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CN104051368A - 指纹识别芯片封装结构和封装方法 - Google Patents

指纹识别芯片封装结构和封装方法 Download PDF

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Publication number
CN104051368A
CN104051368A CN201410310106.1A CN201410310106A CN104051368A CN 104051368 A CN104051368 A CN 104051368A CN 201410310106 A CN201410310106 A CN 201410310106A CN 104051368 A CN104051368 A CN 104051368A
Authority
CN
China
Prior art keywords
chip
induction
plastic packaging
packaging layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410310106.1A
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English (en)
Inventor
王之奇
喻琼
王蔚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Wafer Level CSP Co Ltd
Original Assignee
China Wafer Level CSP Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Wafer Level CSP Co Ltd filed Critical China Wafer Level CSP Co Ltd
Priority to CN201410310106.1A priority Critical patent/CN104051368A/zh
Publication of CN104051368A publication Critical patent/CN104051368A/zh
Priority to TW104120854A priority patent/TWI567881B/zh
Priority to KR1020177001840A priority patent/KR101878695B1/ko
Priority to US15/322,080 priority patent/US10108837B2/en
Priority to PCT/CN2015/082717 priority patent/WO2016000598A1/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1365—Matching; Classification
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
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    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1365—Matching; Classification
    • G06V40/1376—Matching features related to ridge properties or fingerprint texture
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Abstract

一种指纹识别芯片封装结构和封装方法，封装结构包括：基板；耦合于基板表面的感应芯片，所述感应芯片具有第一表面、以及与第一表面相对的第二表面，所述感应芯片的第一表面具有感应区，所述感应芯片的第二表面位于基板表面；位于基板和感应芯片表面的塑封层，所述塑封层覆盖于感应芯片的感应区表面，且位于感应区表面的部分塑封层具有预设厚度，所述塑封层的材料为聚合物。所述封装结构能对感应芯片灵敏度的要求降低，应用更广泛。

Description

指纹识别芯片封装结构和封装方法
技术领域
本发明涉及半导体制造技术领域，尤其涉及一种指纹识别芯片封装结构和封装方法。
背景技术
随着现代社会的进步，个人身份识别以及个人信息安全的重要性逐步受到人们的关注。由于人体指纹具有唯一性和不变性，使得指纹识别技术具有安全性好，可靠性高，使用简单方便的特点，使得指纹识别技术被广泛应用于保护个人信息安全的各种领域。而随着科学技术的不断发展，各类电子产品的信息安全问题始终是技术发展的关注要点之一。尤其是对于移动终端，例如手机、笔记本电脑、平板的电脑、数码相机等，对于信息安全性的需求更为突出。
现有的指纹识别器件的感测方式包括电容式(电场式)和电感式，指纹识别器件通过提取用户指纹，并将用户指纹转换为电信号输出，从而获取用户的指纹信息。具体的，如图1所示，图1是现有技术的一种指纹识别器件的剖面结构示意图，包括：基板100；耦合于基板100表面的指纹识别芯片101；覆盖于所述指纹识别芯片101表面的玻璃基板102。
以电容式指纹识别芯片为例，所述指纹识别芯片101内具有一个或多个电容极板。由于用户手指的表皮或皮下层具有凸起的脊和凹陷的谷，当用户手指103接触所述玻璃基板102表面时，所述脊与谷到指纹识别芯片101的距离不同，因此，用户手指103脊或谷与电容极板之间的电容值不同，而指纹识别芯片101能够获取所述不同的电容值，并将其转化为相应的电信号输出，而指纹识别器件汇总所受到的电信号之后，能够获取用户的指纹信息。
然而，在现有的指纹识别器件中，对指纹识别芯片的灵敏度要求较高，使得指纹识别器件的制造及应用受到限制。
发明内容
本发明解决的问题是提供一种指纹识别芯片封装结构和封装方法，所述封装结构能对感应芯片灵敏度的要求降低，应用更广泛。
为解决上述问题，本发明提供一种指纹识别芯片封装结构，包括：基板；耦合于基板表面的感应芯片，所述感应芯片具有第一表面、以及与第一表面相对的第二表面，所述感应芯片的第一表面具有感应区，所述感应芯片的第二表面位于基板表面；位于基板和感应芯片表面的塑封层，所述塑封层覆盖于感应芯片的感应区表面，位于感应区上的塑封层表面平坦，且位于感应区表面的部分塑封层具有预设厚度，所述塑封层的材料为聚合物。
可选的，所述塑封层位于感应区表面的预设厚度为20微米～100微米。
可选的，所述预设厚度的公差范围在-10％～+10％以内。
可选的，所述塑封层的莫氏硬度大于或等于8H；所述塑封层的介电常数大于或等于7。
可选的，所述塑封层的材料包括：环氧树脂、聚酰亚胺树脂、苯并环丁烯树脂、聚苯并恶唑树脂、聚对苯二甲酸丁二酯、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烃、聚氨酯、聚烯烃、聚醚砜、聚酰胺、聚亚氨酯、乙烯-醋酸乙烯共聚物或聚乙烯醇。
可选的，所述感应芯片的第一表面还包括：包围所述感应区的外围区。
可选的，所述感应芯片还包括：位于所述外围区内的边缘凹槽，所述感应芯片的侧壁暴露出所述凹槽；位于感应芯片外围区的芯片电路，所述芯片电路位于感应芯片的外围区表面、以及凹槽的侧壁和底部表面，且位于凹槽底部具有第一连接端，所述芯片电路与第一连接端连接。
可选的，所述边缘凹槽为包围感应区的连续凹槽；或者，所述边缘凹槽为包围感应区的若干分立凹槽。
可选的，所述基板具有第一表面，所述感应芯片耦合于基板的第一表面，所述基板的第一表面具有第二连接端。
可选的，还包括：导电线，所述导电线两端分别与第一连接端与第二连接端连接。
可选的，还包括：位于感应芯片侧壁表面、基板第一表面、以及边缘凹槽内的导电层，所述导电层两端分别与第一连接端和第二连接端连接。
可选的，还包括：位于感应芯片和基板之间的第一粘结层。
可选的，所述感应芯片还包括：贯穿所述感应芯片的导电插塞，所述感应芯片的第二表面暴露出所述导电插塞，所述导电插塞的一端与第一连接端连接；位于感应芯片第二表面暴露出的导电插塞顶部的焊料层，所述焊料层焊接于第二连接端表面。
可选的，还包括：位于基板表面的保护环，所述保护环包围所述感应芯片和塑封层。
可选的，所述保护环的材料为金属；所述保护环通过所述基板接地。
可选的，还包括：包围所述塑封层、感应芯片和保护环的外壳，所述外壳暴露出感应区表面的塑封层，所述塑封层的颜色与所述外壳的颜色一致。
可选的，还包括：包围所述塑封层和感应芯片的外壳，所述外壳暴露出感应区表面的塑封层，所述塑封层的颜色与所述外壳的颜色一致。
可选的，所述基板为硬性基板或软性基板；所述基板的一端具有连接部，所述连接部用于使感应芯片与外部电路电连接。
相应的，本发明提供一种形成上述任一项结构的封装方法，包括：提供基板；在基板表面耦合感应芯片，所述感应芯片具有第一表面、以及与第一表面相对的第二表面，所述感应芯片的第一表面具有感应区，所述感应芯片的第二表面位于基板表面；在基板和感应芯片表面形成塑封层，所述塑封层覆盖于感应芯片的感应区表面，形成于感应区上的塑封层表面平坦，且位于感应区表面的部分塑封层具有预设厚度。
可选的，所述塑封层的形成工艺为注塑工艺、转塑工艺或丝网印刷工艺。
与现有技术相比，本发明的技术方案具有以下优点：
本发明的封装结构中，所述感应芯片的第二表面耦合于基板表面，所述感应芯片的第一表面具有感应区，所述感应区用于提取用户指纹。位于基板和感应芯片表面的塑封层覆盖于所述感应芯片的感应区表面，位于感应区表面的塑封层能够保护所述感应区。当用户的手指置于感应区上的塑封层表面时，能够使感应区提取到用户指纹，而感应芯片能够将所述用户指纹转换为电信号输出。由于所述塑封层的材料为聚合物，而聚合物材料具有较好的延展性和柔韧性，而且覆盖能力好，因此，所述能够使塑封层的厚度较薄，而且硬度较高，从而使所述塑封层具有足够大的硬度以保护感应芯片；同时，所述塑封层表面到感应芯片的距离减小，使感应芯片易于检测到用户指纹，相应地，所述封装结构能够降低对感应芯片灵敏度的要求，使得指纹识别芯片的封装结构的应用更为广泛。
而且，所述塑封层的材料为聚合物，采用所述塑封层保护感应区能够降低了封装结构的制造成本。此外，所述塑封层还位于基板和感应芯片除感应区以外的区域表面，所述塑封层用于封装所述感应芯片，将所述感应芯片固定于基板表面，同时所述塑封层还能够保护感应区，用于直接与用户手指接触，因此所述指纹识别芯片封装结构简单。
进一步，位于感应区表面的部分塑封层的预设厚度为20微米～100微米，所述塑封层的莫氏硬度大于或等于8H。虽然位于感应区表面的塑封层厚度较薄，然而所述塑封层的硬度较大，使得所述塑封层足以保护所述感应区免受损伤，同时，使得感应区易于检测到接触塑封层表面的用户指纹，降低了对感应芯片灵敏度的要求。
进一步，所述塑封层的介电常数大于或等于7，所述塑封层的介电常数较大，使所述塑封层的电隔离性能更佳，使所述塑封层对感应区的保护能力更佳，即使位于感应区表面的塑封层厚度较薄，也能够使用户手指与感应区之间构成的电容值处于能够被检测的较大范围内。
进一步，所述基板表面还具有包围所述感应芯片和塑封层的保护环。所述保护环用于对所述感应芯片进行静电防护，避免感应区检测到的用户指纹数据精确度下降；所述保护环还能够消除感应芯片输出的信号噪声，使感应芯片检测到的数据、以及输出的信号更精确。
本发明的封装方法中，所述感应芯片的第一表面具有用于提取用户指纹的感应区，在基板和感应芯片表面形成的塑封层之后，所述塑封层还覆盖于感应区表面，所述塑封层用于保护感应芯片的感应区，当用户手指置于感应区上的塑封层表面时，即能够进行指纹检测。所述塑封层用于封装所述感应芯片，使感应芯片固定于基板表面。由于所述塑封层的材料为聚合物，而聚合物材料具有较好的延展性和柔韧性，且覆盖能力佳，能够使形成于感应区表面的塑封层厚度薄、且硬度高，因此，所形成的塑封层具有足够大的硬度以保护感应芯片；而且，所述塑封层表面到感应芯片的距离减小，使感应区更易获取用户指纹数据，所形成的封装结构对感应芯片灵敏度的要求降低，所述封装方法的使用范围更广泛。而且，由于所述塑封层在封装感应芯片的同时，能够保护感应区，使得封装感应芯片的方法得以简化。此外，所述塑封层的材料为聚合物，形成所述塑封层的成本低，进而降低了制造所述封装结构的成本。
附图说明
图1是现有技术的一种指纹识别器件的剖面结构示意图；
图2至图6是本发明实施例的指纹识别芯片的封装结构的示意图；
图7至图10是本发明实施例的一种指纹识别芯片的封装方法的剖面结构示意图。
具体实施方式
如背景技术所述，在现有的指纹识别器件中，对指纹识别芯片的灵敏度要求较高，使得指纹识别器件的制造及应用受到限制。
经过研究发现，请继续参考图1，指纹识别芯片101表面覆盖有玻璃基板102，所述玻璃基板102用于保护指纹识别芯片101，而用户的手指103直接与所述玻璃基板102相接触，因此，为了保证所述玻璃基板102具有足够的保护能力，所述玻璃基板102的厚度较厚。然而，由于所述玻璃基板102的厚度较厚，因此要求指纹识别芯片101具有较高的灵敏度，以保证能够精确提取到用户指纹。然而，高灵敏度的指纹识别芯片制造难度较大、制造成本较高，继而造成指纹识别芯片的应用和推广受到限制。
具体的，继续以电容式指纹识别器件为例，当用户手指置103于玻璃基板102表面时，用户手指103、与指纹识别芯片101中的电容极板之间能够构成电容；其中，所述用户手指103和电容极板为电容的两极，所述玻璃基板102为电容两极之间的电介质。然而，由于所述玻璃基板102的厚度较厚，使得用户手指103与电容基板之间的电容值较大，而用户手指103的脊与谷之间的高度差异较小，因此，所述脊与电容极板之间的电容值、相对于所述谷与电容极板之间的电容值之间的差值极小，为了能够精确检测到所述电容值的差异，要求所述指纹识别芯片101具有较高的灵敏度。
为了解决上述问题，本发明提出一种指纹识别芯片的封装结构和封装方法。其中，所述封装结构中，感应芯片的感应区表面覆盖有塑封层，所述感应区表面的塑封层替代了传统的玻璃基板，能够直接与用户手指接触，用于保护感应芯片。由于所述塑封层的材料为聚合物，而聚合物材料具有较好的延展性和柔韧性，能够使所述塑封层的厚度较薄且硬度较高，在所述塑封层足以保护感应芯片的同时，使所述塑封层表面到感应芯片的距离减小，从而使感应芯片易于检测到用户指纹；相应地，所述封装结构降低了对感应芯片灵敏度的要求，使得指纹识别芯片的封装结构的应用更为广泛。
为使本发明的上述目的、特征和优点能够更为明显易懂，下面结合附图对本发明的具体实施例做详细的说明。
图2至图6是本发明实施例的指纹识别芯片的封装结构的示意图。
请参考图2，所述指纹识别芯片的封装结构包括：
基板200；
耦合于基板200表面的感应芯片201，所述感应芯片201具有第一表面210、以及与第一表面210相对的第二表面220，所述感应芯片201的第一表面210具有感应区211，所述感应芯片201的第二表面220位于基板200表面；
位于基板200和感应芯片201表面的塑封层203，所述塑封层203覆盖于感应芯片201的感应区211表面，位于感应区211上的塑封层203表面平坦，且位于感应区211表面的部分塑封层203具有预设厚度，所述塑封层203的材料为聚合物。
以下将对上述指纹识别芯片的封装结构进行详细说明。
所述基板200用于固定所述感应芯片201，并使所述感应芯片201与其它器件或电路电连接。所述基板200为硬性基板或软性基板，能够根据需要设置所述感应芯片201的器件或终端进行调整；在本实施例中，所述基板200为硬性基板，所述硬性基板为PCB基板、玻璃基板、金属基板、半导体基板或聚合物基板。
所述基板200具有第一表面230，而所述感应芯片201耦合于基板200的第一表面230。所述基板200的第一表面230具有布线层(未示出)，而所述布线层与位于基板200第一表面230的第二连接端205连接，所述第二连接端205用于与感应芯片201表面的芯片电路连接。
本实施例中，所述基板200的一端具有连接部204，所述连接部204的材料包括导电材料，连接部204与所述布线层电连接，从而使所述芯片电路能够通过基板200第一表面230的布线层和连接部204与外部电路或器件电连接，从而实现电信号的传输。
位于感应芯片201第一表面210的感应区211用于检测和接收用户的指纹信息，所述感应区211内能够具有电容结构、或者具有电感结构，所述电容结构或电感结构能够用于获取用户指纹信息。
在本实施例中，所述感应区211内具有至少一个电容极板，当用户手指置于感应区211上的塑封层203表面时，所述电容极板、塑封层203和用户手指构成电容结构，而所述感应区211能够获取用户手指表面脊与谷与电容极板之间的电容值差异，并将所述电容值差异通过芯片电路进行处理之后输出，以此获取用户指纹数据。
所述感应芯片201的第一表面210还包括包围所述感应区211的外围区212，所述感应芯片201第一表面210的外围区212具有芯片电路(未标示)，所述芯片电路与感应区211内的电容结构或电感结构电连接，用于对电容结构或电感结构输出的电信号进行处理。
所述感应芯片201还包括：位于所述外围区212内具有边缘凹槽206，所述感应芯片201的侧壁暴露出所述凹槽206；位于感应芯片201外围区212的芯片电路还位于所述凹槽206的侧壁和底部表面，且位于凹槽206底部具有第一连接端207，所述芯片电路延伸到所述凹槽206内，并且与所述第一连接端207连接。
所述边缘凹槽206，用于形成芯片电路的输出端，即所述第一连接端207，通过将第一连接端207与基板200表面的第二连接端205电连接，能够实现感应芯片201与基板200的耦合。
在一实施例中，所述边缘凹槽206为包围感应区211的连续凹槽，所述连续的边缘凹槽206底部表面具有一个或若干第一连接端207；在另一实施例中，所述边缘凹槽206为包围感应区211的若干分立凹槽，且每一边缘凹槽206内具有一个或若干第一连接端207。所述第一连接端207的数量和分布状态根据芯片电路的具体电路布线需要设计。
在本实施例中，所述边缘沟槽206的侧壁相对于感应芯片201的表面倾斜，且所述边缘沟槽206的侧壁与底部之间的夹角呈钝角，所述倾斜的边缘沟槽206侧壁表面易于形成芯片电路，以此感应区211到第一连接端207之间的电路布线。
所述塑封层203位于基板200表面，并且包围所述感应芯片201，用于将感应芯片固定于基板200表面，并且用于保护并隔离所述感应芯片201。而且，所述塑封层203还位于感应芯片201的感应区211表面，使得所述塑封层203用于保护所述感应区211，且用户的手指能够直接与所述感应区211表面的塑封层203相接触。由于所述塑封层203用于保护并固定感应芯片201的同时，能够保护感应芯片201的感应区211，并且能够与用户手指直接接触，因此，使得本实施例的指纹识别芯片的封装结构简单，能够减少制造成本。
所述塑封层203的材料为聚合物材料，所述聚合物材料具有良好的柔韧性、延展性以及覆盖能力，能够使位于感应区211表面的塑封层203厚度较薄，从而增强了感应芯片201对用户手指指纹的感应能力。同时，通过选择和调整所述聚合物材料的种类，能够使位于感应区211表面的塑封层203具有较高的硬度，从而保证了塑封层203对感应区211具有足够的保护能力。
位于感应区211表面的塑封层203的预设厚度为20微米～100微米，所述预设厚度较薄，当用户手指置于所述感应区211上的塑封层203表面，所述手指到感应区211的距离较小，因此，感应区211更容易检测到用户手指的指纹，从而降低了对感应芯片201高灵敏度的要求。
而且，所述预设厚度的公差需要控制在-10％～+10％的范围内，以保证位于感应区211表面的塑封层203厚度均匀，继而保证了对用户手指指纹进行检测的结果精确。
在本实施例中，所述感应区211内具有电容极板，由于位于感应区211表面的塑封层203的厚度较薄，当用户手指置于感应区211上的塑封层203表面时，用户手指到电容极板的距离较短，则用户手指与电容极板之间的电容值较小；相应的，用户手指表面的脊(凸起)与电容基板之间的电容值、相对于谷(凹陷)与电容基板之间的电容值差异较大，因此，所述感应区211易于检测到用户手指的指纹信息。
而且，所述预设厚度的公差在-10％～+10％以内，使得位于感应区211表面的塑封层203厚度均匀，当检测用户手指的指纹信息时，能够杜绝因塑封层203厚度差异引起用户手指与电容基板之间的电容值发生偏差，从而使用户指纹的检测结果更为准确。
所述塑封层203的莫氏硬度大于或等于8H，所述塑封层203的硬度较高，即使位于感应区211表面的塑封层203厚度较薄，所述塑封层203也足以保护感应芯片201的感应区211，当用户手指在所述感应区211上的塑封层203表面移动时，不会对感应芯片201造成损伤。而且，由于所述塑封层203的硬度较高，因此所述塑封层203难以发生形变，即使用户手指按压与所述塑封层203表面，所述塑封层203的厚度也难以发生变化，从而保证了感应区211的检测结果精确度。
所述塑封层203的介电常数大于或等于7，所述塑封层203的电隔离能力较强，位于感应区211表面的塑封层203对所述感应区211的保护能力较强。
在本实施例中，位于感应区211表面的塑封层203厚度较薄，而用户手指与电容极板之间的电容值与所述塑封层203的厚度成反比，与塑封层203的介电常数成正比，因此，当感应区211表面的塑封层203厚度较薄、且介电常数较大时，用户手指与电容极板之间的电容值处于感应区211能够检测到的范围内，避免电容值过大或过小而使感应区211的感应失效。
而且，感应区211表面的塑封层203厚度在20微米～100微米范围内、介电常数在大于或等于7的范围内，则塑封层203所选取的材料介电常数越大，位于感应区211表面的塑封层203的厚度也应相应增大，以便使用户手指与电容极板之间的电容值能够在一个稳定且感应区211可检测的范围内。
所述塑封层203的材料为环氧树脂、聚酰亚胺树脂、苯并环丁烯树脂、聚苯并恶唑树脂、聚对苯二甲酸丁二酯、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烃、聚氨酯、聚烯烃、聚醚砜、聚酰胺、聚亚氨酯、乙烯-醋酸乙烯共聚物、聚乙烯醇或其他合适的聚合物材料。
在本实施例中，指纹识别芯片封装结构还包括：导电线208，所述导电线208两端分别与第一连接端207与第二连接端205连接，从而使芯片电路与基板200表面的布线层电连接，而所述布线层与连接部204电连接，从而使感应芯片201表面的芯片电路和感应区211能够与外部电路或器件进行电信号的传输。所述导电线208的材料为金属，所述金属为铜、钨、铝、金或银。
由于本实施例中，第一连接端207和第二连接端205之间通过导电线208连接，因此所述指纹识别芯片的封装结构还包括：位于感应芯片201和基板200之间的第一粘结层301，用于将感应芯片201固定于基板200的第一表面230。
在本实施例中，所述指纹识别芯片的封装结构还包括：位于基板200表面的保护环209，所述保护环209包围所述感应芯片20和塑封层203。所述保护环209的材料为金属，且所述保护环209通过所述基板200接地，所述保护环209固定于基板200的第一表面230。
在本实施例中，所述保护环209位于感应芯片201和塑封层203周围，覆盖于部分塑封层203上方，且暴露出感应区211表面的塑封层203。在另一实施例中，保护环仅位于感应芯片201和塑封层203的周围，且暴露出塑封层203的表面。
所述保护环209的材料为金属，所述金属为铜、钨、铝、银或金。所述保护环209用于对所述感应芯片进行静电防护，由于所述保护环209为金属，所述保护环209能够导电，当用户手指在接触塑封层203时产生静电，则静电电荷会首先自所述保护环209传至基板200，从而避免塑封层203被过大的静电电压击穿，以此保护感应芯片201，提高指纹检测的精确度，消除感应芯片输出的信号噪声，使感应芯片输出的信号更精确。
在一实施例中，请参考图3，指纹识别芯片的封装结构还包括：位于感应芯片201侧壁表面、基板200第一表面210、以及边缘凹槽206内的导电层303，所述导电层303两端分别与第一连接端207和第二连接端205连接，以实现感应区211和芯片电路与基板200表面布线层之间的电连接。所述指纹识别芯片的封装结构还包括：位于感应芯片201和基板200之间的第一粘结层301。
在另一实施例中，请参考图4，所述感应芯片201内还具有贯穿所述感应芯片201的导电插塞304，所述感应芯片201的第二表面220暴露出所述导电插塞304，所述导电插塞304的一端与第一连接端207连接；位于感应芯片201第二表面220暴露出的导电插塞304顶部的焊料层305，所述焊料层305焊接于第二连接端205表面，使实现感应区211和芯片电路、与基板200表面布线层之间电连接。由于所述感应芯片201通过焊料层305焊接于基板200第一表面230，使所述感应芯片201相对于基板200固定。
在本实施例中，请参考图5，所述指纹识别芯片的封装结构还包括：包围所述塑封层203、感应芯片201和保护环209的外壳400，所述外壳400暴露出所述感应区211上的塑封层203表面，使用户手指能够触碰到所述感应区211表面的塑封层203，以进行指纹检测。所述塑封层203的颜色与所述外壳400的颜色一致，例如当外壳400颜色为黑色时，所述塑封层203的颜色为黑色，当外壳400颜色为白色时，所述塑封层203颜色为白色，使得指纹识别芯片的封装结构整体美观协调。
在另一实施例中，请参考图6，所述指纹识别芯片的封装结构不包括上述保护环209，所述指纹识别芯片的封装结构包括：包围所述塑封层203和感应芯片201的外壳，所述外壳400暴露出感应区211表面的塑封层203，所述塑封层203的颜色与所述外壳400的颜色一致。
本实施例中，所述感应芯片的第二表面耦合于基板表面，所述感应芯片的第一表面具有感应区，所述感应区用于提取用户指纹。位于基板和感应芯片表面的塑封层覆盖于所述感应芯片的感应区表面，位于感应区表面的塑封层能够保护所述感应区。当用户的手指置于感应区上的塑封层表面时，能够使感应区提取到用户指纹，而感应芯片能够将所述用户指纹转换为电信号输出。由于所述塑封层的材料为聚合物，而聚合物材料具有较好的延展性和柔韧性，而且覆盖能力好，因此，所述能够使塑封层的厚度较薄，而且硬度较高，从而使所述塑封层具有足够大的硬度以保护感应芯片；同时，所述塑封层表面到感应芯片的距离减小，使感应芯片易于检测到用户指纹，相应地，所述封装结构能够降低对感应芯片灵敏度的要求，使得指纹识别芯片的封装结构的应用更为广泛。而且，所述塑封层的材料为聚合物，采用所述塑封层保护感应区能够降低了封装结构的制造成本。此外，所述塑封层还位于基板和感应芯片除感应区以外的区域表面，所述塑封层用于封装所述感应芯片，将所述感应芯片固定于基板表面，同时所述塑封层还能够保护感应区，用于直接与用户手指接触，因此所述指纹识别芯片封装结构简单。
相应的，本发明实施例还提供一种形成上述指纹识别芯片封装结构的封装方法，如图7至图10所示。
请参考图7，提供基板200。
所述基板200为硬性基板或软性基板，能够根据需要设置所述感应芯片201的器件或终端进行调整；在本实施例中，所述基板200为硬性基板，所述硬性基板为PCB基板、玻璃基板、金属基板、半导体基板或聚合物基板。
所述基板200具有第一表面230，所述第一表面230用于耦合后续的感应芯片。在所述基板200的第一表面230形成布线层和第二连接端205，所述布线层与所述第二连接端205连接。
本实施例中，在基板200的一端形成连接部204，所述连接部204的材料包括导电材料，且所述布线层连接到所述连接部204，从而使布线层和第二连接端205能够与外部电路或器件电连接。
请参考图8，在所述基板200的第一表面230固定感应芯片201，所述感应芯片201具有第一表面210、以及与第一表面210相对的第二表面220，所述感应芯片201的第一表面210具有感应区211，所述感应芯片201的第二表面220位于基板200表面。
所述感应芯片201用于识别用户指纹。所述感应芯片201的感应区211用于感应用户的指纹信息，所述感应区211内能够具有电容结构、或者具有电感结构，用于检测并获取用户指纹信息，并转换为电信号输出。
在本实施例中，所述感应区211内形成有至少一个电容极板，当用户手指置于感应区211上的塑封层203表面时，所述电容极板、塑封层203和用户手指构成电容结构，而所述感应区211能够获取用户手指表面脊与谷与电容极板之间的电容值差异，并将所述电容值差异通过芯片电路进行处理之后输出，以此获取用户指纹数据。
所述感应芯片201还包括：包围所述感应区211的外围区212。在所述感应芯片201的外围区212内形成有边缘凹槽206，所述感应芯片201的侧壁暴露出所述凹槽206；在所述凹槽206底部形成第一连接端207；在感应芯片201的第一表面210形成芯片电路，且所述芯片电路延伸入所述凹槽206内，并且与第一连接端207连接，所述第一连接端207为芯片电路的输出端。
在一实施例中，所述边缘凹槽206为包围感应区211的连续凹槽，在所述连续的边缘凹槽206底部表面形成一个或若干第一连接端207。在另一实施例中，所述边缘凹槽206为包围感应区211的若干分立凹槽，且每一边缘凹槽206内形成有一个或若干第一连接端207。
在本实施例中，所述边缘沟槽206的侧壁相对于感应芯片201的表面倾斜，且所述边缘沟槽206的侧壁与底部之间的夹角呈钝角。在所述边缘沟槽206内形成芯片电路时，易于对形成于所述倾斜侧壁表面的芯片电路材料进行光刻和刻蚀工艺，以此形成芯片电路的布线。
本实施例中，所述感应芯片201通过第一粘结层301固定于基板200的第一表面230，后续通过导电线或导电层时第一连接端207与第二连接层205相连接。
在另一实施例中，请参考图4，在感应芯片201内形成贯穿所述感应芯片201的导电插塞304，所述感应芯片201的第二表面220暴露出所述导电插塞304，所述导电插塞304的一端与第一连接端207连接；在感应芯片201第二表面220暴露出的导电插塞304顶部的焊料层305；将所述焊料层305焊接于第二连接端205表面，使所述感应芯片201与基板200之间相互固定。
请参考图9，在将感应芯片201固定于基板200的第一表面210之后，使所述基板200与感应芯片201耦合。
在本实施例中，感应芯片201通过第一粘结层301固定于基板200表面，因此能够通过导电线或导电层时基板200与感应芯片201耦合。
在本实施例中，在所述基板200表面耦合感应芯片201的方法包括：提供导电线208；将所述导电线208两端通过焊接工艺分别与第一连接端207与第二连接端205连接。所述导电线208的材料为金属，所述金属为铜、钨、铝、金或银。
在另一实施例中，请参考图3，在所述基板200表面耦合感应芯片201的方法包括：在感应芯片201侧壁表面、基板200第一表面230、以及边缘凹槽206内的导电层303，所述导电层303两端分别与第一连接端207和第二连接端205连接。所述导电层303的形成工艺包括：以沉积工艺、电镀工艺或化学镀工艺形成导电膜；刻蚀部分所述导电膜以形成导电层303。所述导电层303的材料为金属，所述金属为铜、钨、铝、银、金、钛、钽、镍、氮化钛、氮化钽中的一种或多种。
请参考图10，在基板200和感应芯片201表面形成塑封层203，所述塑封层203覆盖于感应芯片201的感应区211表面，位于感应区211上的塑封层203表面平坦，且位于感应区211表面的部分塑封层203具有预设厚度。
所述塑封层203的材料为环氧树脂、聚酰亚胺树脂、苯并环丁烯树脂、聚苯并恶唑树脂、聚对苯二甲酸丁二酯、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烃、聚氨酯、聚烯烃、聚醚砜、聚酰胺、聚亚氨酯、乙烯-醋酸乙烯共聚物、聚乙烯醇或其他合适的聚合物材料。
所述塑封层203的形成工艺为注塑工艺(injection molding)、转塑工艺(transfer molding)或丝网印刷工艺。所述封料层400还可以采用其它合适的工艺形成。所述塑封层203形成于基板200表面，包围所述感应芯片201，并且覆盖于感应区211表面。所述塑封层203不仅用于将感应芯片固定于基板200表面，保护并隔离所述感应芯片201，还能够用于保护所述感应区211，且用户的手指能够直接与所述感应区211表面的塑封层203相接触。因此，形成本实施例的指纹识别芯片的封装结构的工艺简单，能够减少工艺时间和制造成本。
形成于感应区211表面的塑封层203的预设厚度为20微米～100微米，所述预设厚度较薄，当用户手指置于所述感应区211上的塑封层203表面，所述手指到感应区211的距离较小，因此，感应区211更容易检测到用户手指的指纹，从而降低了对感应芯片201高灵敏度的要求。而且，所述预设厚度的公差需要控制在-10％～+10％的范围内，以保证位于感应区211表面的塑封层203厚度均匀，继而保证了对用户手指指纹进行检测的结果精确。
所述塑封层203的莫氏硬度大于或等于8H。所述塑封层203的硬度较高，即使位于感应区211表面的塑封层203厚度较薄，所述塑封层203也足以保护感应芯片201的感应区211，当用户手指在所述感应区211上的塑封层203表面移动时，不会对感应芯片201造成损伤。
所述塑封层203的介电常数大于或等于7，所述塑封层203的电隔离能力较强，位于感应区211表面的塑封层203对所述感应区211的保护能力较强。
在本实施例中，在形成封装层203之后，还能够在基板200表面形成保护环209，所述保护环209包围所述感应芯片201和塑封层203。所述保护环209的材料为金属，所述保护环209通过所述基板200接地。所述保护环209的材料为金属，所述金属为铜、钨、铝、银或金。
本实施例中，形成于基板和感应芯片表面的塑封层用于封装所述感应芯片。由于所述塑封层的材料为聚合物，聚合物材料具有较好的延展性和柔韧性，且覆盖能力佳，能够使形成于感应区表面的塑封层厚度薄、且硬度高，所形成的塑封层具有足够大的硬度以保护感应芯片；而且，所述塑封层表面到感应芯片的距离减小，使感应区更易获取用户指纹数据，所形成的封装结构对感应芯片灵敏度的要求降低，所述封装方法的使用范围更广泛。而且，由于所述塑封层能够在封装感应芯片的同时保护感应区，使得封装感应芯片的方法得以简化。
虽然本发明披露如上，但本发明并非限定于此。任何本领域技术人员，在不脱离本发明的精神和范围内，均可作各种更动与修改，因此本发明的保护范围应当以权利要求所限定的范围为准。

Claims (20)

1.一种指纹识别芯片封装结构，其特征在于，包括：
基板；
耦合于基板表面的感应芯片，所述感应芯片具有第一表面、以及与第一表面相对的第二表面，所述感应芯片的第一表面具有感应区，所述感应芯片的第二表面位于基板表面；
位于基板和感应芯片表面的塑封层，所述塑封层覆盖于感应芯片的感应区表面，位于感应区上的塑封层表面平坦，且位于感应区表面的部分塑封层具有预设厚度，所述塑封层的材料为聚合物。
2.如权利要求1所述的指纹识别芯片封装结构，其特征在于，所述塑封层位于感应区表面的预设厚度为20微米～100微米。
3.如权利要求2所述的指纹识别芯片封装结构，其特征在于，所述预设厚度的公差范围在-10％～+10％以内。
4.如权利要求1所述的指纹识别芯片封装结构，其特征在于，所述塑封层的莫氏硬度大于或等于8H；所述塑封层的介电常数大于或等于7。
5.如权利要求4所述的指纹识别芯片封装结构，其特征在于，所述塑封层的材料包括：环氧树脂、聚酰亚胺树脂、苯并环丁烯树脂、聚苯并恶唑树脂、聚对苯二甲酸丁二酯、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烃、聚氨酯、聚烯烃、聚醚砜、聚酰胺、聚亚氨酯、乙烯-醋酸乙烯共聚物或聚乙烯醇。
6.如权利要求1所述的指纹识别芯片封装结构，其特征在于，所述感应芯片的第一表面还包括：包围所述感应区的外围区。
7.如权利要求6所述的指纹识别芯片封装结构，其特征在于，所述感应芯片还包括：位于所述外围区内的边缘凹槽，所述感应芯片的侧壁暴露出所述凹槽；位于感应芯片外围区的芯片电路，所述芯片电路位于感应芯片的外围区表面、以及凹槽的侧壁和底部表面，且位于凹槽底部具有第一连接端，所述芯片电路与第一连接端连接。
8.如权利要求7所述的指纹识别芯片封装结构，其特征在于，所述边缘凹槽为包围感应区的连续凹槽；或者，所述边缘凹槽为包围感应区的若干分立凹槽。
9.如权利要求7所述的指纹识别芯片封装结构，其特征在于，所述基板具有第一表面，所述感应芯片耦合于基板的第一表面，所述基板的第一表面具有第二连接端。
10.如权利要求9所述的指纹识别芯片封装结构，其特征在于，还包括：导电线，所述导电线两端分别与第一连接端与第二连接端连接。
11.如权利要求9所述的指纹识别芯片封装结构，其特征在于，还包括：位于感应芯片侧壁表面、基板第一表面、以及边缘凹槽内的导电层，所述导电层两端分别与第一连接端和第二连接端连接。
12.如权利要求10或11所述的指纹识别芯片封装结构，其特征在于，还包括：位于感应芯片和基板之间的第一粘结层。
13.如权利要求9所述的指纹识别芯片封装结构，其特征在于，所述感应芯片还包括：贯穿所述感应芯片的导电插塞，所述感应芯片的第二表面暴露出所述导电插塞，所述导电插塞的一端与第一连接端连接；位于感应芯片第二表面暴露出的导电插塞顶部的焊料层，所述焊料层焊接于第二连接端表面。
14.如权利要求1所述的指纹识别芯片封装结构，其特征在于，还包括：位于基板表面的保护环，所述保护环包围所述感应芯片和塑封层。
15.如权利要求14所述的指纹识别芯片封装结构，其特征在于，所述保护环的材料为金属；所述保护环通过所述基板接地。
16.如权利要求14所述的指纹识别芯片封装结构，其特征在于，还包括：包围所述塑封层、感应芯片和保护环的外壳，所述外壳暴露出感应区表面的塑封层，所述塑封层的颜色与所述外壳的颜色一致。
17.如权利要求1所述的指纹识别芯片封装结构，其特征在于，还包括：包围所述塑封层和感应芯片的外壳，所述外壳暴露出感应区表面的塑封层，所述塑封层的颜色与所述外壳的颜色一致。
18.如权利要求1所述的指纹识别芯片封装结构，其特征在于，所述基板为硬性基板或软性基板；所述基板的一端具有连接部，所述连接部用于使感应芯片与外部电路电连接。
19.一种形成如权利要求1至18任一项结构的封装方法，其特征在于，包括：
提供基板；
在基板表面耦合感应芯片，所述感应芯片具有第一表面、以及与第一表面相对的第二表面，所述感应芯片的第一表面具有感应区，所述感应芯片的第二表面位于基板表面；
在基板和感应芯片表面形成塑封层，所述塑封层覆盖于感应芯片的感应区表面，形成于感应区上的塑封层表面平坦，且位于感应区表面的部分塑封层具有预设厚度。
20.如权利要求19所述的指纹识别芯片封装方法，其特征在于，所述塑封层的形成工艺为注塑工艺、转塑工艺或丝网印刷工艺。
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