CN104401929B - For merging bonding structure and the anchor point structure of bonding wafer - Google Patents
For merging bonding structure and the anchor point structure of bonding wafer Download PDFInfo
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- CN104401929B CN104401929B CN201410667914.3A CN201410667914A CN104401929B CN 104401929 B CN104401929 B CN 104401929B CN 201410667914 A CN201410667914 A CN 201410667914A CN 104401929 B CN104401929 B CN 104401929B
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- 239000011159 matrix material Substances 0.000 claims abstract description 6
- 230000008859 change Effects 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention provides a kind of for merging bonding structure and the anchor point structure of bonding wafer. Comprise for the bonding structure that merges bonding wafer: for bonding framework that the device in framework is isolated from the outside, be arranged in bonding framework for prevent moving component excessive movement stop member and be arranged in the anchor point connecting for bonding in bonding framework; Wherein, described anchor point comprises the matrix structure being made up of multiple anchor point piecemeals, and wherein, each anchor point piecemeal and adjacent anchor point piecemeal in described multiple anchor point piecemeals are separated by shallow trench. For the anchor point structure that merges bonding wafer, original solid anchor is divided into multiple fritters according to the preferred embodiment of the invention, makes thus the number of edges quantitative change of anchor many, thereby the length that makes it possible to carry out effective bonding becomes large, improves thus bond strength.
Description
Technical field
The present invention relates to field of semiconductor manufacture, be specifically related to Micro Electro Mechanical System (Micro-ElectroMechanicalSystems, MEMS) field, more particularly, the present invention relates to a kind of for merging keyAnchor point structure and the bonding structure of synthetic sheet.
Background technology
Along with the extensive use of senser element, motion MEMS device be widely used in mobile phone, automobile,In toy and various wearable device, this motion MEMS device generally need to merge bonding to waferTo form the inertia member of perceive motion parameter and this inertia member is isolated from the outside, ensure device with thisThe Performance And Reliability of part. Fig. 1 schematically show according to prior art for merging bonding wafer(fusionbondingwafer) bonding structure. As shown in Figure 1, for by the device in framework with extraneousThe bonded interface (framework) 10 of isolation, is furnished with excessive movement for preventing moving component thereinStop member 20, and be furnished with the anchor point 30 connecting for bonding. Fig. 2 schematically shows according to existingHave technology for merging the anchor point structure of bonding wafer. As shown in Figure 2, according to prior art for meltingThe structure of closing the anchor point 30 of bonding wafer is generally a complete rectangle or square.
But due to the limitation of technique, the structure of the anchor point 30 of prior art is can only be at the edge of anchor pointPlace carries out effective bonding, and the centre of anchor point can not bonding, and reason is that the centre of anchor point before bonding is than the low 70A in edgeLeft and right, causes the periphery keys that can only formerly contact to be closed, and such bond strength is inadequate, is forming movable partWhen part, part parts will directly drop, if increase exercise parameter, because bond strength can not bear fortuneThe weight of dynamic component and exercise parameter, peeling off so situation can worsen more.
Summary of the invention
Technical problem to be solved by this invention is for there being above-mentioned defect in prior art, and a kind of energy is providedEnough anchor point structure and bonding structures of more effectively realizing the bonding effect that merges bonding wafer.
In order to realize above-mentioned technical purpose, according to a first aspect of the invention, provide a kind of for merging keyThe bonding structure of synthetic sheet, comprising: for bonding framework, layout that the device in framework is isolated from the outsideIn bonding framework for prevent moving component excessive movement stop member and be arranged in bond frameThe anchor point connecting for bonding in frame; Wherein, described anchor point comprises the matrix being made up of multiple anchor point piecemealsStructure, and wherein, each the anchor point piecemeal in described multiple anchor point piecemeals and adjacent anchor point piecemeal byShallow trench separates.
Preferably, described multiple anchor point piecemeal and adjacent anchor point piecemeal are separated by shallow trench.
Preferably, the shape of each the anchor point piecemeal in described multiple anchor point piecemeals is identical, and each anchorPoint piecemeal spaced at equal intervals.
Preferably, each in described multiple anchor point piecemeal is rectangular shape.
According to a second aspect of the invention, provide a kind of for merging the anchor point structure of bonding wafer, its bagDraw together: the matrix structure being formed by multiple anchor point piecemeals, and wherein, each in described multiple anchor point piecemealsIndividual anchor point piecemeal and adjacent anchor point piecemeal are separated by shallow trench.
Preferably, described multiple anchor point piecemeal and adjacent anchor point piecemeal are separated by shallow trench.
Preferably, the shape of each the anchor point piecemeal in described multiple anchor point piecemeals is identical, and each anchorPoint piecemeal spaced at equal intervals.
Preferably, each in described multiple anchor point piecemeal is rectangular shape.
For the anchor point structure that merges bonding wafer, original solid anchor is divided according to the preferred embodiment of the inventionBecomes multiple fritters, make thus the number of edges quantitative change of anchor many, thereby the length that can carry out effective bonding becomes large,Improve thus bond strength.
Brief description of the drawings
By reference to the accompanying drawings, and by reference to detailed description below, will more easily have more complete to the present inventionUnderstanding and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically show according to prior art for merging bonding structure concrete of bonding waferExample.
Fig. 2 schematically show according to prior art for merging anchor point structure concrete of bonding waferExample.
Fig. 3 schematically shows according to the preferred embodiment of the invention for merging the bonding junction of bonding waferThe concrete example of structure.
Fig. 4 schematically shows according to the preferred embodiment of the invention for merging the anchor point knot of bonding waferThe concrete example of structure.
It should be noted that, accompanying drawing is used for illustrating the present invention, and unrestricted the present invention. Note, represent structureAccompanying drawing may not be in proportion draw. And, in accompanying drawing, identical or similar element indicate identical orThe similar label of person.
Detailed description of the invention
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings to thisBright content is described in detail.
Fig. 3 schematically shows according to the preferred embodiment of the invention for merging the bonding junction of bonding waferStructure.
As shown in Figure 3, comprise for the bonding structure that merges bonding wafer according to the preferred embodiment of the invention:For bonding framework 10 that the device in framework is isolated from the outside, be arranged in bonding framework 10 for anti-The only stop member of the excessive movement of moving component and be arranged in connecting for bonding in bonding framework 10Anchor point 40.
Fig. 4 schematically shows according to the preferred embodiment of the invention for merging the anchor point knot of bonding waferStructure.
As shown in Figure 4, according to the preferred embodiment of the invention for merge the anchor point 40 of bonding wafer comprise byThe matrix structure that multiple anchor point piecemeals 41 form. Wherein, each in described multiple anchor point piecemeal 41 withAdjacent piecemeal is separated by shallow trench, and (, all anchor points divide to increase thus the edge length of whole anchor point 40The edge sum of piece 41).
Preferably, as shown in Figure 4, described multiple anchor point piecemeals 41 are separated by shallow trench completely mutually.
Preferably, the shape of each the anchor point piecemeal 41 in described multiple anchor point piecemeals 41 is identical, andEach anchor point piecemeal 41 spaced at equal intervals. Preferably, each in described multiple anchor point piecemeal 41 is squareShape shape; More preferably, for example, each in described multiple anchor point piecemeals 41 is square shape to a stepShape. It should be noted that, for any those of ordinary skill in the art, be understandable that, thoughSo there is shown for the partitioned organization of anchor point and illustrate with identical rectangle piecemeal and equidistant arrangement, but pointDistance between structure and the piecemeal of piece is not limited to respectively rectangle and equidistant arrangement, as other shapes and arrangementAlso can.
Thus, according to the preferred embodiment of the invention for the anchor point structure that merges bonding wafer by original wholeBody anchor is divided into multiple fritters, makes thus the number of edges quantitative change of anchor many, thereby can carry out the length of effective bondingIt is large that degree becomes, and improves thus bond strength.
Further preferably, for manufacture and the processing of anchor point structure, also there are some improvement aspects.
First be, as diaphragm, due to heat oxide film with heat oxide film owing to forming anchor point in prior artGrowth can consume silicon, thus affect anchor point surface smoothness, thus affect bonding. Therefore, the present invention adoptsTEOS (ethyl orthosilicate) oxide-film, the in the situation that of TEOS oxide-film, can not consume silicon, so anchor pointWhole plane be all smooth, be conducive to bonding.
Secondly, prevent in the stop member technique of excessive movement of moving component in formation, of the prior artProcessing procedure is to protect anchor point with oxide-film, and the present invention protects anchor point with photoresistance, on oxide-film, also has lightResistance, the isolated part in the middle of each like this blockage, photoresistance also can be protected.
In addition, it should be noted that, unless stated otherwise or point out, otherwise term " in descriptionOne ", the description such as " second ", " the 3rd " is only for distinguishing each assembly, element, the step of descriptionDeng, instead of for representing logical relation or the ordinal relation etc. between each assembly, element, step.
Be understandable that, although the present invention discloses as above with preferred embodiment, but above-described embodiment alsoNon-in order to limit the present invention. For any those of ordinary skill in the art, do not departing from skill of the present inventionIn art scheme scope situation, all can utilize the technology contents of above-mentioned announcement technical solution of the present invention to be made manyPossible variation and modification, or be revised as the equivalent embodiment of equivalent variations. Therefore, everyly do not depart from thisThe content of bright technical scheme, according to technical spirit of the present invention to any simple modification made for any of the above embodiments,Equivalent variations and modification, all still belong in the scope of technical solution of the present invention protection.
Claims (10)
1. for merging a bonding structure for bonding wafer, it is characterized in that comprising: for by frameworkBonding framework that device is isolated from the outside, be arranged in bonding framework for preventing the motion of moving componentAmount stop member and be arranged in bonding framework for bonding connect anchor point; Wherein, described anchorPoint comprises matrix structure be made up of multiple anchor point piecemeals, and wherein, in described multiple anchor point piecemeals oftenAn anchor point piecemeal and adjacent anchor point piecemeal are separated by shallow trench each other.
2. according to claim 1ly it is characterized in that institute for merging the bonding structure of bonding waferState bonding structure for Micro Electro Mechanical System.
3. according to claim 1 and 2ly it is characterized in that for merging the bonding structure of bonding wafer,Described multiple anchor point piecemeal is spaced from each other by shallow trench each other completely.
4. according to claim 1 and 2ly it is characterized in that for merging the bonding structure of bonding wafer,The shape of each the anchor point piecemeal in described multiple anchor point piecemeal is identical, and each anchor point piecemeal equidistantly everyOpen.
5. according to claim 1 and 2ly it is characterized in that for merging the bonding structure of bonding wafer,Each in described multiple anchor point piecemeal is rectangular shape.
6. for merging an anchor point structure for bonding wafer, it is characterized in that comprising: by multiple anchor point piecemealsThe matrix structure of composition, and wherein, each the anchor point piecemeal and adjacent in described multiple anchor point piecemealsAnchor point piecemeal is spaced by shallow trench.
7. according to claim 6ly it is characterized in that institute for merging the anchor point structure of bonding waferState anchor point structure for Micro Electro Mechanical System.
8. according to claim 6ly it is characterized in that institute for merging the anchor point structure of bonding waferStating multiple anchor point piecemeals is separated by shallow trench completely mutually.
9. according to claim 6ly it is characterized in that institute for merging the anchor point structure of bonding waferThe shape of stating each the anchor point piecemeal in multiple anchor point piecemeals is identical, and each anchor point piecemeal spaced at equal intervals.
10. according to claim 6ly it is characterized in that for merging the anchor point structure of bonding wafer,Each in described multiple anchor point piecemeal is rectangular shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410667914.3A CN104401929B (en) | 2014-11-20 | 2014-11-20 | For merging bonding structure and the anchor point structure of bonding wafer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410667914.3A CN104401929B (en) | 2014-11-20 | 2014-11-20 | For merging bonding structure and the anchor point structure of bonding wafer |
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| Publication Number | Publication Date |
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| CN104401929A CN104401929A (en) | 2015-03-11 |
| CN104401929B true CN104401929B (en) | 2016-05-11 |
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| CN201410667914.3A Active CN104401929B (en) | 2014-11-20 | 2014-11-20 | For merging bonding structure and the anchor point structure of bonding wafer |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1198013A (en) * | 1997-02-21 | 1998-11-04 | 日本电气株式会社 | Semiconductor device and method of fabricating the same |
| CN101355038A (en) * | 2007-07-27 | 2009-01-28 | 李刚 | Method and chip for integrating micro electromechanical system device and integrated circuit |
| CN103839844A (en) * | 2014-03-10 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | Encapsulating method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6744114B2 (en) * | 2001-08-29 | 2004-06-01 | Honeywell International Inc. | Package with integrated inductor and/or capacitor |
| US20080181558A1 (en) * | 2007-01-31 | 2008-07-31 | Hartwell Peter G | Electronic and optical circuit integration through wafer bonding |
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2014
- 2014-11-20 CN CN201410667914.3A patent/CN104401929B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1198013A (en) * | 1997-02-21 | 1998-11-04 | 日本电气株式会社 | Semiconductor device and method of fabricating the same |
| CN101355038A (en) * | 2007-07-27 | 2009-01-28 | 李刚 | Method and chip for integrating micro electromechanical system device and integrated circuit |
| CN103839844A (en) * | 2014-03-10 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | Encapsulating method |
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| CN104401929A (en) | 2015-03-11 |
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