CN104392988A - Multi-chip integrally packaged LED (Light Emitting Diode) light source module - Google Patents
Multi-chip integrally packaged LED (Light Emitting Diode) light source module Download PDFInfo
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- CN104392988A CN104392988A CN201410714430.XA CN201410714430A CN104392988A CN 104392988 A CN104392988 A CN 104392988A CN 201410714430 A CN201410714430 A CN 201410714430A CN 104392988 A CN104392988 A CN 104392988A
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- Prior art keywords
- light source
- source module
- led
- led light
- positioning framework
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- 238000010438 heat treatment Methods 0.000 claims description 19
- 230000010354 integration Effects 0.000 claims description 16
- 238000004806 packaging method and process Methods 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 13
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The invention discloses a multi-chip integrally packaged LED (Light Emitting Diode) light source module. The LED light source module comprises a positioning frame, a radiating plate and an insulating thin film, wherein the radiating plate is arranged on the lower part of the positioning frame; the insulating film is arranged between the radiating plate and the positioning frame. Since a PCB (Printed Circuit Board) is not required by the multi-chip integrally packaged LED light source module, the production cost of the multi-chip integrally packaged LED light source module of a new structure can be greatly reduced; since welding spots of the LED device face outwards, any device therein is also extremely convenient to disassemble, the disassembly can be performed by only cutting a certain welding spot therein, and the problem that the entire device is required to be heated from the front face together in order to melt the welding spots on the back of an LED patch can be completely solved; thus, the maintenance is more convenient and safer, the yield of a product is improved, and further the production cost of the module is reduced.
Description
Technical field
The present invention relates to LED field, be specially a kind of LED light source module of multi-chip integration packaging.
Background technology
Single led LED power is little, luminous quantity is few, can obtain the power needed for illumination and luminous flux after generally all needing that multiple LED component is combined into containing multiple chip LED module by series connection and mode in parallel.In order to realize the combination of multiple chip, there are two kinds at present by way of realizing: two of light-emitting diode lead-out wires are welded in (direct insertion) in PCB printed board by the form of plug-in unit by the first; Another kind method LED is made the form of paster, and end tin cream being coated in LED paster both sides is extremely gone up by being directly welded in PCB printed board after the fusing of heating tin cream.All a lot of problem can be there is by the LED light source module of the LED light source module of the multi-chip integration packaging of above-mentioned two kinds of method integration and the integrated multi-chip integration packaging of the connection in series-parallel of traditional LED component.
Summary of the invention
The object of the present invention is to provide a kind of LED light source module of multi-chip integration packaging, to solve the problem proposed in above-mentioned background technology.
For achieving the above object, the invention provides following technical scheme: a kind of LED light source module of multi-chip integration packaging, comprise positioning framework, heating panel and insulation film, described heating panel is arranged on positioning framework bottom, is provided with dielectric film between described heating panel and positioning framework.
Preferably, described positioning framework is provided with groove, and the bottom surface of described groove is provided with plural loophole spaced apart, and the corresponding LED paster of each loophole, described LED paster is installed in series in inside grooves.
Preferably, described groove is no less than ten, spaced apart between groove, and the LED paster between adjacent grooves is connected in parallel.
Preferably, described positioning framework, the insulation film position corresponding with on heating panel is respectively equipped with fixing hole, and positioning framework, insulation film and heating panel are fixed together through fixing hole by screw.
Preferably, described positioning framework is at least provided with four fixing holes, is provided with conductive spacer in described fixing hole, and conductive spacer is the power input of multi-chip LED module.
Preferably, the quantity of described LED paster is no less than 20 and distance between adjacent LED paster is between 2 millimeters to 10 millimeters.
Compared with prior art, the invention has the beneficial effects as follows: the LED light source module of this multi-chip integration packaging owing to not needing to use PCB printed circuit board, thus can reduce the production cost of the LED light source module of new construction multi-chip integration packaging greatly; Due to LED component solder joint outwardly, any one device dismantled wherein is also very convenient, only need certain solder joint wherein be split, can avoid the solder joint in order to melt LED paster back need from the problem just together heated in the face of whole device completely, make to safeguard Portable safety more, improve the rate of finished products of product, reduce further the production cost of module.
Accompanying drawing explanation
Fig. 1 is structure vertical view of the present invention;
Fig. 2 is structural representation of the present invention.
In figure: 1 positioning framework, 2 heating panels, 3 insulation films, 4LED paster, 41 terminals, 5 grooves, 6 light penetrating objects, 7 conductive spacers, 8 fixing holes, 9 screws.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1-2, the invention provides a kind of technical scheme: a kind of LED light source module of multi-chip integration packaging, comprise positioning framework 1, heating panel 2 and insulation film 3, heating panel is arranged on positioning framework 1 bottom, due to prior through careful wires design on positioning framework 1, as long as be connected by terminal 41 adjacent for the LED paster 4 in groove, the mode of connection both can adopt traditional mode with tin welding, also can adopt the mode of spot welding, be convenient to very much carry out automated production.Dielectric film 3 is provided with between heating panel 2 and positioning framework 2, positioning framework 3 is provided with groove 5, positioning framework 1, insulation film 3 position corresponding with on heating panel 2 is respectively equipped with fixing hole 8, positioning framework 1 is at least provided with four fixing holes 8, conductive spacer 7 is provided with in fixing hole 8, conductive spacer 7 is the power input of multi-chip LED module, screw 9 passes fixing hole 8 by positioning framework 1, insulation film 3 and heating panel 2 are fixed together, with fixed screw 9 by positioning framework 1, insulation film 3, heating panel 2 is integrally fixed, and the gap of LED paster 4 and insulation film 3 is filled and led up with heat-conducting glue, reach fixed L ED paster 4 and guarantee have good insulation property and less thermal resistance with heating panel 2, the bottom surface of groove 5 is provided with plural loophole 6 spaced apart, the corresponding LED paster 4 of each loophole 6, LED paster 4 is installed in series inner at groove 5, groove 5 is no less than ten, spaced apart between groove 5, LED paster 4 between adjacent grooves 5 is connected in parallel, and the quantity of LED paster 4 is no less than 20 and distance between adjacent LED paster 4 is between 2 millimeters to 10 millimeters.
Although illustrate and describe embodiments of the invention, for the ordinary skill in the art, be appreciated that and can carry out multiple change, amendment, replacement and modification to these embodiments without departing from the principles and spirit of the present invention, scope of the present invention is by claims and equivalents thereof.
Claims (6)
1. a LED light source module for multi-chip integration packaging, comprises positioning framework, heating panel and insulation film, it is characterized in that: described heating panel is arranged on positioning framework bottom, be provided with dielectric film between described heating panel and positioning framework.
2. the LED light source module of a kind of multi-chip integration packaging according to claim 1, it is characterized in that: described positioning framework is provided with groove, the bottom surface of described groove is provided with plural loophole spaced apart, the corresponding LED paster of each loophole, described LED paster is installed in series in inside grooves.
3. the LED light source module of a kind of multi-chip integration packaging according to claim 2, is characterized in that: described groove is no less than ten, spaced apart between groove, and the LED paster between adjacent grooves is connected in parallel.
4. the LED light source module of a kind of multi-chip integration packaging according to claim 1, it is characterized in that: described positioning framework, the insulation film position corresponding with on heating panel is respectively equipped with fixing hole, positioning framework, insulation film and heating panel are fixed together through fixing hole by screw.
5. the LED light source module of a kind of multi-chip integration packaging according to claim 1, it is characterized in that: described positioning framework is at least provided with four fixing holes, is provided with conductive spacer in described fixing hole, conductive spacer is the power input of multi-chip LED module.
6. the LED light source module of a kind of multi-chip integration packaging according to claim 2, is characterized in that: the quantity of described LED paster is no less than 20 and distance between adjacent LED paster is between 2 millimeters to 10 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410714430.XA CN104392988A (en) | 2014-11-28 | 2014-11-28 | Multi-chip integrally packaged LED (Light Emitting Diode) light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410714430.XA CN104392988A (en) | 2014-11-28 | 2014-11-28 | Multi-chip integrally packaged LED (Light Emitting Diode) light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104392988A true CN104392988A (en) | 2015-03-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410714430.XA Pending CN104392988A (en) | 2014-11-28 | 2014-11-28 | Multi-chip integrally packaged LED (Light Emitting Diode) light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104392988A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020035013A1 (en) * | 2018-08-17 | 2020-02-20 | 乐健科技（珠海）有限公司 | Led vehicle light module, manufacturing method therefor, and circuit board for use in led vehicle light module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070145398A1 (en) * | 2005-12-23 | 2007-06-28 | Lg Innotek Co., Ltd | Light emission diode and method of fabricating thereof |
| CN201364711Y (en) * | 2009-03-16 | 2009-12-16 | 深圳市华海诚信电子显示技术有限公司 | LED outdoor lattice screen |
| CN102226504A (en) * | 2011-03-24 | 2011-10-26 | 上海新凯元照明科技有限公司 | Multi-chip integration packaged LED (light emitting diode) light source module and preparation process thereof |
-
2014
- 2014-11-28 CN CN201410714430.XA patent/CN104392988A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070145398A1 (en) * | 2005-12-23 | 2007-06-28 | Lg Innotek Co., Ltd | Light emission diode and method of fabricating thereof |
| CN201364711Y (en) * | 2009-03-16 | 2009-12-16 | 深圳市华海诚信电子显示技术有限公司 | LED outdoor lattice screen |
| CN102226504A (en) * | 2011-03-24 | 2011-10-26 | 上海新凯元照明科技有限公司 | Multi-chip integration packaged LED (light emitting diode) light source module and preparation process thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020035013A1 (en) * | 2018-08-17 | 2020-02-20 | 乐健科技（珠海）有限公司 | Led vehicle light module, manufacturing method therefor, and circuit board for use in led vehicle light module |
| CN110887006A (en) * | 2018-08-17 | 2020-03-17 | 乐健科技（珠海）有限公司 | LED vehicle lamp module and manufacturing method thereof, and circuit board for LED vehicle lamp module |
| CN110887006B (en) * | 2018-08-17 | 2021-12-03 | 丰鹏电子(珠海)有限公司 | LED car lamp module, manufacturing method thereof and circuit board for LED car lamp module |
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Application publication date: 20150304 |
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| RJ01 | Rejection of invention patent application after publication |