CN104183519A - Integrated circuit substrate ball planting device and method capable of improving ball planting yield - Google Patents
Integrated circuit substrate ball planting device and method capable of improving ball planting yield Download PDFInfo
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- CN104183519A CN104183519A CN201310204129.XA CN201310204129A CN104183519A CN 104183519 A CN104183519 A CN 104183519A CN 201310204129 A CN201310204129 A CN 201310204129A CN 104183519 A CN104183519 A CN 104183519A
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- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 29
- 229910000679 solder Inorganic materials 0.000 claims abstract description 65
- 230000004907 flux Effects 0.000 claims abstract description 10
- 230000000630 rising effect Effects 0.000 abstract description 4
- 238000007790 scraping Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 26
- 238000006748 scratching Methods 0.000 description 4
- 230000002393 scratching effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
本发明公开了一种可增进集成电路基板植球良率的集成电路基板植球装置与方法，尤特指在吸球治具上方加装一导球板，铺球时焊球会先经由导球板的导球孔，再铺设至吸球治具的球槽中，所以即使吸球治具的球槽制作的比较浅，也可以使得焊球完全铺设在吸球治具上，而且不会有刮球的问题产生；同时，因为球槽制作的比较浅，所以在植球时基板上升的高度更容易控制，不会有助焊剂沾粘到吸球治具或者是焊球散球的情形发生。
The present invention discloses an integrated circuit substrate ball planting device and method which can improve the yield rate of integrated circuit substrate ball planting, and particularly refers to a ball guide plate installed above a ball suction fixture. When placing the ball, the solder ball will first pass through the ball guide hole of the ball guide plate and then be placed in the ball groove of the ball suction fixture. Therefore, even if the ball groove of the ball suction fixture is made relatively shallow, the solder ball can be completely placed on the ball suction fixture without the problem of ball scraping. At the same time, because the ball groove is made relatively shallow, the height of the substrate rising during ball planting is easier to control, and there will be no situation where the flux sticks to the ball suction fixture or the solder ball is scattered.
Description
技术领域technical field
本发明涉及可增进集成电路基板植球良率的方法，主要是为了避免在铺球时会有刮球问题产生，以及在植球时会有助焊剂沾粘到吸球治具或者是焊球散球情形发生的焊球铺球与植球技术上。The invention relates to a method for improving the ball-planting yield of an integrated circuit substrate, mainly to avoid the problem of scratching the ball when laying the ball, and to prevent flux from sticking to the ball-absorbing jig or solder ball during ball-planting Solder ball laying and ball planting technology in the case of loose balls.
背景技术Background technique
按，公知集成电路基板植球的方法，敬请参阅图1所示：其为公知技术的植球方法的截面组合示意图。主要在于：吸球治具10设有多个上方开口较大、下方开口较小的球槽11，每一个球槽11中可供容设一个焊球1，每一个球槽11的下方都设有一穿孔12，该吸球治具10下方设有一真空装置20，该真空装置20内部设有一真空气室21，该真空气室21对应于球槽11的穿孔12处设有连接孔22，该真空气室21的中间设有一气孔23，由该气孔23将真空气室21中的空气抽出，藉以吸附住焊球1，或由该气孔23重新将空气排进真空气室21中，藉以释放出焊球1，该真空装置20两侧设有翻转轴持装置24，做为将吸球治具10翻转一百八十度之用，该吸球治具10上方设有一铺球治具30，该铺球治具30中可供容纳众多的焊球1，当铺球治具30来回在吸球治具10移动时，即可使焊球1直接铺设在吸球治具10的球槽11中（如图2和图3所示），再由真空装置20的气孔23将真空气室21中的空气抽出，藉以吸附住焊球1，完成铺球作业（如图4所示），再由翻转轴持装置24将吸球治具10向下翻转一百八十度，使得吸球治具10的焊球1朝下准备植球（如图5所示），此时基板40上升（如图6所示），再由真空装置20的气孔23重新将空气排进真空气室21中，藉以释放出焊球1，让焊球1可以掉落至基板40的助焊剂41上，进行植球（如图7所示），最后基板40下降（如图8所示），完成植球作业。Press, please refer to FIG. 1 for the known method of ball planting on an integrated circuit substrate: it is a cross-sectional schematic diagram of a ball planting method in the known technology. The main reason is that: the ball suction jig 10 is provided with a plurality of ball grooves 11 with larger upper openings and smaller lower openings, each ball groove 11 can accommodate a solder ball 1, and each ball groove 11 is provided with a solder ball 1 below. There is a perforation 12, a vacuum device 20 is provided under the ball suction fixture 10, a vacuum chamber 21 is provided inside the vacuum device 20, and a connecting hole 22 is provided at the vacuum chamber 21 corresponding to the perforation 12 of the ball groove 11. An air hole 23 is arranged in the middle of the vacuum chamber 21, and the air in the vacuum chamber 21 is drawn out through the air hole 23, so as to absorb the solder ball 1, or the air is discharged into the vacuum chamber 21 again through the air hole 23, so as to release Out of the solder ball 1, the two sides of the vacuum device 20 are provided with an overturning shaft holding device 24, which is used to turn over the ball absorbing jig 10 by 180 degrees. A ball laying jig 30 is arranged above the ball absorbing jig 10 , the ball laying fixture 30 can accommodate many solder balls 1, when the ball laying fixture 30 moves back and forth on the ball absorbing fixture 10, the solder balls 1 can be directly laid on the ball groove 11 of the ball absorbing fixture 10 (as shown in Figure 2 and Figure 3), and then the air in the vacuum chamber 21 is drawn out by the air hole 23 of the vacuum device 20, so as to absorb the solder ball 1, and complete the ball laying operation (as shown in Figure 4), and then Turn the ball-absorbing jig 10 downward by 180 degrees by the reversing shaft-holding device 24, so that the solder balls 1 of the ball-absorbing jig 10 face down to prepare for ball planting (as shown in FIG. 5 ), at this time the substrate 40 rises ( As shown in Figure 6), the air is discharged into the vacuum chamber 21 again through the air hole 23 of the vacuum device 20, so as to release the solder ball 1, so that the solder ball 1 can drop onto the flux 41 of the substrate 40 to carry out Ball planting (as shown in FIG. 7 ), and finally the substrate 40 is lowered (as shown in FIG. 8 ), and the ball planting operation is completed.
惟，上述公知技术的集成电路基板植球的方法，为了能够有效固定焊球（锡球）1以及避免铺球时造成刮球情形，所以会将吸球治具10里的球槽11制作的比较深，若吸球治具10里的球槽11制作的比较浅（如图9所示），会造成焊球1铺不满的情形，因为球槽11制作的太浅，会因前面一颗焊球1凸出较多，导致后面焊球1被向上推挤，导致该焊球1无法顺利掉落至球槽11里，进而发生缺球的情形（如图10所示）；同时，球槽11制作的太浅也容易发生刮球的情形，因为焊球1会卡在两颗焊球1的中间而无法动弹（如第图11所示），当铺球治具30移动时，即会将卡住的焊球1刮掉上半层（如第图12所示）。However, in order to effectively fix the solder balls (solder balls) 1 and avoid scratching the balls when laying the balls in the method for planting balls on the integrated circuit substrate of the above-mentioned known technology, the ball grooves 11 in the ball-absorbing jig 10 are made It is relatively deep. If the ball groove 11 in the ball suction jig 10 is made relatively shallow (as shown in Figure 9), it will cause the situation that the solder ball 1 is not covered enough. The solder ball 1 protrudes a lot, causing the solder ball 1 to be pushed upwards, causing the solder ball 1 to fail to fall smoothly into the ball groove 11, resulting in a lack of ball (as shown in Figure 10); at the same time, the ball If the groove 11 is made too shallow, it is also easy to scratch the ball, because the solder ball 1 will be stuck in the middle of the two solder balls 1 and cannot move (as shown in Figure 11). When the ball laying jig 30 moves, it will Scrape off the upper half of the stuck solder ball 1 (as shown in Figure 12).
但是若将吸球治具10里的球槽11制作的比较深，会造成基板40在植球的时侯，上升高度比较不好控制，因为当基板40上升时太靠近吸球治具10，则助焊剂41很容易沾附到吸球治具10（如图7局部放大所示）；反之，当基板40上升时离吸球治具10太远（如图13所示），则植球时掉落时可能会偏离植球点位置，造成焊球1散球情形（如图14所示），为其既存尚待克服解决的问题与缺陷。However, if the ball groove 11 in the ball-absorbing jig 10 is made deeper, the rise height of the substrate 40 is difficult to control when the ball is planted, because when the substrate 40 rises, it is too close to the ball-absorbing jig 10. Then the flux 41 is easy to adhere to the ball-absorbing jig 10 (as shown in the partial enlargement of Figure 7); When dropped, it may deviate from the position of the ball planting point, causing solder ball 1 to scatter (as shown in Figure 14), which is an existing problem and defect that has yet to be overcome.
发明内容Contents of the invention
针对现有技术中存在的问题，本发明的目的在于提供一种集成电路基板植球装置于方法，以增进集成电路基板植球良率。Aiming at the problems existing in the prior art, the purpose of the present invention is to provide an integrated circuit substrate ball planting device and method, so as to improve the yield rate of integrated circuit substrate ball planting.
发明解决问题所应用的技术手段以及对照现有技术的功效在于：吸球治具的上方及下方设有一导球板及一真空装置，该真空装置两侧设有翻转轴持装置，该导球板对应于吸球治具的球槽处设有导球孔，该导球孔中可供容设一个焊球，该导球板上方还设有一铺球治具，该铺球治具中可供容纳众多的焊球；由于在吸球治具上方加装一导球板，铺球时焊球会先经由导球板的导球孔，再铺设至吸球治具的球槽中，所以即使吸球治具的球槽制作的比较浅，也可以使得焊球完全铺设在吸球治具上，而且不会有刮球的问题产生；同时，因为球槽制作的比较浅，所以在植球时基板上升的高度更容易控制，不会有助焊剂沾粘到吸球治具或者是焊球散球的情形发生。The technical means applied in the invention to solve the problem and the effect compared with the prior art are: a ball guide plate and a vacuum device are provided above and below the ball suction jig, and a turning shaft holding device is provided on both sides of the vacuum device. A ball guide hole is provided on the plate corresponding to the ball groove of the ball absorbing jig. A solder ball can be accommodated in the ball guide hole. A ball laying jig is also arranged above the ball guide plate. To accommodate a large number of solder balls; since a ball guide plate is installed above the ball-absorbing jig, the solder balls will first pass through the ball-guiding hole of the ball-guiding plate when laying the balls, and then be laid into the ball groove of the ball-absorbing jig. Even if the ball groove of the ball-absorbing fixture is made relatively shallow, the solder balls can be completely laid on the ball-absorbing fixture, and there will be no problem of scratching the ball; It is easier to control the rising height of the substrate when balling, and there will be no situation where the flux sticks to the ball-absorbing fixture or the solder balls scatter.
附图说明Description of drawings
图1：为现有技术植球方法的截面组合示意图。Fig. 1: It is a cross-sectional schematic diagram of the ball planting method in the prior art.
图2：为现有技术植球方法翻转轴持装置向右倾斜时的动作示意图。Figure 2: It is a schematic diagram of the action when the ball planting method in the prior art turns over the shaft holding device and tilts to the right.
图3：为现有技术植球方法翻转轴持装置向左倾斜时的动作示意图。Fig. 3: It is a schematic diagram of the action when the ball planting method of the prior art turns over the shaft holding device and tilts to the left.
图4：为现有技术植球方法真空装置吸住焊球的动作示意图。FIG. 4 is a schematic diagram of the action of vacuum device sucking solder balls in the ball planting method in the prior art.
图5：为现有技术植球方法翻转轴持装置将吸球治具翻转向下时的动作示意图。Fig. 5 is a schematic diagram of the action when the ball-absorbing jig is turned downward by turning over the shaft holding device in the prior art ball planting method.
图6：为现有技术植球方法基板上升时的动作示意图。FIG. 6 is a schematic diagram of the action when the substrate is raised in the ball planting method in the prior art.
图7：为现有技术植球方法真空装置释放焊球的动作示意图。FIG. 7 is a schematic diagram of the action of releasing the solder balls by the vacuum device of the ball planting method in the prior art.
图8：为现有技术植球方法基板下降时的动作示意图。FIG. 8 is a schematic diagram of the action when the substrate is lowered in the ball planting method in the prior art.
图9：为现有技术植球方法焊球无法顺利掉落至球槽里的状态示意图。FIG. 9 is a schematic diagram of a state in which solder balls cannot be smoothly dropped into ball grooves in the prior art ball planting method.
图10：为现有技术植球方法球槽发生缺球的状态示意图。Fig. 10: It is a schematic diagram of the ball missing state in the ball groove of the ball planting method in the prior art.
图11：为现有技术植球方法焊球卡在两颗焊球中间的状态示意图。FIG. 11 is a schematic diagram of a state in which a solder ball is stuck between two solder balls in the ball planting method in the prior art.
图12：为现有技术植球方法铺球治具移动时将卡住的焊球刮掉的状态示意图。FIG. 12 is a schematic diagram of the state of scraping off stuck solder balls when the ball laying jig moves in the prior art ball planting method.
图13：为现有技术植球方法基板上升时离吸球治具太远的状态示意图。Fig. 13 is a schematic diagram of the state where the substrate is too far away from the ball-absorbing fixture when the ball-planting method in the prior art rises.
图14：为现有技术植球方法焊球散球的状态示意图。FIG. 14 is a schematic diagram of the state of solder ball loosening in the ball planting method in the prior art.
图15：为本发明植球方法的截面组合示意图。Fig. 15 is a cross-sectional schematic diagram of the ball planting method of the present invention.
图16：为本发明导球板下降与吸球治具结合的动作示意图。Fig. 16: It is a schematic diagram of the combination of the ball guide plate descending and the ball suction jig of the present invention.
图17：为本发明翻转轴持装置向右倾斜时的动作示意图。Fig. 17: It is a schematic diagram of the action when the turning shaft holding device of the present invention is tilted to the right.
图18：为本发明翻转轴持装置向左倾斜时的动作示意图。Fig. 18: It is a schematic diagram of the action when the turning shaft holding device of the present invention is tilted to the left.
图19：为本发明真空装置吸住焊球的动作示意图。Fig. 19 is a schematic diagram of the action of the vacuum device of the present invention sucking solder balls.
图20：为本发明导球板上升与吸球治具脱离的动作示意图。Fig. 20: It is a schematic diagram of the movement of the ball guide plate rising and the ball suction jig disengaging in the present invention.
图21：为本发明翻转轴持装置将吸球治具翻转向下时的动作示意图。Fig. 21: It is a schematic diagram of the action when the turning shaft holding device of the present invention turns the ball-absorbing jig downward.
图22：为本发明基板上升时的动作示意图。Fig. 22: It is a schematic diagram of the action when the substrate of the present invention is raised.
图23：为本发明真空装置释放焊球的动作示意图。Fig. 23 is a schematic diagram of the action of releasing solder balls by the vacuum device of the present invention.
图24：为本发明基板下降时的动作示意图。Fig. 24: It is a schematic diagram of the action when the substrate of the present invention is lowered.
其中，附图标记说明如下：Wherein, the reference signs are explained as follows:
1 焊球1 solder ball
10 吸球治具10 Suction ball fixture
11 球槽11 ball groove
12 穿孔12 perforations
20 真空装置20 vacuum device
21 真空气室21 vacuum chamber
22 连接孔22 Connection hole
23 气孔23 Stomata
24 翻转轴持装置24 Flip shaft holding device
30 铺球治具30 laying ball jig
40 基板40 Substrate
41 助焊剂41 flux
本发明部分Part of the invention
1 焊球1 solder ball
50 吸球治具50 Suction ball fixture
51 球槽51 ball groove
52 穿孔52 perforations
60 真空装置60 vacuum device
61 真空气室61 vacuum chamber
62 连接孔62 Connection holes
63 气孔63 stomata
64 翻转轴持装置64 Flip shaft holding device
70 导球板70 guide plate
71 导球孔71 guide ball hole
80 铺球治具80 laying ball jig
90 基板90 Substrate
91 助焊剂91 flux
具体实施方式Detailed ways
为使本技术领域的技术人员易于深入了解本发明的装置内容以及所能达成的功能效益，兹列举一具体实施例，并配合附图详细介绍说明如下：In order to make it easy for those skilled in the art to understand the device content of the present invention and the functional benefits that can be achieved, a specific embodiment is listed hereby, and the detailed description is as follows in conjunction with the accompanying drawings:
一种可增进集成电路基板植球良率的集成电路基板植球方法，敬请参阅图15所示：其为本发明的截面组合示意图。主要在于：Please refer to FIG. 15 , which is a schematic cross-sectional combination diagram of the present invention, for an integrated circuit substrate ball planting method that can improve the ball planting yield of the integrated circuit substrate. Mainly in:
吸球治具50设有多个上方开口较大、下方开口较小的球槽51，每一个球槽51中可供容设一个焊球1，每一个球槽51的下方都设有一穿孔52，该吸球治具50下方设有一真空装置60，该真空装置60内部设有一真空气室61，该真空气室61对应于球槽51的穿孔52处设有连接孔62，该真空气室61的中间设有一气孔63，由该气孔63将真空气室61中的空气抽出，藉以吸附住焊球1，或由该气孔63重新将空气排进真空气室61中，藉以释放出焊球1，该真空装置60两侧设有翻转轴持装置64，做为将吸球治具50翻转一百八十度之用，该吸球治具50上方设有一导球板70，该导球板70对应于吸球治具50的球槽51处设有导球孔71，每一个导球孔71中都可供容设一个焊球1，该导球板70上方还设有一铺球治具80，该铺球治具80中可供容纳众多的焊球1，导球板70先下降与吸球治具50结合，准备铺球（如图16所示），当翻转轴持装置64来回倾斜转动吸球治具50与导球板70时，该铺球治具80即会来回在导球板70移动，使得焊球1先经由导球板70的导球孔71，再铺设至吸球治具50的球槽51中（如图17和图18所示），再由真空装置60的气孔63将真空气室61中的空气抽出，藉以吸附住焊球1，完成铺球作业（如图19所示），导球板70上升，离开吸球治具50（如图20所示），再由翻转轴持装置64将吸球治具50向下翻转一百八十度，使得吸球治具50的焊球1朝下准备植球（如图21所示），此时基板90上升（如图22所示），再由真空装置60的气孔63重新将空气排进真空气室61中，藉以释放出焊球1，让焊球1可以掉落至基板90的助焊剂91上，进行植球（如图23所示），最后基板40下降，完成植球作业（如图24所示）。The ball suction jig 50 is provided with a plurality of ball grooves 51 with larger upper openings and smaller lower openings, each ball groove 51 can accommodate a solder ball 1, and each ball groove 51 is provided with a perforation 52 below A vacuum device 60 is provided below the ball suction fixture 50, and a vacuum chamber 61 is provided inside the vacuum device 60. The vacuum chamber 61 is provided with a connecting hole 62 corresponding to the perforation 52 of the ball groove 51. There is an air hole 63 in the middle of the air hole 63, and the air in the vacuum chamber 61 is drawn out from the air hole 63, so as to absorb the solder ball 1, or the air is discharged into the vacuum chamber 61 again through the air hole 63, so as to release the solder ball 1. Both sides of the vacuum device 60 are provided with a turning shaft holding device 64, which is used to turn the ball-absorbing jig 50 by 180 degrees. A ball-guiding plate 70 is provided above the ball-absorbing jig 50, and the ball-guiding jig 50 Plate 70 is provided with guide hole 71 corresponding to ball groove 51 of ball suction jig 50, and all can accommodate a solder ball 1 in each guide hole 71, and this ball guide plate 70 top is also provided with a ball laying fixture. Tool 80, which can accommodate many solder balls 1 in the ball laying fixture 80, the ball guide plate 70 first descends and combines with the ball absorbing fixture 50, and prepares to lay balls (as shown in Figure 16), when the shaft holding device 64 is turned over When the ball absorbing jig 50 and the ball guide plate 70 are tilted back and forth, the ball laying jig 80 will move back and forth on the ball guide plate 70, so that the solder balls 1 first pass through the ball guide hole 71 of the ball guide plate 70, and then lay to the In the ball groove 51 of the ball suction fixture 50 (as shown in Figure 17 and Figure 18), the air in the vacuum chamber 61 is drawn out by the air hole 63 of the vacuum device 60, so as to absorb the solder ball 1 and complete the ball laying operation (As shown in Figure 19), the ball guide plate 70 rises and leaves the ball-absorbing jig 50 (as shown in Figure 20), and then the flipping shaft holding device 64 turns the ball-absorbing jig 50 downward by 180 degrees, Make the solder ball 1 of the ball suction fixture 50 face down to prepare for ball planting (as shown in Figure 21), at this time the substrate 90 rises (as shown in Figure 22), and then the air is exhausted into the vacuum again by the air hole 63 of the vacuum device 60 In the air chamber 61, the solder ball 1 is released so that the solder ball 1 can drop onto the flux 91 of the substrate 90 for ball planting (as shown in FIG. 23 ), and finally the substrate 40 descends to complete the ball planting operation (such as Figure 24).
通过上述各装置及方法所组合而成的本发明，是在提供一种可增进集成电路基板植球良率的集成电路基板植球方法，在实际操作应用上：由于在吸球治具50上方加装一导球板70，铺球时焊球1会先经由导球板70的导球孔71，再铺设至吸球治具50的球槽51中，所以即使吸球治具50的球槽51制作的比较浅，也可以使得焊球1完全铺设在吸球治具50上，而且不会有刮球的问题产生；同时，因为球槽51制作的比较浅，所以在植球时基板90上升的高度更容易控制了，不会有助焊剂91沾粘到吸球治具50或者是焊球1散球的情形发生。The present invention combined by the above-mentioned various devices and methods is to provide a ball planting method for an integrated circuit substrate that can improve the ball planting yield of an integrated circuit substrate. Install a ball guide plate 70, when laying balls, the solder ball 1 will first pass through the ball guide hole 71 of the ball guide plate 70, and then be laid in the ball groove 51 of the ball suction jig 50, so even if the ball of the ball suction jig 50 Grooves 51 are made relatively shallow, so that the solder balls 1 can be completely laid on the ball-absorbing jig 50, and there will be no problem of scratching the balls; at the same time, because the ball grooves 51 are made relatively shallow, the substrate will The rising height of 90 is easier to control, and there will be no situation where the solder flux 91 sticks to the ball-absorbing jig 50 or the solder balls 1 loose.
综合上述所陈，本发明提供一种可增进集成电路基板植球良率的集成电路基板植球方法，经过本发明人实际制做完成以及反复操作测试之后，证实的确可以达到本发明所预期的功能效益，同时又为目前坊间尚无见闻的首先创作，具有产业上的利用价值。Based on the above, the present invention provides a ball planting method for integrated circuit substrates that can improve the ball planting yield of integrated circuit substrates. After the actual production and repeated operation tests by the inventors, it is confirmed that the expected results of the present invention can indeed be achieved. Functional benefits, and at the same time, it is the first creation that has not been seen in the market at present, and has industrial utilization value.
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| CN113084422A (en) * | 2021-03-04 | 2021-07-09 | 江苏运鸿辉电子科技有限公司 | Welding positioning device for lamp strip lamp beads |
| CN114914188A (en) * | 2022-04-25 | 2022-08-16 | 上海微松工业自动化有限公司 | BGA plants ball with large-traffic ball mechanism of inhaling |
| CN114999945A (en) * | 2022-05-27 | 2022-09-02 | 江苏长电科技股份有限公司 | Welding ball mounting method and corresponding welding ball taking and placing device |
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| CN115985790A (en) * | 2023-01-10 | 2023-04-18 | 上海世禹精密设备股份有限公司 | Full-sealed tin ball supply device for ball planting machine |
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| CN115985790A (en) * | 2023-01-10 | 2023-04-18 | 上海世禹精密设备股份有限公司 | Full-sealed tin ball supply device for ball planting machine |
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Application publication date: 20141203 |