30 | Minnesota Mining And Manufacturing Company | Supported photoinitiator |
| DE3774004D1 (en) * | 1986-06-17 | 1991-11-28 | Ciba Geigy Ag | METHOD FOR CURING POLYURETHANE PAINTS. |
| US4861806A (en) * | 1986-09-19 | 1989-08-29 | Ciba-Geigy Corporation | Process for curing polyisocyanate coatings in the presence of a ferrocenium compound |
-
1989
- 1989-04-20 CA CA000597247A patent/CA1340758C/en not_active Expired - Fee Related
- 1989-04-28 EP EP89304318A patent/EP0344911B1/en not_active Expired - Lifetime
- 1989-04-28 ES ES89304318T patent/ES2104561T3/en not_active Expired - Lifetime
- 1989-04-28 DE DE68928290T patent/DE68928290T2/en not_active Expired - Fee Related
- 1989-05-23 JP JP1129960A patent/JPH0220509A/en active Pending
- 1989-05-30 ZA ZA894116A patent/ZA894116B/en unknown
- 1989-06-01 KR KR1019890007501A patent/KR0144577B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE68928290D1 (en) | 1997-10-09 |
| KR910000967A (en) | 1991-01-30 |
| KR0144577B1 (en) | 1998-07-01 |
| DE68928290T2 (en) | 1998-02-26 |
| JPH0220509A (en) | 1990-01-24 |
| EP0344911B1 (en) | 1997-09-03 |
| AU619822B2 (en) | 1992-02-06 |
| EP0344911A2 (en) | 1989-12-06 |
| ES2104561T3 (en) | 1997-10-16 |
| AU3304089A (en) | 1989-12-07 |
| EP0344911A3 (en) | 1991-01-23 |
| ZA894116B (en) | 1991-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4985340A (en) | Energy curable compositions: two component curing agents | |
| CA1333949C (en) | Energy-induced dual curable compositions | |
| US4952612A (en) | Energy-induced curable compositions | |
| US5086086A (en) | Energy-induced curable compositions | |
| US5147900A (en) | Energy-induced dual curable compositions | |
| EP0306188B1 (en) | Energy polymerizable polyurethane precursors | |
| KR0180534B1 (en) | Energy curable cations and free-radically polymerizable pressure sensitive compositions | |
| CA1340758C (en) | Energy curable compositions: single component curing agents | |
| US4507458A (en) | Urethane acrylate compositions | |
| US5462797A (en) | Energy curable pressure-sensitive adhesive compositions | |
| AU620892B2 (en) | Energy-curable cyanate compositions | |
| US5212210A (en) | Energy curable compositions having improved cure speeds | |
| HK1008035B (en) | Energy-curable cyanate compositions |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |