CN104191855B - A kind of SMT printing stencil - Google Patents
A kind of SMT printing stencil Download PDFInfo
- Publication number
- CN104191855B CN104191855B CN201410417880.2A CN201410417880A CN104191855B CN 104191855 B CN104191855 B CN 104191855B CN 201410417880 A CN201410417880 A CN 201410417880A CN 104191855 B CN104191855 B CN 104191855B
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- CN
- China
- Prior art keywords
- printing stencil
- composite layer
- reinforcement
- scratch
- smt printing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007639 printing Methods 0.000 title claims abstract description 33
- 239000002131 composite material Substances 0.000 claims abstract description 29
- 230000002787 reinforcement Effects 0.000 claims abstract description 20
- 230000003678 scratch resistant effect Effects 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 13
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 12
- 239000010959 steel Substances 0.000 claims abstract description 12
- 229910000851 Alloy steel Inorganic materials 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910000677 High-carbon steel Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 230000007547 defect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 210000004243 sweat Anatomy 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- Printing Plates And Materials Therefor (AREA)
Abstract
The invention discloses a kind of SMT printing stencil, described SMT printing stencil includes scratch-resistant layer, scratch-resistant layer is made up of steel, it is located at SMT printing stencil top layer, it it is composite layer below scratch-resistant layer, composite layer is mixed by macromolecular material and sensitive material, there is certain viscosity, being provided with reinforcement in composite layer, reinforcement is made up of steel alloy, is support plate below composite layer, support plate is made up of steel, SMT printing stencil has pattern hole, and pattern hole cross section becomes certain gradient, and aperture is more more wide toward center.This SMT printing stencil is reasonable in design, manufactures simplicity, prevents template to ftracture well, improve job stability.
Description
Technical field
The present invention relates to print field, particularly to a kind of SMT printing stencil.
Background technology
Modern electronics industry develops rapidly, electronic product towards less, gentlier, thinner direction develop, more and more application of thin space, stencil print process is more and more in electronics manufacturing application.Electronic component kit PCB is welded in electronic product produces, soften on PCB firstly the need of stannum silk, and PCB has a lot of pad need stannum, the corresponding electronic component in the position of each pad, will adopt stencil printing techniques exactly the best approach of disposable for the pad needing upper stannum accurately upper stannum.
Existing printing stencil designs simply mostly, single with material, usually there will be the defects such as template cracking, print solder paste off normal, have impact on product quality.
Summary of the invention
The technical problem to be solved is to provide a kind of SMT printing stencil, pattern hole cross section becomes certain gradient, and aperture is more more wide toward center, it is to avoid the problems such as generation tin sweat(ing), to solve the above-mentioned multinomial defect caused in prior art.
For achieving the above object, the present invention provides following technical scheme: a kind of SMT printing stencil, including scratch-resistant layer, composite layer, support plate, reinforcement, pattern hole, described SMT printing stencil includes scratch-resistant layer and is made up of steel, it is located at SMT printing stencil top layer, it it is composite layer below scratch-resistant layer, composite layer is mixed by macromolecular material and sensitive material, there is certain viscosity, composite layer is provided with reinforcement, reinforcement is made up of steel alloy, it it is support plate below composite layer, support plate is made up of steel, SMT printing stencil has pattern hole, pattern hole cross section becomes certain gradient, and aperture is more more wide toward center, wherein scratch-resistant layer, composite layer and support plate, it is all by adhesive bond between three layers.
Preferably, described pattern hole upper and lower surface is designed with rounding, and in pattern hole, center is provided with the convex arc of projection.
Preferably, described reinforcement is manufactured by steel alloy, and reinforcement is cross section is circular steel wire, is uniformly applied in inside composite layer.
Above technical scheme is adopted to provide the benefit that: this SMT printing stencil adopts multiple material comprehensively to use, scratch-resistant layer is made up of steel, composite layer is mixed by macromolecular material and sensitive material, reinforcement is made up of steel alloy, support plate is made up of steel, the combination of multiple material, improve the mechanical property of SMT printing stencil, scratch-resistant layer is made up of high-carbon steel, hardness is big, and anti-wear performance is good, well prevent the defects such as template cracking, the use of reinforcement, improves the tensile strength of composite layer.SMT printing stencil has pattern hole, pattern hole cross section becomes certain gradient, and aperture is more more wide toward center, in pattern hole, center is provided with the convex arc of projection, the pattern hole using this kind of structure prevents the print solder paste off normal that plain bore easily occurs to produce the problems such as tin sweat(ing) with easy, simple in construction, easy to manufacture, improve serviceability and the life-span of printing stencil.
Accompanying drawing explanation
Fig. 1 is the sectional view of a kind of SMT printing stencil of the present invention；
Fig. 2 is the top view of a kind of SMT printing stencil of the present invention.
Wherein, 1 scratch-resistant layer, 2 composite layers, 3 support plates, 4 reinforcements, 5 pattern hole, 6 convex arcs.
Detailed description of the invention
The preferred implementation of a kind of SMT printing stencil of the present invention is described in detail below in conjunction with accompanying drawing.
nullFig. 1 and Fig. 2 shows the detailed description of the invention of a kind of SMT printing stencil of the present invention: a kind of SMT printing stencil，Including scratch-resistant layer 1、Composite layer 2、Support plate 3、Reinforcement 4、Pattern hole 5，Described SMT printing stencil includes scratch-resistant layer 1 and is made up of steel，It is located at printing stencil top layer，It it is composite layer 2 below scratch-resistant layer 1，Composite layer 2 is mixed by macromolecular material and sensitive material，There is certain viscosity，Composite layer 2 is provided with reinforcement 4，Reinforcement 4 is made up of steel alloy，It it is support plate 3 below composite layer 2，Support plate 3 is made up of steel，Hardness is big，Wearability is good，SMT printing stencil has pattern hole 5，Pattern hole 5 cross section becomes certain gradient，And aperture is more more wide toward center，Wherein scratch-resistant layer 1、Composite layer 2 and support plate 3，It is all by adhesive bond between three layers.
In conjunction with shown in Fig. 1 and Fig. 2, scratch-resistant layer 1 hardness is higher, mar proof is good, pattern hole 5 upper and lower surface is designed with rounding, and in pattern hole 5, center is provided with the convex arc 6 of projection, it is therefore prevented that the problems such as print solder paste off normal and easily generation tin sweat(ing), reinforcement 4 is manufactured by steel alloy, reinforcement 4 is cross section is circular steel wire, is uniformly applied in composite layer 2 internal, improves the tensile strength of composite layer 2.
Above is only the preferred embodiment of the present invention, it is noted that for the person of ordinary skill of the art, without departing from the concept of the premise of the invention, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention.
Claims (3)
1. a SMT printing stencil, including scratch-resistant layer, composite layer, support plate, reinforcement, pattern hole, it is characterized in that: the scratch-resistant layer that described SMT printing stencil includes is made up of high-carbon steel, it is located at SMT printing stencil top layer, it it is composite layer below scratch-resistant layer, composite layer is mixed by macromolecular material and sensitive material, there is certain viscosity, composite layer is provided with reinforcement, reinforcement is made up of steel alloy, it it is support plate below composite layer, support plate is made up of steel, SMT printing stencil has pattern hole, pattern hole cross section becomes certain gradient, and aperture is more more wide toward center, wherein scratch-resistant layer, composite layer and support plate, it is all by adhesive bond between three layers.
2. printing stencil according to claim 1, it is characterised in that: described pattern hole upper and lower surface is designed with rounding, and in pattern hole, center is provided with the convex arc of projection.
3. printing stencil according to claim 1, it is characterised in that: described reinforcement is manufactured by steel alloy, and reinforcement is cross section is circular steel wire, is uniformly applied in inside composite layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410417880.2A CN104191855B (en) | 2014-08-22 | 2014-08-22 | A kind of SMT printing stencil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410417880.2A CN104191855B (en) | 2014-08-22 | 2014-08-22 | A kind of SMT printing stencil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104191855A CN104191855A (en) | 2014-12-10 |
| CN104191855B true CN104191855B (en) | 2016-07-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410417880.2A Active CN104191855B (en) | 2014-08-22 | 2014-08-22 | A kind of SMT printing stencil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104191855B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104219895A (en) * | 2014-10-04 | 2014-12-17 | 艾金富 | Printing template |
| CN105415912A (en) * | 2015-11-18 | 2016-03-23 | 桐城运城制版有限公司 | Printing template |
| CN115302205B (en) * | 2022-08-23 | 2024-05-14 | 上海福讯电子有限公司 | SMT ladder template preparation method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050161490A1 (en) * | 1999-09-02 | 2005-07-28 | Salman Akram | Method and apparatus for forming metal contacts on a substrate |
| CN201226078Y (en) * | 2008-05-26 | 2009-04-22 | 新日光能源科技股份有限公司 | Composite printing template |
| CN201703004U (en) * | 2010-05-19 | 2011-01-12 | 彰绅精密工业股份有限公司 | metal printing stencil |
| CN202353948U (en) * | 2011-10-11 | 2012-07-25 | 潘宇强 | Mask plate applied in B2it+FCA (fixed channel allocation) |
| CN103203955A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A hybrid production process for a step stencil |
| CN103862744A (en) * | 2012-12-10 | 2014-06-18 | 昆山允升吉光电科技有限公司 | Compound mask plate |
| CN103974548A (en) * | 2014-04-26 | 2014-08-06 | 昆山允升吉光电科技有限公司 | Method for manufacturing mask plate |
-
2014
- 2014-08-22 CN CN201410417880.2A patent/CN104191855B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050161490A1 (en) * | 1999-09-02 | 2005-07-28 | Salman Akram | Method and apparatus for forming metal contacts on a substrate |
| CN201226078Y (en) * | 2008-05-26 | 2009-04-22 | 新日光能源科技股份有限公司 | Composite printing template |
| CN201703004U (en) * | 2010-05-19 | 2011-01-12 | 彰绅精密工业股份有限公司 | metal printing stencil |
| CN202353948U (en) * | 2011-10-11 | 2012-07-25 | 潘宇强 | Mask plate applied in B2it+FCA (fixed channel allocation) |
| CN103203955A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A hybrid production process for a step stencil |
| CN103862744A (en) * | 2012-12-10 | 2014-06-18 | 昆山允升吉光电科技有限公司 | Compound mask plate |
| CN103974548A (en) * | 2014-04-26 | 2014-08-06 | 昆山允升吉光电科技有限公司 | Method for manufacturing mask plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104191855A (en) | 2014-12-10 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Yuan Shaojie Inventor before: Zhang Liming |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180315 Address after: 061600 Hebei province Dongguang Huiyuan Economic Development Zone on the west side of the road Patentee after: Dongguang Yuncheng plate making Co. Ltd. Address before: 231400 Tongcheng City, Anqing Province, private Economic Development Zone Xingyuan West Road Patentee before: Tongcheng Yuncheng Platemaking Co., Ltd. |