CN104267218B - A kind of BGA package test jack for possessing pin test function - Google Patents
A kind of BGA package test jack for possessing pin test function Download PDFInfo
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- CN104267218B CN104267218B CN201410535754.7A CN201410535754A CN104267218B CN 104267218 B CN104267218 B CN 104267218B CN 201410535754 A CN201410535754 A CN 201410535754A CN 104267218 B CN104267218 B CN 104267218B
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- pin
- measured
- substrate
- slot
- bga chip
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- 238000012360 testing method Methods 0.000 title claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000000926 separation method Methods 0.000 claims abstract description 3
- 238000013461 design Methods 0.000 claims description 4
- 238000011990 functional testing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 102100032983 Phospholipase D2 Human genes 0.000 description 9
- 108010002267 phospholipase D2 Proteins 0.000 description 9
- 108090000553 Phospholipase D Proteins 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a kind of BGA package test jack for possessing pin test function, it is characterized in that the socket includes substrate, the PLD and pin test point buried in substrate, the substrate is integrated pcb board, cabling is provided with inside substrate, cabling is connected with the pin of PLD, the upper face center of substrate is provided with slot, slot point is provided with slot, the slot is used to insert bga chip to be measured, the spherical pin spacing conformance to specifications of the separation of the slot and bga chip to be measured, line number and columns that the number of lines and columns of the slot point are respectively encapsulated more than the spherical pin of bga chip to be measured；The bottom surface of the substrate is provided with substrate draw-foot, and the PLD is connected with the spherical pin of substrate draw-foot and bga chip to be measured；The pin test point is drawn by PLD, is evenly distributed on the top surface edge of substrate.
Description
Technical field
The present invention relates to a kind of test jack, specially a kind of BGA package test jack for possessing pin test function.
Background technology
The pin measurement of chip bga needs to account for before pcb board design, and needs to measure
Each pin draw a test point, give over to pcb board test when use.If being designed without drawing test point in pcb board, that
In system testing if there is problem, just the equipment such as oscillograph can not be used to measure.
The pin spacing specification of chip bga is limited, generally 1.27mm, 1mm, 0.8mm, 0.65mm, 0.5mm,
Several specifications such as 0.45mm, 0.4mm, 0.3mm, but under same specification, the pin number of bga chip and distribution Dou Youhen great areas
Not, the bga chip of many non-standard encapsulation can not be put into the bga socket of standard, it is necessary to special special format customized
Socket, this testing cost that small-lot chips have been significantly greatly increased and cycle.
Traditional board level testing system must reserve the test point of special pin, once it is determined that can not change；If desired
Retain to the power of test of all BGA pins, it is necessary to which all pins are all drawn into test point.
Therefore one kind is provided and can be used in non-standard encapsulation bga chip, and size is identical, power pins are distributed with ground pin
The test jack that identical, the signal pins quantity bga chip different from distribution carries out pin test turns into the prior art urgently
The problem of solution.
The content of the invention
In view of the shortcomings of the prior art, the technical problem that the present invention is intended to solve has been to provide one kind and has possessed pin test work(
The BGA package test jack of energy, the socket can carry out power of tests to the whole pins of chip bga, and be applicable to mark
The accurate bga chip with a range of off-gauge BGA package form.
The present invention solves the technical problem and a kind of possesses pin test function the technical scheme adopted is that providing
BGA package test jack, it is characterised in that the socket includes the PLD buried in substrate, substrate and pin test
Point, the substrate is that cabling is provided with inside integrated pcb board, substrate, and cabling is connected with the pin of PLD, substrate
Upper face center, which is provided with slot, slot, is provided with slot point, and the slot is used to insert bga chip to be measured, the groove of the slot
Spacing and the spherical pin spacing conformance to specifications of bga chip to be measured, the number of lines and columns of the slot point are respectively more than to be measured
The line number and columns of the spherical pin encapsulation of bga chip；The bottom surface of the substrate is provided with substrate draw-foot, the programmable logic device
Part is connected with the spherical pin of substrate draw-foot and bga chip to be measured；The pin test point is drawn by PLD,
The even top surface edge for being distributed in substrate.
Compared with prior art, the present invention has online programming ability, can be by the ball being arbitrarily designated of bga chip to be measured
Shape pin leads to pin test point, while can change tested spherical pin by programming, is tested by using a small amount of pin
The test to the spherical pin of all bga chips to be measured can be achieved in point.The present invention also has good adaptability, between pin
Away from identical, feelings of the row, column number no more than the row, column number of the slot point of slot in the present invention of the spherical pin of bga chip to be measured
Under condition, it is possible to achieve the test to the bga chip of different number of pins types.
Brief description of the drawings
Fig. 1 possesses a kind of vertical section structure of embodiment of BGA package test jack of pin test function for the present invention
Schematic diagram；
Fig. 2 possesses a kind of plan structure signal of embodiment of BGA package test jack of pin test function for the present invention
Figure；
In figure, 1, substrate, 2, PLD, 3, pin test point, 4, substrate draw-foot, 5, bga chip to be measured.
Embodiment
The present invention is further discussed below with reference to embodiment and its accompanying drawing, specific embodiment is only to the further of the present invention
Explain, protection scope of the present invention is not limited with this.
The present invention possess pin test function BGA package test jack (abbreviation socket, referring to Fig. 1-2) include substrate 1,
The PLD 2 and pin test point 3 buried in substrate, the substrate 1 is to be set inside the pcb board of high integration, substrate 1
There is cabling, cabling is connected with the pin of PLD 2, the upper face center of substrate 1 is provided with slot, slot provided with slotting
Groove point, the slot is used to insert bga chip 5 to be measured, state the spherical pin spacing of the separation of slot and bga chip to be measured with
Specification is consistent, and the number of lines and columns of the slot point are respectively more than line number and columns that the spherical pin of bga chip to be measured is encapsulated；
The bottom surface of the substrate 1 is provided with substrate draw-foot 4, the PLD 2 and substrate draw-foot 4 and the ball of bga chip to be measured 5
Shape pin carries out logic connection；The pin test point 3 is drawn by PLD 2, is evenly distributed on the upper table of substrate 1
Face edge.
The application method of socket of the present invention is：When needing to carry out functional test to bga chip to be measured, by BGA to be measured
In the slot of the insertion substrate 1 of chip 5, and the socket is connected to test system using physical connection mode, according to system design,
PLD 2 is programmed in advance, bga chip 5 to be measured is tested by being logically connected to default output pin
On point 3；
In some the spherical pin signal for needing to measure bga chip 5 to be measured, it is necessary to be carried out to PLD 2
Programming, is connected to the reserved pin of BGA test jacks by PLD 2 by the spherical pin of bga chip to be measured and surveys
In pilot 3, the just state of the measurable point；
When needing to change the type of bga chip 5 to be measured, it is only necessary to PLD 2 is programmed again, built
Found the spherical pin of new bga chip to be measured 5 and the corresponding annexation of pin test point 3.
The quantity of pin test point 3 of the present invention is relevant with the quantity of requirement of system design and bga chip to be measured, pin test
The quantity maximum of point 3 can be supported to test the pin of all bga chips.
The software flow that the present invention is realized is：1) it is the pin point of all bga chips to be measured 5 for being connected to substrate draw-foot 4
GPIO pin with PLD 2；2) it is to need to be connected to the pin assignment of the bga chip to be measured 5 of pin test point 3
Programmable logic device pin；3) in the internal logic of programmable logic device, the logical relation 1), 2) set up in two steps is entered
Row connection；4) Pin locations that bga chip 5 to be measured leads to pin test point 3 are changed if desired, then returning to the, 2) step is again
Set；5) the software programming for writing completion is entered in the program storage area of PLD.
The present invention possesses the BGA package test jack of pin test function, with online programming ability, can will be to be measured
The spherical pin being arbitrarily designated of bga chip 5 leads to pin test point 3, possesses and is owned using a small amount of 3 pairs of pin test point
The power of test of the spherical pin of bga chip 5 to be measured, and the spherical pin for being tested bga chip 5 can be changed by programming,
And then the test of the spherical pin to all bga chips 5 to be measured can be easily carried out.The present invention has good adaptability,
Identical in pin spacing, the line number and columns of the spherical pin of bga chip 5 to be measured are respectively no more than slot in slot in the present invention
In the case of the line number and columns of point, it is possible to achieve the test to the bga chip of different number of pins types.
The present invention does not address part and is applied to prior art.
Claims (1)
1. a kind of BGA package test jack for possessing pin test function, it is characterised in that the socket in substrate, substrate including burying
PLD and pin test point, the substrate is integrated pcb board, cabling is provided with inside substrate, cabling is with that can compile
The pin of journey logical device is connected, and the upper face center of substrate, which is provided with slot, slot, is provided with slot point, and the slot is used to insert
Put bga chip to be measured, the spherical pin spacing conformance to specifications of the separation of the slot and bga chip to be measured, the slot
Line number and columns that the number of lines and columns of point are respectively encapsulated more than the spherical pin of bga chip to be measured；The bottom surface of the substrate is set
There is substrate draw-foot, the PLD is connected with the spherical pin of substrate draw-foot and bga chip to be measured；The pin is surveyed
Pilot is drawn by PLD, is evenly distributed on the top surface edge of substrate；
The application method of socket is：When needing to carry out functional test to bga chip to be measured, bga chip to be measured is inserted into base
In the slot of plate, and the socket is connected to test system using physical connection mode, according to system design, in advance to programmable
Logical device is programmed, by bga chip to be measured by being logically connected in default output pin test point；
, will in some the spherical pin signal for needing to measure bga chip to be measured, it is necessary to be programmed to PLD
The spherical pin of bga chip to be measured is connected in the reserved pin test point of BGA test jacks by PLD, just
The state of the measurable point；
When needing to change the type of bga chip to be measured, it is only necessary to PLD is programmed again, set up newly
The corresponding annexation of the spherical pin of bga chip to be measured and pin test point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410535754.7A CN104267218B (en) | 2014-10-11 | 2014-10-11 | A kind of BGA package test jack for possessing pin test function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410535754.7A CN104267218B (en) | 2014-10-11 | 2014-10-11 | A kind of BGA package test jack for possessing pin test function |
Publications (2)
| Publication Number | Publication Date |
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| CN104267218A CN104267218A (en) | 2015-01-07 |
| CN104267218B true CN104267218B (en) | 2017-09-15 |
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| CN201410535754.7A Active CN104267218B (en) | 2014-10-11 | 2014-10-11 | A kind of BGA package test jack for possessing pin test function |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105067846A (en) * | 2015-08-10 | 2015-11-18 | 深圳市共进电子股份有限公司 | BGA package chip test clamp |
| CN105353175B (en) * | 2015-11-22 | 2018-01-05 | 苏州光韵达光电科技有限公司 | A kind of BGA package test jack |
| CN107976618B (en) * | 2016-03-08 | 2020-02-07 | 宁波利特舜电气有限公司 | Working method of BGA packaging test socket |
| CN106771405B (en) * | 2017-01-06 | 2017-12-29 | 中国船舶重工集团公司第七0九研究所 | A kind of spherical grid array integrated circuit interface adapter |
| US10789550B2 (en) * | 2017-04-13 | 2020-09-29 | Battelle Memorial Institute | System and method for generating test vectors |
| CN109116061A (en) * | 2018-09-10 | 2019-01-01 | 上海泽丰半导体科技有限公司 | A kind of socket based on chip testing |
| CN114078566A (en) | 2020-08-14 | 2022-02-22 | 长鑫存储技术有限公司 | Test fixture |
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| CN100373165C (en) * | 2003-12-26 | 2008-03-05 | 技嘉科技股份有限公司 | Ball grid array substrate detection device and construction method thereof |
| CN101063625B (en) * | 2006-04-30 | 2010-08-11 | 中芯国际集成电路制造(上海)有限公司 | BGA packaging retainer apparatus and method for testing BGA packaging |
| CN100578240C (en) * | 2007-05-29 | 2010-01-06 | 北京中星微电子有限公司 | A method for realizing chip testing |
| CN102621466B (en) * | 2012-03-22 | 2015-02-11 | 上海华力微电子有限公司 | Aging test board and method for manufacturing same |
| CN204154755U (en) * | 2014-10-11 | 2015-02-11 | 中国航天科工集团第三研究院第八三五七研究所 | A kind of BGA package test jack |
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2014
- 2014-10-11 CN CN201410535754.7A patent/CN104267218B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6300781B1 (en) * | 1998-10-30 | 2001-10-09 | St Assembly Test Services Pte Ltd | Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system |
| CN201600928U (en) * | 2009-05-08 | 2010-10-06 | 黄建军 | Chip test system and automatic test vector generator ATPG |
| CN203396792U (en) * | 2013-08-08 | 2014-01-15 | 长春长光辰芯光电技术有限公司 | Chip-packaging general test seat |
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| CN104267218A (en) | 2015-01-07 |
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Effective date of registration: 20180404 Address after: 300308 Tianjin District of Dongli City Airport Economic Zone bonded Road No. 357 Patentee after: TIANJIN JINHANG INSTITUTE OF COMPUTING TECHNOLOGY Address before: 300308 Tianjin District of Dongli City Airport Economic Zone bonded Road No. 357 Patentee before: NO.8357 Research Institute of the Third Academy of China Aerospace Science & Industry Corp. |
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