CN104329868B - Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof - Google Patents

Abstract

The invention provides a semiconductor refrigeration refrigerator and a cold end heat exchange device thereof. The cold-end heat exchange device includes: a cold-end heat conduction plate, which has a heat exchange surface thermally connected to a cooling source; a plurality of cooling ring-shaped heat pipes, arranged at intervals along a radial direction in a plane parallel to the heat exchange surface, wherein each The upper part of the cooling annular heat pipe is in contact with the cold-end heat conducting plate for heat exchange, and is arranged downward along a plane parallel to the heat exchange surface. According to the technical proposal of the present invention, the plurality of refrigeration annular heat pipes in the cold-end heat exchange device effectively conducts the temperature transmitted by the cold-end heat conduction plate, occupies a small space, and is conducive to the cooperation with the structure of the refrigerator.

Description

Semiconductor refrigeration refrigerator and its cold end heat exchange device

technical field

The invention relates to refrigeration equipment, in particular to a semiconductor refrigeration refrigerator and a cold end heat exchange device thereof.

Background technique

Semiconductor refrigeration refrigerators, also known as thermoelectric refrigerators. It utilizes semiconductor refrigerating sheet to achieve cooling through high-efficiency annular double-layer heat pipe heat dissipation and conduction technology and automatic variable pressure and variable flow control technology. It does not need refrigeration fluid and mechanical moving parts, and solves the application problems of traditional mechanical refrigeration refrigerators such as medium pollution and mechanical vibration. .

However, semiconductor refrigeration refrigerators need to effectively conduct the temperature of the cold end of the semiconductor refrigeration sheet to the storage room of the refrigerator. The existing technology generally adopts the forced convection of the heat sink. Chamber for heat exchange, the heat conduction and heat exchange efficiency between solids is low, which is not conducive to the best performance of semiconductors, and the cooling fins are large in size, occupying the space of the refrigerator, and the noise will increase when the fan is used. Work, less reliable.

Contents of the invention

An object of the present invention is to provide a cold end heat exchange device with high heat exchange efficiency and small space occupation.

A further object of the present invention is to make the production and assembly process of the cold-end heat exchange device simple, and the cooperation with the refrigerator body reliable and stable.

According to one aspect of the present invention, a cold end heat exchange device for a semiconductor refrigeration refrigerator is provided. The cold-end heat exchange device includes: a cold-end heat conduction plate, which has a heat exchange surface thermally connected with a cooling source; a plurality of cooling ring-shaped heat pipes, arranged at intervals along a radial direction in a plane parallel to the heat exchange surface, each of which The upper part of the refrigeration annular heat pipe is in contact with the cold end heat conducting plate for heat exchange, and is arranged downward along a plane parallel to the heat exchange surface.

Optionally, each cooling annular heat pipe is a polygon axisymmetric to the longitudinal center line of the cold-end heat conduction plate, and two sides constituting a top angle or a part of its top edge are in contact with the cold-end heat conduction plate for heat exchange.

Optionally, each cooling annular heat pipe is a square with rounded corners, at least a part of its upper side is in contact with the cold end heat conducting plate for heat exchange, and its two side edges extend vertically downward parallel to the heat exchange surface.

Optionally, the lumen of the cooling ring heat pipe has a sintered metal powder structure inside.

Optionally, each cooling annular heat pipe is diamond-shaped, the first group of diagonals is vertically arranged, and the second group of diagonals is horizontally arranged to form the upper corners of the first group of diagonals and the adjacent corners forming the upper corners. At least a part of the edge is in contact with the cold end heat conducting plate to exchange heat.

Optionally, the cooling loop heat pipe is a light pipe heat pipe.

Optionally, the outer surface of each refrigeration annular heat pipe is flat and square.

According to another aspect of the present invention, a semiconductor refrigeration refrigerator is also provided. The semiconductor refrigerating refrigerator includes: an inner container, which defines a storage compartment; an outer casing, which is arranged on the outside of the inner container, and includes a U shell and a back, and the back wall of the outer casing and the rear wall of the inner container define an installation space ; Semiconductor cooling sheet; Optionally, any of the above-described cold-end heat exchange devices and the semiconductor cooling sheet are arranged in the installation space, and the cold-end heat exchange device is installed so that its heat exchange surface is the same as that of the semiconductor cooling sheet. The cold end is thermally connected, and at least a part of each refrigeration annular heat pipe is attached to the outer surface of the inner tank, so as to transmit the cold energy from the cold end to the storage compartment.

Optionally, the above semiconductor refrigeration refrigerator further includes: a hot end heat exchange device, thermally connected to the hot end of the semiconductor refrigeration sheet, for dissipating the heat generated by the hot end to the surrounding environment.

Optionally, the heat exchange device at the hot end includes: a heat exchange box at the hot end, defining an inner chamber for containing a refrigerant in two phases coexisting in gas and liquid, and configured to allow the refrigerant to undergo phase change heat therein; and a heat dissipation pipeline configured to allow the refrigerant to flow therein and undergo phase conversion heat, and the first end and the second end of the heat dissipation pipeline formed as open ends are both connected to the upper part of the inner cavity of the hot end heat exchange box, The heat dissipation pipes are respectively bent upwards from the first end and the second end to a common highest position.

Optionally, the heat exchange device at the hot end includes: a heat exchange box at the hot end, defining an inner chamber for containing a refrigerant in two phases coexisting in gas and liquid, and configured to allow the refrigerant to undergo phase change heat therein; and A plurality of radiating pipes are configured to allow the refrigerant to flow therein and undergo phase-change heat, and the first end of each radiating pipe, which is formed as an open end, communicates with the upper part of the inner cavity of the hot-end heat exchange box, and each The heat dissipation pipe extends obliquely upwards from its first end, and terminates at its second end which is formed as a closed end.

Optionally, the hot end heat exchange device includes: a hot end heat conducting plate, which is thermally connected to the hot end; The inner wall of the outer shell of the refrigerating refrigerator is in contact with heat exchange.

Optionally, the heat exchange device at the hot end includes: a heat conducting plate at the hot end, which is thermally connected to the hot end; a plurality of heat dissipation heat pipes, one end of each heat dissipation heat pipe is in contact with the heat conduction plate at the hot end; on the root heat dissipation heat pipe; and the fan is fixed on the heat dissipation fin by a fastening mechanism, so as to carry out forced convection heat dissipation to the heat transferred from the plurality of heat dissipation heat pipes to the heat dissipation fin.

Optionally, the heat exchange device at the hot end includes: a heat exchange box at the hot end, which defines an inner cavity for containing a refrigerant in which gas and liquid coexist, and is configured to allow the refrigerant to undergo phase change heat therein; a heat dissipation pipeline configured to allow the refrigerant to flow therein and undergo phase conversion heat, and the first end of each heat dissipation pipeline formed as an open end communicates with the upper part of the inner cavity of the hot end heat exchange box, each The heat dissipation pipeline bends and extends obliquely upwards from its first end, and terminates at its second end formed as a closed end; the heat dissipation fins are arranged on a plurality of heat dissipation pipelines; and the fan is fixed on the heat dissipation fins by a fastening mechanism On the chip, in order to carry out the forced convection heat dissipation of the heat transferred from multiple heat dissipation pipes to the heat dissipation fins.

In the cold-end heat exchange device of the present invention, the plurality of refrigeration ring-shaped heat pipes effectively conduct the temperature transmitted from the cold-end heat conduction plate, occupies a small space, and is helpful for cooperation with the structure of the refrigerator.

Furthermore, in the semiconductor refrigeration refrigerator of the present invention, at least a part of the heat exchange device at the cold end is attached to the outer surface of the inner tank, and the inner tank is used for heat conduction, making full use of the structure of the refrigerator and occupying a small space.

Furthermore, the semiconductor refrigeration refrigerator of the present invention can adopt various forms of hot-end heat exchange devices to timely and effectively dissipate the heat generated by the hot end of the semiconductor refrigeration sheet to the surrounding environment, which is flexible in configuration and ensures reliable operation of the refrigerator.

Those skilled in the art will be more aware of the above and other objects, advantages and features of the present invention according to the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings.

Description of drawings

Hereinafter, some specific embodiments of the present invention will be described in detail by way of illustration and not limitation with reference to the accompanying drawings. The same reference numerals in the drawings designate the same or similar parts or parts. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the attached picture:

Fig. 1 is a schematic diagram of a cold end heat exchange device for a semiconductor refrigeration refrigerator according to an embodiment of the present invention;

Fig. 2 is a schematic diagram of another cooling annular heat pipe used in a cold end heat exchange device of a semiconductor refrigeration refrigerator according to an embodiment of the present invention;

Fig. 3 is a schematic diagram of another cooling annular heat pipe used in a cold-end heat exchange device of a semiconductor refrigeration refrigerator according to an embodiment of the present invention;

Fig. 4 is a schematic exploded view of a hot end heat exchange device that can be used in a semiconductor refrigeration refrigerator of the present invention;

Fig. 5 is a schematic exploded view of another hot end heat exchange device that can be used in the semiconductor refrigeration refrigerator of the present invention;

Fig. 6 is a schematic diagram of another hot end heat exchange device that can be used in the semiconductor refrigeration refrigerator of the present invention;

Fig. 7 is a schematic diagram of another hot end heat exchange device that can be used in the semiconductor refrigeration refrigerator of the present invention;

Fig. 8 is a schematic diagram of another hot end heat exchange device that can be used in the semiconductor refrigeration refrigerator of the present invention

Fig. 9 is a schematic diagram of another hot end heat exchange device that can be used in the semiconductor refrigeration refrigerator of the present invention; and

Fig. 10 is a cross-sectional view along the direction B of another heat exchange device at the hot end that can be used in the semiconductor refrigeration refrigerator of the present invention.

detailed description

Embodiments of the present invention are described in detail below, examples of said embodiments are shown in the accompanying drawings, and the embodiments described below by referring to the accompanying drawings are exemplary, are only used to explain the present invention, and cannot be construed as explanations for the present invention limit. In the description of the present invention, the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear" etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention. There is no requirement that the invention be constructed and operated in a particular orientation, and thus no limitation should be construed.

Fig. 1 is a schematic diagram of a cold end heat exchange device 100 for a peltier refrigerator according to an embodiment of the present invention. The cold-end heat exchange device 100 may generally include: a cold-end heat conducting plate 110 and a plurality of cooling loop heat pipes 120 . Wherein, the cold end heat conduction plate 110 has a heat exchange surface for heat exchange with a cooling source (such as the cold end of a semiconductor cooling chip); a plurality of cooling annular heat pipes 120 are arranged at intervals in a plane parallel to the heat exchange surface along the radial direction, each The upper part of the cooling annular heat pipe 120 is in contact with the cold end heat conducting plate 110 for heat exchange, and is arranged downward along a plane parallel to the heat exchange surface. A plurality of cooling annular heat pipes 120 are arranged at intervals along the radial direction, forming a structure of a large ring surrounded by small rings, with a certain distance between them.

When the cold-end heat exchange device 100 is working, the temperature of the cold-end heat conducting plate 110 drops, and the temperature is transferred to the cooling ring heat pipe 120 in contact with it. When the temperature inside the cooling ring heat pipe 120 drops, the liquid refrigerant in it is condensed and transformed into a liquid state , due to its own gravity and the adsorption of the sintered powder, it flows to the lower part, cooling the temperature of the object that the lower part of the annular heat pipe 120 is attached to, thereby reducing the temperature of the surrounding environment. The refrigerant that has absorbed heat evaporates into a gaseous state, rises to the upper part of the cooling ring heat pipe 120 under the power of the heat source, reabsorbs the temperature of the cold end heat conducting plate 110, condenses into a liquid state, and thus circulates.

In order to ensure the heat exchange efficiency between the cold-end heat-conducting plate 110 and the cooling source, the heat-exchanging surface of the cold-end heat-conducting plate 110 can have a heat-conducting layer, and the heat-conducting layer is made of heat-conducting silicone grease (graphite or other medium) coated on the heat-exchanging surface. form. The "thermal connection" or "thermal contact" in this embodiment could have been a direct abutment contact, and conduct heat transfer by means of heat conduction. If thermal conductive silicone grease (graphite or other media) is applied against the contact surface, it can be considered as a part of the contact surface, as a heat conduction layer to improve thermal connection (or thermal contact).

The cooling ring heat pipe 120 can choose to use a variety of ring shapes. Considering the processing technology and cooling effect, each cooling ring heat pipe 120 is a polygon that is symmetrical to the longitudinal centerline of the cold end heat conducting plate, and the two sides or A part of its top edge is in contact with the cold end heat conducting plate for heat exchange. The refrigerating annular heat pipe 120 shown in FIG. 1 is hexagonal, and the part of one vertex and the two adjacent sides of the vertex serves as a condenser, which is in contact with the cold end heat conducting plate 110 for heat exchange, and the other parts of the refrigerating annular heat pipe 120 as an evaporator.

Fig. 2 is a schematic diagram of another cooling ring heat pipe used in the cold end heat exchange device 100 of a semiconductor refrigeration refrigerator according to an embodiment of the present invention. The end heat conducting plate 110 contacts the heat exchange as a condenser, and its two side edges extend vertically downward parallel to the heat exchange surface. The cooling ring heat pipe 120 adopts a heat pipe with a sintered metal powder structure inside the lumen.

The bottom of the rounded square refrigeration ring heat pipe 120 and at least a part (such as the lower half) of the two sides are used as an evaporator. Relying on the capillary force generated by the sintered metal powder, the liquid refrigerant is absorbed into the heat-absorbing area.

Fig. 3 is a schematic diagram of another cooling ring heat pipe used in the cold end heat exchange device 100 of a semiconductor refrigeration refrigerator according to an embodiment of the present invention, each cooling ring heat pipe 120 is a rhombus, and the first group of diagonal lines are vertical The second group of diagonals is arranged horizontally, and at least a part of the upper vertex constituting the first group of diagonals and the adjacent side forming the upper vertex is in contact with the cold-end heat conducting plate 110 to form a condenser. The part of the cooling ring heat pipe 120 located outside the cold end heat conduction plate 110 is used as an evaporator. Since there is no horizontal part in the rhombus shape, the liquid refrigerant in the upper part can automatically flow down by gravity and absorb heat and evaporate. Therefore, the cooling ring heat pipe 120 Light pipe heat pipe can be used.

The cooling ring heat pipes 120 of various shapes above can be directly embedded in the cold end heat conduction plate 110 or welded and fixed with the cold end heat conduction plate 110. In order to facilitate connection with other components, the cooling ring heat pipe 120 can choose a flat structure to increase the contact area. .

Embodiments of the present invention also provide a semiconductor refrigeration refrigerator using the above cold-end heat exchange device 100 . The semiconductor refrigeration refrigerator may generally include: an inner tank, an outer shell, a semiconductor refrigeration sheet, and the cold-end heat exchange device 100 . Wherein the liner of the refrigerator defines a storage compartment, and the outer shell generally has two structures, one is an assembled type, that is, a complete cabinet is assembled from a top cover, left and right side panels, a back panel, and a lower bottom panel. The other is the integral type, that is, the top cover and the left and right side plates are rolled into an inverted "U" shape according to the requirements, which is called a U shell, and the back plate and the lower bottom plate are spot-welded to form a box body. The semiconductor refrigeration refrigerator of the embodiment of the present invention preferably uses an integral shell, that is, the shell includes a U shell and a back, wherein the U shell is arranged on the outside of the side wall and the top wall of the inner container, and the back of the shell is connected with the rear wall of the inner container. The installation space is limited. The cold-end heat exchange device 100 and the semiconductor refrigeration sheet can be installed in the installation space, and the specific arrangement structure is that the heat exchange surface of the cold-end heat exchange device 100 is thermally connected with the cold end of the semiconductor refrigeration sheet, and each refrigeration annular heat pipe At least a part of 120 is in contact with the outer surface of the inner tank, so as to transmit the cold energy from the cold end to the storage compartment.

In the case of using a rounded square cooling annular heat pipe 120, the cold end of the semiconductor cooling chip is fixed in contact with the cold end heat transfer plate 110, and heat conduction material can be applied on the contact surface to enhance the heat transfer effect. The upper part of the cooling ring heat pipe 120 is in contact with the heat transfer plate of the cold end heat transfer plate 110 , and the cooling ring heat pipe 120 has a good contact surface by being embedded in the cold end heat transfer plate 110 or by welding.

There is a sintered metal powder structure on the inner wall of the cooling ring heat pipe 120, and the structure produces capillary action. The inside of the cooling ring heat pipe 120 is filled with a refrigerant working medium. Before filling, the tube must be vacuum treated, and the heat pipe is sealed after the vacuum filling. Under normal conditions, the inside of the cooling ring heat pipe 120 is in a gas-liquid two-phase coexistence state of the refrigerant. Most of the liquid state is located in the lower part of the tube due to its own gravity and is adsorbed inside the sintered powder, and most of the gaseous state is located in the upper part of the space in the tube. When the semiconductor refrigeration refrigerator is working, the heat generated by the cold end of the semiconductor refrigeration chip is transferred to the cold end heat transfer plate 110 through heat conduction, and the cold end heat transfer plate 110 then transfers the heat to the refrigeration annular heat pipe 120 in contact with it, and the gaseous refrigerant in the pipe When condensed by cold, it turns into a liquid state, and the liquid refrigerant flows downward due to the capillary force of its own gravity heating tube, and absorbs the heat of the inner cavity at the part in contact with the inner cavity of the semiconductor refrigeration refrigerator, vaporizes and evaporates when heated, and absorbs The heat-absorbed refrigerant vaporizes into a gaseous state, rises to the upper part of the heat pipe under the driving force of the heat source, and condenses again depending on the temperature of the cold-end heat transfer plate 110, thus the cycle works. The heat in the inner cavity of the refrigerator is taken away by the cooling ring heat pipe 120, thereby reducing the temperature of the storage compartment. When the liquid refrigerant is located in the upper or lower horizontal part, its own gravity cannot cause the refrigerant to flow back here, but the sintered powder inside the cooling ring heat pipe 120 has capillary action, which will generate capillary force and absorb the liquid refrigerant. to heated areas.

The semiconductor refrigerating refrigerator adopts a phase change method for heat transfer, which has higher heat transfer efficiency than the traditional heat conduction method, and the cooling annular heat pipe 120 can be made into a flat type, which is convenient for matching with the inner cavity of the refrigerator. It does not take up extra space in the refrigerator and has a beautiful appearance. Moreover, the system does not need an additional fan to force convection, is silent, has no vibration, and is safe and reliable.

The working principle of the diamond-shaped cooling ring heat pipe 120 is similar to that of the rounded square cooling ring heat pipe 120 , except that since there is no horizontal part, a light pipe can be used. Corresponding arrangements of other polygonal refrigeration ring heat pipes are arranged using a similar working principle.

In order to solve the problem of heat dissipation at the hot end of the semiconductor cooling chip, the semiconductor cooling refrigerator of this embodiment may further include: a hot end heat exchange device, which is thermally connected to the hot end of the semiconductor cooling chip, and is used to dissipate the heat generated by the hot end to the surrounding environment. The heat exchange device at the hot end of the semiconductor refrigeration refrigerator of this embodiment will be introduced below with reference to the accompanying drawings.

FIG. 4 is a schematic exploded view of a hot end heat exchange device 200 that can be used in a semiconductor refrigeration refrigerator of the present invention. The hot end heat exchange device 200 includes: a hot end heat exchange box 210 and a heat dissipation pipeline 220 . The hot-end heat exchange box 210 defines an inner chamber for accommodating refrigerant in gas-liquid two-phase coexistence, and is configured to allow the refrigerant to undergo phase-change heat therein. The heat dissipation pipeline 220 is configured to allow the refrigerant to flow therein and undergo phase conversion heat, and the first end and the second end of the heat dissipation pipeline 220 formed as open ends are both connected to the inner cavity of the hot end heat exchange box 210 In the upper part, the heat dissipation pipes 220 respectively bend upwards from the first end and the second end to a common highest position.

The heat dissipation pipeline 220 can be attached to the casing 230 of the refrigerator, and the heat can be dissipated to the surrounding environment through the casing 230 . The refrigerant poured into the hot end heat exchange box 210 can be water or other refrigerants, and its state is a gas-liquid two-phase coexistence state. When the semiconductor refrigeration chip is powered on, the temperature of its hot end rises. The hot end surface exchanges heat with the hot end heat exchange box 210. The hot end heat exchange box 210 forms an evaporator and changes into a gaseous state. The gaseous refrigerant rises along the refrigerant pipeline under the pressure of the heat source and transfers heat to the refrigerator shell 230, and then transfer heat to the external space through natural convection, the refrigerant pipeline 220 forms a condenser, the refrigerant condenses and releases heat and becomes liquid, and flows back to the heat exchange box 210 at the hot end by gravity, where it re-absorbs heat from the hot end and evaporates. form a thermal cycle.

When using the hot end heat exchange device 200 to assemble with the cold end heat exchange device 100 introduced in the above embodiments, the structure can be as follows: the semiconductor cooling plate is arranged in the space between the rear wall of the refrigerator liner and the rear wall of the refrigerator shell , the rear wall of the cold end heat exchange box 110 of the cold end heat exchange device 100 is thermally connected to the cold end of the semiconductor refrigeration chip, and the refrigerant pipeline 120 is attached to the inner tank of the refrigerator for cooling the storage inner cavity. The hot end of the semiconductive cooling sheet conducts the heat of the hot end to a lower position through a thermal bridge device arranged vertically downward, the upper end of the thermal bridge device is connected with the hot end of the semiconductive cooling sheet, and the heat of the hot end heat exchange device 200 The end heat exchange box 210 can be thermally connected to the hot end of the semiconductor cooling fin through the lower end of the heat bridge device, thereby providing a larger space for the heat dissipation pipeline 220 to extend upward.

FIG. 5 is a schematic exploded view of another hot end heat exchange device 300 that can be used in a semiconductor refrigeration refrigerator of the present invention. The hot end heat exchange device 300 includes: a hot end heat exchange box 310 and a plurality of heat dissipation pipelines 320 . The hot-end heat exchange box 310 defines an inner cavity for containing a refrigerant in gas-liquid two-phase coexistence, and is configured to allow the refrigerant to undergo phase-change heat therein. A plurality of heat dissipation pipelines 320 are configured to allow the refrigerant to flow therein and undergo phase conversion heat, and the first end of each heat dissipation pipeline 320 formed as an open end communicates with the inner cavity of the hot end heat exchange box 310 In the upper part, each heat dissipation pipe 320 extends obliquely upwards from its first end, and terminates at its second end formed as a closed end.

The working principle of the hot end heat exchange device 300 shown in FIG. 5 is similar to that of the hot end heat exchange device 200 shown in FIG. Line 220. The hot end surface exchanges heat with the hot end heat exchange box 310. The hot end heat exchange box 310 forms an evaporator and changes into a gaseous state. The gaseous refrigerant will rise along the refrigerant pipeline 320 under the pressure of the heat source and transfer heat to the refrigerator. The outer shell 230 then transfers heat to the external space through natural convection, and the refrigerant pipeline 320 forms a condenser. The refrigerant condenses and releases heat and becomes liquid, and flows back to the heat exchange box 310 at the hot end by gravity, where it reabsorbs heat from the hot end and evaporates , forming a thermal cycle. With the disconnected heat dissipation pipeline, the production process is relatively simple, and it can be better assembled with the outer shell 230 of the refrigerator.

The hot end heat exchange device 300 of this embodiment can also be arranged at a lower position by connecting with a heat bridge, thereby providing a larger space for the heat dissipation pipeline 320 to extend upwards, so as to have a larger Cooling area.

FIG. 6 is a schematic diagram of another hot-side heat exchange device 400 that can be used in the semiconductor refrigeration refrigerator of the present invention. The hot-end heat exchange device 400 includes: a hot-end heat conducting plate 410 and a plurality of heat dissipation annular heat pipes 420 . The hot end heat conducting plate 410 is thermally connected with the hot end. A part of each heat-dissipating annular heat pipe 420 is in contact with the heat conducting plate 410 at the hot end for heat exchange, and the other part is in contact with the inner wall of the semiconductor refrigeration refrigerator for heat exchange.

The contact surface of the hot-side heat-conducting plate 410 in contact with the hot-end of the semiconductor chip is coated with a heat-conducting material to enhance the heat transfer effect. A plurality of heat-dissipating annular heat pipes 420 are directly embedded in the heat-conducting plate 410 or welded and fixed with the heat-conducting plate 410 . To facilitate connection with other components, the heat-dissipating annular heat pipes 420 can be in a flat structure to increase the contact area.

A sintered metal powder structure can be optionally used on the inner wall of the heat dissipation annular heat pipe 420, and the structure produces capillary action. Under normal conditions, the interior of the heat-dissipating annular heat pipe 420 is in a gas-liquid two-phase coexistence state of the refrigerant. Most of the liquid state is located in the lower part of the tube due to its own gravity and is adsorbed inside the sintered powder, and most of the gaseous state is located in the upper part of the space in the tube.

When the system works, the heat generated by the hot end of the semiconductor chip is transferred to the hot end heat conducting plate 410 through heat conduction, and the hot end heat conducting plate 410 then transfers the heat to the heat dissipation annular heat pipe 420 in contact with it. When the heat dissipation annular heat pipe 420 is heated, the heat in the pipe The liquid refrigerant vaporizes and evaporates when heated, and the refrigerant that has absorbed heat vaporizes into a gaseous state, and rises to the upper part of the heat-dissipating annular heat pipe 420 under the driving force of the heat source, and then conducts convective heat exchange between the outer shell of the refrigerator and the external space, and condenses back to the Liquid, the liquid refrigerant flows back to the lower part of the heat-dissipating annular heat pipe 4200 due to the capillary force of its own gravity heating pipe, and then continues to absorb heat, vaporize and evaporate, thereby circulating.

The shape of each annular heat pipe 420 can be square or rhombus, wherein, the lower horizontal part of the square heat pipe 420 is in thermal contact with the heat conduction plate 410, and the upper horizontal part and vertical part of the square heat pipe 420 are in contact with the inner wall of the refrigerator shell. Therefore, when the liquid refrigerant is located in the horizontal part of the heat pipe 420, its own gravity here cannot cause the refrigerant to flow back, but the sintered powder inside the square heat pipe 420 has a capillary effect, which will generate capillary force and suck the liquid refrigerant to heated area.

One set of diagonals of the diamond-shaped annular heat pipe 420 is set vertically, the other set of diagonals is set horizontally, and a part of the lower set of adjacent sides is fixed to the heat conducting plate 410 . There is no horizontal part of the diamond-shaped pipeline 420, therefore, the sintered powder structure inside the tube can also be removed, and a common light tube structure is adopted, and the liquid refrigerant completely relies on its own gravity when flowing down. This hot-end cooling device 400 does not need to occupy additional space of the refrigerator, has a beautiful appearance, and does not need an additional fan to force convection, is quiet, has no vibration, and is safe and reliable.

FIG. 7 is a schematic diagram of another hot end heat exchange device 500 that can be used in the semiconductor refrigeration refrigerator of the present invention. The hot end heat exchange device 500 includes: a hot end heat conducting plate 510 , a plurality of heat exchange heat pipes 520 , cooling fins 530 and a fan 540 . The hot end heat conducting plate 510 is thermally connected with the hot end. One end of each heat pipe 520 is in contact with the heat conducting plate 510 at the hot end for heat exchange. The cooling fins 530 are disposed on the plurality of heat pipes 520 . The fan 540 is fixed on the cooling fins 530 by a fastening mechanism, so as to dissipate the heat transferred from the plurality of heat pipes 520 to the cooling fins 530 by forced convection. In order to ensure heat transfer efficiency, heat-conducting silicone grease (graphite or other media) is used to contact each connecting part. The hot-end heat exchange device 500 conducts heat transfer through heat pipe fins, and conducts forced convection through fans, and has fast heat dissipation effect, simple structure, convenient maintenance, and simple production process.

FIG. 8 is a schematic diagram of another hot end heat exchange device 600 that can be used in a semiconductor refrigeration refrigerator of the present invention. The hot end heat exchange device 600 includes: a hot end heat exchange box 610 , a plurality of heat dissipation pipelines 620 , heat dissipation fins 630 and a fan 640 . The hot-end heat exchange box 610 defines an inner cavity for accommodating a refrigerant in gas-liquid two-phase coexistence, and is configured to allow the refrigerant to undergo phase-change heat therein. The plurality of heat dissipation pipelines 620 are configured to allow the refrigerant to flow therein and undergo phase conversion heat, and the first end of each heat dissipation pipeline 620 formed as an open end communicates with the upper part of the inner chamber of the hot end heat exchange box 610 , each cooling pipe 620 bends and extends obliquely upwards from its first end, and terminates at its second end formed as a closed end. The heat dissipation fins 630 are disposed on the plurality of heat dissipation pipelines 620 . The fan 640 is fixed on the heat dissipation fins 630 by a fastening mechanism, so as to dissipate the heat transferred from the plurality of heat dissipation pipes 620 to the heat dissipation fins 630 by forced convection.

When this kind of hot-end heat exchange device 600 is powered on, the hot-end surface exchanges heat with the hot-end heat exchange box 610. The hot-end heat exchange box 610 forms an evaporator and changes into a gaseous state. The gaseous refrigerant will be in the heat source Under pressure, it rises along the refrigerant pipeline 620, transfers heat to the fins 630, and then transfers the heat to the external space through convection. The refrigerant pipeline 620 forms a condenser. To the heat exchange box 610 at the hot end, re-absorb heat from the hot end to evaporate to form a heat cycle, and the fins 630 and the fan 640 increase the condensation speed of the refrigerant pipeline 620 . The refrigerant pipeline 620 conducts heat to the fins 630 , and the cooling efficiency of the fins is further improved through the fan 640 .

Fig. 9 is a schematic diagram of another hot end heat exchange device 700 applicable to the semiconductor refrigeration refrigerator of the present invention, and Fig. 10 is a B-direction cross-sectional view of another hot end heat exchange device 700 applicable to the semiconductor refrigeration refrigerator of the present invention. The hot end heat exchange device 700 may generally include: a hot end heat exchange box 710 , a plurality of heat dissipation pipelines 720 , and a plurality of grid-shaped wire tube heat dissipation surfaces 730 . Wherein, the hot-end heat exchange box 710 defines an inner chamber for accommodating a refrigerant in which gas-liquid two-phase coexistence, and is configured to allow the refrigerant to undergo phase-change heat in it; a plurality of heat dissipation pipelines 720 are configured to allow refrigeration The agent flows in it and undergoes phase-change heat, and each heat dissipation pipeline 720 extends upward from the top wall of the heat exchange box 710 at the hot end to the highest point, then bends along different vertical planes and extends downward to the hot end At the bottom of the side wall of the heat exchange box 710, the lumen of each heat dissipation pipeline 720 communicates with the inner cavity of the hot end heat exchange box 710 to form a heat dissipation loop; a plurality of grid-shaped wire tube heat dissipation surfaces 730 are respectively arranged on the One side of the heat dissipation pipeline 720 is disposed between two adjacent heat dissipation pipelines 720 or adjacently.

An optional structure of the hot end heat exchange device 700 is as follows: two heat dissipation pipelines 720 extend upward from the two connecting pipes protruding from the top of the hot end heat exchange box 710, and extend to a certain height after reaching a certain height. The side extends obliquely to the highest point, then extends downward in a serpentine shape in two vertical planes, and finally communicates with the inner cavity of the hot end heat exchange box 710 through the connecting pipe at the bottom of the side wall of the hot end heat exchange box 710 . The grid-shaped wire tube heat dissipation surface 730 is formed by multiple groups of heat dissipation wire tubes arranged in parallel and at intervals, including three groups, which are attached to one side and the middle interval of the two heat dissipation pipes 720 respectively. When the refrigerant in the hot-end heat exchange box 710 is heated and evaporates, it rises along the heat dissipation pipeline 720, dissipates the temperature to the surrounding environment, and then gradually condenses into a liquid along the serpentine pipeline, and returns to the hot-end heat exchange box under the action of gravity 710. The grid-shaped wire tube increases the heat dissipation area and improves the heat dissipation efficiency. A three-way device for injecting refrigerant may also be provided on the heat dissipation pipeline 720 .

The cold end heat exchange device introduced in the above embodiments is assembled with various types of hot end heat exchange devices to form a refrigeration system of a semiconductor refrigerator, which can reliably ensure the normal operation of the semiconductor refrigeration sheet and improve heat exchange efficiency.

So far, those skilled in the art should appreciate that, although a number of exemplary embodiments of the present invention have been shown and described in detail herein, without departing from the spirit and scope of the present invention, the disclosed embodiments of the present invention can still be used. Many other variations or modifications consistent with the principles of the invention are directly identified or derived from the content. Accordingly, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

So far, those skilled in the art should appreciate that, although a number of exemplary embodiments of the present invention have been shown and described in detail herein, without departing from the spirit and scope of the present invention, the disclosed embodiments of the present invention can still be used. Many other variations or modifications consistent with the principles of the invention are directly identified or derived from the content. Accordingly, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims (13)

1. A cold end heat exchange device for a semiconductor refrigeration refrigerator, comprising: The cold end heat conducting plate has a heat exchange surface thermally connected with the cooling source; A plurality of cooling annular heat pipes are arranged at intervals in the radial direction in a plane parallel to the heat exchange surface, wherein The upper part of each cooling annular heat pipe is in contact with the cold-end heat conducting plate for heat exchange, and is arranged downward along a plane parallel to the heat exchange surface, wherein Each of the cooling annular heat pipes is a polygon that is axially symmetrical to the longitudinal centerline of the cold-end heat conducting plate, and the two sides constituting the vertex or a part of its top edge are in contact with the cold-end heat conducting plate for heat exchange, and each At least a part of the refrigerated annular heat pipe abuts against the outer surface of the inner container of the semiconductor refrigerated refrigerator, so as to transmit the cold energy from the cold end to the storage compartment of the assisted semiconductor refrigerated refrigerator. 2. The cold end heat exchange device according to claim 1, wherein Each of the cooling annular heat pipes is a square with rounded corners, at least a part of its upper side is in contact with the cold-end heat conducting plate for heat exchange, and its two side edges extend vertically downward parallel to the heat exchange surface. 3. The cold end heat exchange device according to claim 2, wherein The inside of the lumen of the refrigeration ring heat pipe has a sintered metal powder structure. 4. The cold end heat exchange device according to claim 1, wherein Each of the refrigeration annular heat pipes is diamond-shaped, the first group of diagonals is arranged vertically, and the second group of diagonals is arranged horizontally, forming the upper vertex of the first group of diagonals and forming the upper vertex At least a part of the adjacent edge is in contact with the cold end heat conducting plate to exchange heat. 5. The cold end heat exchange device according to claim 4, wherein The cooling ring heat pipe is a light pipe heat pipe. 6. The cold end heat exchange device according to claim 1, wherein The outer surface of each cooling ring heat pipe is flat and square. 7. A semiconductor refrigeration refrigerator, comprising: an inner container defining a storage compartment therein; The outer casing is arranged on the outside of the inner container, which includes a U shell and a back, and the back of the outer casing and the rear wall of the inner container define an installation space; semiconductor cooling chip; The cold-end heat exchange device according to any one of claims 1 to 6, which is arranged in the installation space together with the semiconductor cooling fin, The cold-end heat exchange device is installed so that its heat exchange surface is thermally connected to the cold end of the semiconductor refrigeration sheet, and at least a part of each refrigeration annular heat pipe is attached to the outer surface of the inner container, so as to Cooling is transferred from the cold end to the storage compartment. 8. The semiconductor refrigeration refrigerator according to claim 7, further comprising: The hot end heat exchange device is thermally connected with the hot end of the semiconductor refrigeration sheet, and is used for dissipating the heat generated by the hot end to the surrounding environment. 9. The semiconductor refrigeration refrigerator according to claim 8, wherein The hot end heat exchange device includes: a hot-end heat exchange box defining an inner chamber for containing a refrigerant in gas-liquid two-phase coexistence, and configured to allow the refrigerant to undergo phase-change heat therein; and heat dissipation piping configured to allow refrigerant to flow therein and undergo phase change heat, and The first end and the second end of the heat dissipation pipeline formed as open ends are both connected to the upper part of the inner cavity of the hot end heat exchange box, The heat dissipation pipes are respectively bent upwards from the first end and the second end to a common highest position. 10. The semiconductor refrigeration refrigerator according to claim 8, wherein The hot end heat exchange device includes: a hot-end heat exchange box defining an inner chamber for containing a refrigerant in gas-liquid two-phase coexistence, and configured to allow the refrigerant to undergo phase-change heat therein; and a plurality of heat dissipation lines configured to allow refrigerant to flow therein and undergo phase change heat, and The first end formed as an open end of each heat dissipation pipeline communicates with the upper part of the inner cavity of the hot end heat exchange box, Each of the heat dissipation pipes extends obliquely upwards from its first end, and terminates at its second end formed as a closed end. 11. The semiconductor refrigeration refrigerator according to claim 8, wherein The hot end heat exchange device includes: a hot end thermally conductive plate thermally connected to the hot end; and A plurality of heat-dissipating annular heat pipes, one part of each heat-dissipating annular heat pipe is in contact with the heat conducting plate at the hot end for heat exchange, and the other part is in contact with the inner wall of the outer shell of the semiconductor refrigeration refrigerator for heat exchange. 12. The semiconductor refrigeration refrigerator according to claim 8, wherein The hot end heat exchange device includes: a hot end heat conducting plate, which is thermally connected to the hot end; A plurality of heat dissipation heat pipes, one end of each heat dissipation heat pipe is in contact with the heat conduction plate at the hot end for heat exchange; heat dissipation fins arranged on the plurality of heat dissipation heat pipes; and The fan is fixed on the heat dissipation fins by a fastening mechanism, so as to perform forced convection heat dissipation to the heat transferred from the plurality of heat dissipation heat pipes to the heat dissipation fins. 13. The semiconductor refrigeration refrigerator according to claim 8, wherein The hot end heat exchange device includes: The hot-end heat exchange box defines an inner cavity for containing a refrigerant in which gas and liquid coexist, and is configured to allow the refrigerant to undergo phase-change heat therein; a plurality of heat dissipation lines configured to allow refrigerant to flow therein and undergo phase change heat, and The first end formed as an open end of each heat dissipation pipeline communicates with the upper part of the inner cavity of the hot end heat exchange box, Each of the radiating pipes bends and extends obliquely upwards from its first end, and terminates at its second end formed as a closed end; heat dissipation fins arranged on the plurality of heat dissipation pipes; and The fan is fixed on the heat dissipation fins by a fastening mechanism, so as to dissipate the heat transferred from the plurality of heat dissipation pipes to the heat dissipation fins by forced convection.