CN104411100A - Making method of substrate with support - Google Patents
Making method of substrate with support Download PDFInfo
- Publication number
- CN104411100A CN104411100A CN201410781889.1A CN201410781889A CN104411100A CN 104411100 A CN104411100 A CN 104411100A CN 201410781889 A CN201410781889 A CN 201410781889A CN 104411100 A CN104411100 A CN 104411100A
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- China
- Prior art keywords
- supporting plate
- substrate
- manufacture method
- adhesion layer
- marginal zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 title claims abstract description 140
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000000463 material Substances 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical group [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000012260 resinous material Substances 0.000 description 2
- 230000003319 supportive effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002998 adhesive polymer Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a making method of a substrate with a support. The making method comprises the following steps: forming the substrate, wherein the substrate comprises an effective zone for forming a device and an edge zone positioned at the periphery of the effective zone; forming a support plate in a shape corresponding to that of the edge zone of the substrate, wherein the support plate comprises a binding face matched with the substrate; binding and fixing the binding face of the support plate with the edge zone of the substrate. The making method has the benefits that the support plate is bonded with the substrate, so that the support plate has a function of reinforcing the edge of the substrate, and accordingly, can prevent the substrate from warping to a certain extent; the support plate and the substrate are bonded with one another and do not need to be disassembled. Compared with the mode of disassembling the bracket in the prior art, the making method can reduce the possibility that the substrate is damaged and broken.
Description
Technical field
The present invention relates to field of semiconductor package, be specifically related to a kind of manufacture method of substrate of belt supporting frame.
Background technology
Along with the development of integrated circuit technique, electronic product is more and more to miniaturized, intellectuality, high-performance and high reliability future development.And integrated antenna package not only directly affects the performance of integrated circuit, electronic module and even complete machine, but also govern the miniaturization of whole electronic system, low cost and reliability.Progressively reduce in integrated circuit (IC) wafer size, when integrated level improves constantly, electronics industry proposes more and more higher requirement to integrated antenna package technology.These requirements cause the thickness of base plate for packaging more and more thinner.
But the thinning meeting of substrate thickness causes occurring in encapsulation process that the probability of the problem such as warpage and the breakage of substrate edges of boards increases.Warpage and the damaged meeting of substrate be made troubles and risk to follow-up encapsulation process, and then affect product yield.
Summary of the invention
The problem that the present invention solves is to provide a kind of manufacture method of substrate of belt supporting frame, to reduce substrate warp and breakage odds as far as possible.
For solving the problem, the invention provides a kind of manufacture method of substrate of belt supporting frame, comprising:
Form substrate, described substrate comprises the effective district for the formation of device, and is positioned at the marginal zone around described effective district;
Form the supporting plate corresponding with described substrate edges district shape, described supporting plate comprises the binding face for fitting with substrate;
Fitted in the marginal zone of the binding face of supporting plate and described substrate fixing.
Optionally, the step forming supporting plate also comprises: form the supporting plate comprising resin material.
Optionally, the step forming supporting plate also comprises: the supporting plate forming resin material, or, form the resin plate that surface coverage has Copper Foil, or, form resin superposes pressing supporting plate with Copper Foil compartment of terrain.
Optionally, the step forming supporting plate comprises:
The supporting plate mould corresponding with described substrate edges district shape is provided;
In described supporting plate mould, fill the supporting plate material of melting, form described supporting plate with injection moulding;
After the described supporting plate of formation, remove described mould.
Optionally, the step forming supporting plate comprises:
One plate-shaped carrier plate material is provided;
Remove the supporting plate material corresponding to the effective district of substrate, remaining supporting plate material forms described supporting plate.
Optionally, adopt milling cutter cutting, the mode of punching press or laser cutting removes supporting plate material corresponding to the effective district of substrate.
Optionally, the step forming substrate comprises:
Effective district of described substrate comprises multiple separate effectively trivial piece, multiple effectively trivial piece of arrangement in array-like;
Described marginal zone be located at each effectively trivial piece around;
The step forming supporting plate comprises: make described supporting plate have multiple openwork part corresponding to described effectively trivial piece.
Optionally, supporting plate and baseplate-laminating fixing step is made to comprise:
Arrange adhesion layer at the binding face of described supporting plate, described supporting plate is fitted fixing by the marginal zone of described adhesion layer and described substrate.
Optionally, the step arranging adhesion layer comprises:
Gluing on the binding face of described supporting plate;
Make described adhesive curing to form described adhesion layer.
Optionally, the step arranging adhesion layer also comprises:
Described adhesion layer covers layer protecting film;
The step that supporting plate is fitted by the marginal zone of described adhesion layer and described substrate also comprises:
Remove described diaphragm to expose described adhesion layer.
Compared with prior art, technical scheme of the present invention has the following advantages:
By providing the supporting plate corresponding with substrate edges district shape, by described supporting plate and baseplate-laminating, such supporting plate just serves the effect of reinforcing substrate edges district, and then can prevent substrate generation warpage to a certain extent.Supporting plate and substrate bonded to each other and need not remove, relative to the mode of striking in prior art, the present invention also can reduce substrate and sustain damage, produces damaged probability.
Further, the supporting plate of providing package resinous material can reduce the probability of substrate generation warpage further, because the heat absorption rate of resin material is less, the part that substrate contacts with supporting plate is absorbed heat relatively less, whole different base board parts by thermal difference less, such substrate is not easy, because being heated inequality, buckling deformation occurs.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of manufacture method one embodiment of the substrate of belt supporting frame of the present invention;
Fig. 2 to Fig. 9 is the structural representation of each step in manufacture method one embodiment of the substrate of belt supporting frame of the present invention.
Embodiment
Easily there is buckling deformation in existing substrate, so can install a whole plate at the back side of substrate in prior art.But the protection of this whole plate to substrate is inadequate; or can easily cause board warp deformation to increase the weight of the deformation extent of substrate because this whole plate easily causes basal plate heated uneven; and whole plate needs to remove after a procedure, demolishing process easily causes substrate to sustain damage.
Therefore, the invention provides a kind of manufacture method of substrate of belt supporting frame, to improve substrate warp and breakage odds as far as possible.
For enabling above-mentioned purpose of the present invention, feature and advantage more become apparent, and are described in detail specific embodiments of the invention below in conjunction with accompanying drawing.
With reference to figure 1, it is the schematic flow sheet of manufacture method one embodiment of the substrate of belt supporting frame of the present invention.The manufacture method of described belt supporting frame substrate comprises the following steps in the present embodiment:
S101, form substrate, described substrate comprises the effective district for the formation of device, and is positioned at the marginal zone around described effective district;
S102, forms the supporting plate corresponding with described substrate edges district shape, and described supporting plate comprises the binding face for fitting with substrate;
S103, makes the marginal zone of the binding face of supporting plate and described substrate fit fixing.
It should be noted that, the present invention is not limited in any way the sequencing between step S101 and step S102.Because provide the step of the step of substrate and formation supporting plate not conflict, can carry out simultaneously, also can successively carry out.
Below in conjunction with accompanying drawing, each step is described further.
First perform step S101, as shown in Figure 2, provide substrate 100, described substrate 100 comprises the effective district 110 being formed with semiconductor device, and is positioned at the marginal zone 120 around described effective district 110.
Please continue to refer to Fig. 2, in the present embodiment, effective district 110 of described substrate 100 comprises some separate effectively trivial piece 10, the arrangement in array-like between described effectively trivial piece 10.Accordingly, described marginal zone 120 around ground be located at each effectively trivial piece 10 around.
But those skilled in the art it should be understood that, in the present embodiment, the shape in effective district and division rule should set according to actual conditions, accordingly, the shape of marginal zone 120 and scope also can change along with the change in effective district 110, therefore the present invention to the shape of effectively district 110 and marginal zone 120 be not limited in any way.
Meanwhile, in the present embodiment, provide thickness range at the substrate 100 of 65 ~ 115 microns; Such as, thickness can be provided at the substrate 100 of 100 microns.But it should be noted that, above parameter is only one embodiment of the present of invention.The actual (real) thickness of substrate 100 should be as the criterion with the demand of actual conditions, and the present invention is not construed as limiting this.
In conjunction with reference to figure 3 and Fig. 4, perform step S102, form the supporting plate 200 (with reference to figure 4) corresponding with described substrate frontside edge district 120 shape, described supporting plate 200 comprises the binding face for fitting with substrate 100, in subsequent step, described supporting plate 200 is fitted by described binding face and substrate 100.
In the present embodiment, can the supporting plate 200 of providing package resinous material.
The thermal conductivity of this material is lower, and caloric receptivity is few, and the heat transmission of such supporting plate 200 pairs of substrates 100 is also less, and then substrate 100 regional area can be reduced to a certain extent to be heated too much and the problem of deformation warpage occurs.
Meanwhile, resin material lighter weight and easily processing, also simplifies manufacture craft to a certain extent.
Concrete, the supporting plate 200 as BT resin or epoxide resin material can be adopted.
Concrete, can form resin superposes pressing supporting plate 200 with Copper Foil compartment of terrain in the present embodiment, that is, the supporting plate 200 in the present embodiment is adopt sheet-like resin and Copper Foil interval to superpose the force fit plate formed.This force fit plate structure is closer to the structure of substrate 100, because existing substrate is generally the laminated construction of semi-conducting material and metal material, force fit plate structure in the present embodiment is not only closer to the structure of substrate 100 self, and its coefficient of expansion is also more close to substrate 100, such supporting plate 200 differs less with the coefficient of expansion between substrate 100, and the probability that buckling deformation occurs because being heated inequality substrate 100 is less.
Meanwhile, the mechanical strength that sheet-like resin and Copper Foil interval superpose the force fit plate formed is higher, and such supporting plate 200 pairs of substrates 100 also have better supportive.
But the structure of the present invention to the described supporting plate 200 containing resin is not construed as limiting, and in other embodiments of the invention, can also adopt the supporting plate that resin is formed, namely be the supporting plate of resin material; Or, surface coverage can also be adopted to have the resin plate of Copper Foil as being supporting plate 200.
Concrete, in the present embodiment, described supporting plate 200 can be formed in the following ways:
With reference to figure 3, provide a plate-shaped carrier plate material 210;
With reference to figure 4, remove the supporting plate material 210 corresponding to the effective district 110 of substrate, remaining supporting plate material 210 is just corresponding with described substrate frontside edge district 120 shape, and then forms described supporting plate 200.As mentioned before, effective district 110 in substrate 100 in the present embodiment comprises some separate effectively trivial piece 10, therefore the supporting plate material 210 corresponding to the effective district 110 of substrate is removed in the present embodiment, to form some empty window regions 201 in supporting plate material 210 so that exposed in effective district 110 after fitting with substrate 100.
Concrete, the mode that milling cutter can be adopted to cut removes the supporting plate material 210 corresponding to the effective district of substrate.The cutting accuracy of this mode is higher, and the trimming in the empty window region 201 of formation is more neat.
But the present invention is not construed as limiting the concrete supporting plate material 210 adopting which kind of mode to remove corresponding to the effective district of substrate, in other embodiments of the invention, can also adopt the mode of punching press or laser cutting, but the present invention is not construed as limiting to this.
Meanwhile, the present invention to how forming the supporting plate 200 corresponding with described substrate frontside edge district 120 shape is also not construed as limiting.In other embodiments of the invention, such as, as mentioned before, when adopting resin to form described supporting plate, described corresponding with described substrate frontside edge district 120 shape supporting plate 200 can also be formed: first provide the supporting plate mould corresponding with described substrate edges district 120 shape by the mode of injection moulding, then the supporting plate material of melting is filled in the mold, to form described supporting plate 200; After the described supporting plate of formation, remove described mould.Can find out, the method for this injection moulding can form described supporting plate 200 equally.Therefore, the present invention is not construed as limiting the supporting plate material 210 how formed corresponding to the effective district of substrate, specifically should determine according to actual conditions such as the structures of the material of described supporting plate, supporting plate.
In the present embodiment, provide thickness range at the supporting plate of 200 ~ 400 microns.Such as, thickness can be provided to be the supporting plate 200 of 300 microns, enough support force supporting substrates 100 can be had at the supporting plate of this thickness, also be unlikely to blocked up simultaneously.
Perform step S103, fitted in the marginal zone 120 of the binding face of supporting plate 200 and described substrate 100 fixing.
Concrete, can be fitted in the marginal zone 120 of the binding face of supporting plate 200 and described substrate 100 by following steps fixing:
With reference to figure 5, the binding face of described supporting plate 200 arranges adhesion layer 220; Described supporting plate 200 is fitted fixing by described adhesion layer 220 and the marginal zone 120 of described substrate 100.
Concrete, the step arranging adhesion layer 220 comprises:
Gluing on the binding face of described supporting plate 200; The available material of glue used by gluing has multiple, can adopt UV glue in the present invention's preferred embodiment.UV glue be a kind of can to the aitiogenic glueing material of the UV-irradiation of special wavelength.UV glue can be divided into two kinds according to the change of viscosity after UV-irradiation, one is that UV solidifies glue, namely living radical or cation is produced after the light trigger in material or sensitising agent absorb ultraviolet light under ultraviolet irradiation, trigger monomer is polymerized, be cross-linked and connect a chemical reaction, ultraviolet cured adhesive is made to be solid-state by liquid conversion within the several seconds, thus the body surface bonding that will be in contact with it; Another kind is UV glue is very high without viscosity during Ultraviolet radiation, and the crosslinking chemical bond after UV-irradiation in material is interrupted and causes viscosity to decline to a great extent or disappear.
The glue adopted in the present embodiment is that UV solidifies glue.
But the present invention is not construed as limiting glue, in other embodiments of the invention, other glue such as BAC adhesive polymer polymer also may be used for forming described adhesion layer 220.
After gluing, make described adhesive curing to form described adhesion layer 220.
With reference to figure 6, in the present embodiment, in order to protect the adhesion layer 220 of formation, preventing described adhesion layer 220 from losing viscosity because to be exposed in production environment adhering dust or to be collided with etc., in the present embodiment, described adhesion layer 220 covering layer protecting film 230;
When supporting plate 200 is fitted with substrate 100, described diaphragm 230 is removed to expose described adhesion layer 220.
After this, supporting plate 200 is made to be fitted with the marginal zone 120 of described substrate 100 by described adhesion layer 220.
With reference to figure 7, it is the structural representation that supporting plate 200 and substrate 100 are fitted.As mentioned before, the diaphragm 230 now in the present embodiment is removed, and supporting plate 200 is fitted with the marginal zone 120 of described substrate 100 by described adhesion layer 220.Supporting plate 200 now can play the effect supporting fixing base 100, prevents substrate 100 to be out of shape warpage, or sustains damage.Meanwhile, supporting plate 200 is bonded to each other and need not remove with substrate 100, and relative to the mode of striking in prior art, the present invention also can reduce substrate and sustain damage, produces damaged probability.
With reference to figure 8 and Fig. 9, after supporting plate 200 and substrate 100 are fitted, further comprising the steps of:
According to effectively trivial piece 10 in described substrate 100, laminating after-poppet plate and substrate are split (please refer to the cut-off rule 11 in Fig. 8), and then the substrate 100 containing multiple effectively trivial piece 10 is split encapsulation unit 20 (with reference to figure 9) in some fritters together with supporting plate 200, be the carrying out of conveniently follow-up encapsulation step like this, but the present invention is not construed as limiting this step.
In addition, the present invention also provides a kind of substrate of belt supporting frame, with reference to the substrate structural representation in the present embodiment that figure 7 is described belt supporting frame, comprising:
Substrate 100, the concrete structure of substrate 100 can in conjunction with reference to figure 2, and described substrate 100 comprises the effective district 110 for the formation of device, and is positioned at the marginal zone 120 around described effective district 110;
In the present embodiment, effective district 110 of described substrate 100 comprises some separate effectively trivial piece 10, the arrangement in array-like between described effectively trivial piece 10.Accordingly, described marginal zone 120 be located at each effectively trivial piece 10 around.
But those skilled in the art it should be understood that, in the present embodiment, the shape in effective district and division rule should set according to actual conditions, accordingly, the shape of marginal zone 120 and scope also can change along with the change in effective district 110, therefore the present invention to the shape of effectively district 110 and marginal zone 120 be not limited in any way.
In the present embodiment, the thickness range of described substrate is at 65 ~ 115 microns.Such as, thickness can be provided at the substrate 100 of 100 microns.But it should be noted that, above parameter is only one embodiment of the present of invention.The actual (real) thickness of substrate 100 should be as the criterion with the demand of actual conditions, and the present invention is not construed as limiting this.
The supporting plate 200 corresponding with marginal zone 120 shape of described substrate 100, described supporting plate 200 comprises the binding face for fitting with substrate 100;
In the present embodiment, described supporting plate 200 comprises resin material.
The thermal conductivity of this material is lower, and caloric receptivity is few, and the heat transmission of such supporting plate 200 pairs of substrates 100 is also less, and then substrate 100 regional area can be reduced to a certain extent to be heated too much and the problem of deformation warpage occurs.
Meanwhile, resin material lighter weight and easily processing, also simplifies manufacture craft to a certain extent.
Concrete, can be the supporting plate 200 of BT resin or epoxide resin material.
Concrete, the supporting plate 200 in the present embodiment is resin superposes pressing supporting plate 200 with Copper Foil compartment of terrain.That is, the supporting plate 200 in the present embodiment is adopt sheet-like resin and Copper Foil interval to superpose the force fit plate formed.This force fit plate structure is closer to the structure of substrate 100, because existing substrate is generally the laminated construction of semi-conducting material and metal material, force fit plate structure in the present embodiment is not only closer to the structure of substrate 100 self, and its coefficient of expansion is also more close to substrate 100, such supporting plate 200 differs less with the coefficient of expansion between substrate 100, and the probability that buckling deformation occurs because being heated inequality substrate 100 is less.
Meanwhile, the mechanical strength that sheet-like resin and Copper Foil interval superpose the force fit plate formed is higher, and such supporting plate 200 pairs of substrates 100 also have better supportive.
But the structure of the present invention to the described supporting plate 200 containing resin is not construed as limiting, and in other embodiments of the invention, described supporting plate 200 can also be the supporting plate that resin is formed, and is namely the supporting plate of resin material; Or, can also be that surface coverage has the resin plate of Copper Foil as being supporting plate 200.
In the present embodiment, the thickness of described supporting plate 200 is at 200 ~ 400 microns.Such as, thickness can be provided to be the supporting plate 200 of 300 microns, enough support force supporting substrates 100 can be had at the supporting plate 200 of this thickness, also be unlikely to blocked up simultaneously.
In the present embodiment, the supporting plate 200 of described supporting plate 200 for being formed through cutting or punching press.But the present invention forms described supporting plate 200 to which kind of mode of employing and is not construed as limiting.In other embodiments of the invention, described supporting plate 200 also can be the supporting plate formed by injection moulding.
The binding face of described supporting plate 200 is provided with adhesion layer 220, described supporting plate 200 is fitted with the marginal zone 120 of described substrate 100 by described adhesion layer 220, that is, supporting plate 200 and the marginal zone 120 of substrate 100 are combined and then play the effect supporting fixing described substrate 100, supporting plate 200 exposes effective district 110 of substrate 100 simultaneously, can not hinder the carrying out of follow-up encapsulation step like this.
In addition, manufacture method of the present invention can be, but not limited to the substrate forming belt supporting frame of the present invention.
Although the present invention discloses as above, the present invention is not defined in this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.
Claims (10)
1. a manufacture method for the substrate of belt supporting frame, is characterized in that, comprising:
Form substrate, described substrate comprises the effective district for the formation of device, and is positioned at the marginal zone around described effective district;
Form the supporting plate corresponding with described substrate edges district shape, described supporting plate comprises the binding face for fitting with substrate;
Fitted in the marginal zone of the binding face of supporting plate and described substrate fixing.
2. manufacture method as claimed in claim 1, is characterized in that, the step forming supporting plate comprises: form the supporting plate comprising resin material.
3. manufacture method as claimed in claim 1 or 2, is characterized in that, the step forming supporting plate comprises: the supporting plate forming resin material, or, form the resin plate that surface coverage has Copper Foil, or, form resin superposes pressing supporting plate with Copper Foil compartment of terrain.
4. manufacture method as claimed in claim 1, is characterized in that, the step forming supporting plate comprises:
The supporting plate mould corresponding with described substrate edges district shape is provided;
In described supporting plate mould, fill the supporting plate material of melting, form described supporting plate with injection moulding;
After the described supporting plate of formation, remove described mould.
5. manufacture method as claimed in claim 1, is characterized in that, the step forming supporting plate comprises: provide a plate-shaped carrier plate material;
Remove the supporting plate material corresponding to the effective district of substrate, remaining supporting plate material forms described supporting plate.
6. manufacture method as claimed in claim 5, is characterized in that, adopts milling cutter cutting, the mode of punching press or laser cutting removes supporting plate material corresponding to the effective district of substrate.
7. manufacture method as claimed in claim 1, is characterized in that, the step forming substrate comprises: effective district of described substrate comprises multiple separate effectively trivial piece, multiple effectively trivial piece of arrangement in array-like;
Described marginal zone be located at each effectively trivial piece around;
The step forming supporting plate comprises: make described supporting plate have multiple openwork part corresponding to described effectively trivial piece.
8. manufacture method as claimed in claim 1, is characterized in that, supporting plate and baseplate-laminating fixing step are comprised:
Arrange adhesion layer at the binding face of described supporting plate, described supporting plate is fitted fixing by the marginal zone of described adhesion layer and described substrate.
9. manufacture method as claimed in claim 1, it is characterized in that, the step arranging adhesion layer comprises:
Gluing on the binding face of described supporting plate;
Make described adhesive curing to form described adhesion layer.
10. manufacture method as claimed in claim 9, it is characterized in that, the step arranging adhesion layer also comprises:
Described adhesion layer covers layer protecting film;
The step that supporting plate is fitted by the marginal zone of described adhesion layer and described substrate also comprises:
Remove described diaphragm to expose described adhesion layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410781889.1A CN104411100A (en) | 2014-12-16 | 2014-12-16 | Making method of substrate with support |
| US14/967,986 US20160172313A1 (en) | 2014-12-16 | 2015-12-14 | Substrate with a supporting plate and fabrication method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410781889.1A CN104411100A (en) | 2014-12-16 | 2014-12-16 | Making method of substrate with support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104411100A true CN104411100A (en) | 2015-03-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410781889.1A Pending CN104411100A (en) | 2014-12-16 | 2014-12-16 | Making method of substrate with support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104411100A (en) |
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|---|---|---|---|---|
| CN107089641A (en) * | 2017-03-07 | 2017-08-25 | 深南电路股份有限公司 | The preparation method and Related product of a kind of ultra-thin packed substrate |
| CN111710611A (en) * | 2020-06-09 | 2020-09-25 | 上海申和热磁电子有限公司 | Method for reducing fracture of central area of copper-clad ceramic substrate |
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Address after: Jiangsu province Nantong City Chongchuan road 226006 No. 288 Applicant after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant before: Fujitsu Microelectronics Co., Ltd., Nantong |
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Application publication date: 20150311 |