CN104096662B - Absorption type silicon chip is coated with turntable - Google Patents
Absorption type silicon chip is coated with turntable Download PDFInfo
- Publication number
- CN104096662B CN104096662B CN201410350810.XA CN201410350810A CN104096662B CN 104096662 B CN104096662 B CN 104096662B CN 201410350810 A CN201410350810 A CN 201410350810A CN 104096662 B CN104096662 B CN 104096662B
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- table top
- baffle plate
- opening
- absorption type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 33
- 239000010703 silicon Substances 0.000 title claims abstract description 33
- 238000010521 absorption reaction Methods 0.000 title claims abstract description 12
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009193 crawling Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- Coating Apparatus (AREA)
Abstract
A kind of absorption type silicon chip is coated with turntable, including table top, it is characterised in that be provided with the table top it is concentric, and stepped arranged radially annulus platform, at the edge of the table top, the opening that the oriented center of circle extends is set；The end of the opening is provided with the baffle plate contour with the annulus platform of most inner side, the two ends of the baffle plate are connected with the annulus platform of most inner side, set jagged on the baffle plate.The present invention by table top set annulus platform, solve the problems, such as operating personnel place silicon chip when with table top decentraction, mesa edge set opening facilitate silicon chip to take；Simple structure of the present invention, not only realizing can place the silicon chip of different-diameter, and cost is than clipping slewing bottom, and not allow fragile.
Description
Technical field
The present invention relates to silicon chip coating apparatus, specifically a kind of absorption type silicon chip coating turntable.
Background technology
At present, being coated with slewing in silicon chip processing coating process mainly has two kinds, and one kind is clipping, and it is provided with folder
Device is held, can be by silicon chip clamping on table top；Another kind is absorption type, and it includes table top, rotating shaft, motor, vavuum pump and opens
Close, table top is arranged on the top of rotating shaft, and in the through hole of central axial setting one of rotating shaft, the suction end of vavuum pump is connected to rotating shaft
On central through hole, motor rotates for drive shaft, and table top is circular flat, and table top is provided centrally with and the through hole phase in rotating shaft
Same through hole.Absorption type equipment when in use, silicon chip is placed on table top, presses switch, and motor and vavuum pump work simultaneously, silicon
Piece is attracted on table top, starts to rotate, and operating personnel are held with hand and speckle with the hairbrush of masking liquid and carry out coating to silicon chip.
But, due to not having positioner on the table top of absorption type equipment, and the diameter of table top is less than silicon chip diameter, because
This, operating personnel are difficult for silicon chip to be placed on the position concentric with table top, not only not square if silicon chip deviates larger with the table top center of circle
Just it is coated with, and crawling can be caused.
The content of the invention
For the shortcoming for overcoming above-mentioned prior art to exist, silicon chip is placed conveniently it is an object of the invention to provide one kind,
Ensure the silicon chip absorption type silicon chip coating turntable concentric with table top.
In order to solve the above problems, the present invention uses following technical scheme：A kind of absorption type silicon chip is coated with turntable, including
Table top, it is characterised in that be provided with the table top it is concentric, and stepped arranged radially annulus platform, in institute
The edge for stating table top sets the opening that the oriented center of circle extends.
Further, the end in the opening is provided with the baffle plate contour with the annulus platform of most inner side, the gear
The two ends of plate are connected with the annulus platform of most inner side, set jagged on the baffle plate.
Preferably, the opening includes symmetrically arranged four up and down.
The beneficial effects of the invention are as follows：It solves operating personnel and is placing silicon chip by setting annulus platform on table top
When with the problem of table top decentraction, opening is set in mesa edge and facilitates silicon chip to take；Simple structure of the present invention, not only realizes
The silicon chip of different-diameter, and cost can be placed than clipping slewing bottom, and do not allowed fragile.
Brief description of the drawings
The present invention is described further with reference to the accompanying drawings and examples：
Fig. 1 is the top view of table top of the present invention；
Fig. 2 be Fig. 1 in along line A-A sectional view.
In figure, 1 table top, 11 annulus platforms, 12 openings, 2 baffle plates, 21 breach.
Specific embodiment
As depicted in figs. 1 and 2, specific embodiment of the invention includes table top 1, is provided with the table top 1 same with it
The heart, and stepped arranged radially annulus platform 11, stepped is outwards to be incremented by from the center of circle, the height and silicon chip of annulus platform 11
Height be same as or slightly smaller than silicon chip highly, so, coating when, silicon chip edge also can uniform application.
Silicon chip being picked and placeed for convenience, the opening 12 that the oriented center of circle extends being set at the edge of the table top 1, opening 12 is half
Circular arc, it is preferred that the opening 12 includes two of setting symmetrical above and below and two be symmetrical set, such table top 1
Four blades are just divided into by opening 12, not only facilitate silicon chip to pick and place, and save material, reduce cost.
In order to produce bigger absorption affinity to silicon chip, it is necessary to the gap between opening 12 and annulus platform 11 be reduced, this reality
Apply in example, the end of the opening 12 is provided with the baffle plate 2 contour with the annulus platform 11 of most inner side, baffle plate 2 and opening
The arc of 12 ends is engaged, the two ends of the baffle plate 2 with most inner side the annulus platform 11 be connected, in order to prevent silicon chip with most
The annulus platform and baffle plate 2 of inner side form confined space, cause silicon chip to rupture in vacuum pump work, are set on the baffle plate 2
Jagged 21, so, portion gas can pass through from breach 21.
The above is the preferred embodiment of the present invention, for those skilled in the art,
Without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also regarded as this hair
Bright protection domain.
Claims (2)
1. a kind of absorption type silicon chip coating turntable, including table top, it is characterised in that be provided with the table top concentric
, and stepped arranged radially annulus platform, at the edge of the table top, the opening that the oriented center of circle extends is set；Opened described
The end of mouth is provided with the baffle plate contour with the annulus platform of most inner side, the most two ends of the baffle plate and the annulus of inner side
Platform is connected, and sets jagged on the baffle plate.
2. absorption type silicon chip according to claim 1 is coated with turntable, it is characterised in that the opening is included up and down
Symmetrically arranged four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410350810.XA CN104096662B (en) | 2014-07-23 | 2014-07-23 | Absorption type silicon chip is coated with turntable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410350810.XA CN104096662B (en) | 2014-07-23 | 2014-07-23 | Absorption type silicon chip is coated with turntable |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104096662A CN104096662A (en) | 2014-10-15 |
| CN104096662B true CN104096662B (en) | 2017-06-23 |
Family
ID=51665433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410350810.XA Active CN104096662B (en) | 2014-07-23 | 2014-07-23 | Absorption type silicon chip is coated with turntable |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104096662B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0483328A (en) * | 1990-07-26 | 1992-03-17 | Canon Inc | Wafer chuck |
| JP2003332409A (en) * | 2002-05-09 | 2003-11-21 | Nikon Corp | Substrate suction device |
| CN201989054U (en) * | 2010-12-10 | 2011-09-28 | 北京有色金属研究总院 | Vehicle suitable for sand blasting of multi-size wafers |
| CN202221515U (en) * | 2011-09-08 | 2012-05-16 | 合肥芯硕半导体有限公司 | Multi-zone vacuum chuck for direct-writing lithography machine |
| CN202725449U (en) * | 2012-06-28 | 2013-02-13 | 中国科学院苏州纳米技术与纳米仿生研究所 | Photoresist spinner for silicon wafer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100549954B1 (en) * | 2004-06-10 | 2006-02-07 | 삼성전자주식회사 | Spinner device for semiconductor manufacturing |
| CN201126815Y (en) * | 2007-12-25 | 2008-10-01 | 中国电子科技集团公司第四十五研究所 | Device for positioning wafer center |
| CN102080683B (en) * | 2011-02-16 | 2012-06-13 | 合肥芯硕半导体有限公司 | Multi-functional vacuum chuck |
| CN204018159U (en) * | 2014-07-23 | 2014-12-17 | 济南晶博电子有限公司 | Absorption type silicon chip coating turntable |
-
2014
- 2014-07-23 CN CN201410350810.XA patent/CN104096662B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0483328A (en) * | 1990-07-26 | 1992-03-17 | Canon Inc | Wafer chuck |
| JP2003332409A (en) * | 2002-05-09 | 2003-11-21 | Nikon Corp | Substrate suction device |
| CN201989054U (en) * | 2010-12-10 | 2011-09-28 | 北京有色金属研究总院 | Vehicle suitable for sand blasting of multi-size wafers |
| CN202221515U (en) * | 2011-09-08 | 2012-05-16 | 合肥芯硕半导体有限公司 | Multi-zone vacuum chuck for direct-writing lithography machine |
| CN202725449U (en) * | 2012-06-28 | 2013-02-13 | 中国科学院苏州纳米技术与纳米仿生研究所 | Photoresist spinner for silicon wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104096662A (en) | 2014-10-15 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Yuan Guofang Inventor before: Xu Yulei |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20170531 Address after: Office building No. 2 Guangzhou Road, unit 266000 in Jiaozhou City, Shandong province Qingdao City No. 167 Tong Garden District 5 layer Applicant after: QINGDAO HAIZHIYUAN INTELLIGENT TECHNOLOGY CO., LTD. Address before: 250200 Shandong Province, Ji'nan city Zhangqiu District Mingshui ocher Hill Industrial Park Applicant before: JINAN JINGBO ELECTRONICS CO., LTD. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200803 Address after: No. 208, No. 288-1, Bole Road, high tech Zone, Jinan City, Shandong Province Patentee after: SHANDONG ZHIDAO INTELLECTUAL PROPERTY MANAGEMENT Co.,Ltd. Address before: Office building No. 2 Guangzhou Road, unit 266000 in Jiaozhou City, Shandong province Qingdao City No. 167 Tong Garden District 5 layer Patentee before: QINGDAO HAIZHIYUAN INTELLIGENT TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201217 Address after: No.7 xiazhou Road, Taocheng Town, Yongchun County, Quanzhou City, Fujian Province Patentee after: You Zucai Address before: No.208, no.288-1 (east side of second floor), Bole Road, high tech Zone, Jinan City, Shandong Province Patentee before: SHANDONG ZHIDAO INTELLECTUAL PROPERTY MANAGEMENT Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210129 Address after: Liu'an Development Zone, Yongchun County, Quanzhou City, Fujian Province (east side of Taoxi bridge) Patentee after: Yongchun County Product Quality Inspection Institute Fujian fragrance product quality inspection center, national incense burning product quality supervision and Inspection Center (Fujian) Address before: No.7 xiazhou Road, Taocheng Town, Yongchun County, Quanzhou City, Fujian Province Patentee before: You Zucai |