CN104423082A - Method for manufacturing liquid crystal panel and substrate - Google Patents

Abstract

The invention relates to a method for manufacturing a liquid crystal panel and a substrate, which comprises the following steps: providing a first mother substrate and a second mother substrate, wherein each first mother substrate and each second mother substrate respectively define a plurality of sub-substrate areas, an area between two adjacent sub-substrate areas of the same mother substrate is a cutting area, the sub-substrate areas of the first mother substrate and the second mother substrate are in one-to-one correspondence with each other, the sub-substrate area of the second mother substrate is larger than the corresponding sub-substrate area of the first mother substrate, and a peripheral circuit area is arranged on a larger part of the second mother substrate; attaching a first anti-corrosion adhesive to the peripheral circuit region; aligning and attaching the two mother substrates, so that the sub-substrate areas of the first mother substrate and the second mother substrate are overlapped and aligned, and the first anti-corrosion glue is positioned between the first mother substrate and the second mother substrate; and corroding the cutting area from the side, far away from the second mother substrate, of the first mother substrate by using cutting liquid to complete the separation of each sub-substrate area in the two mother substrates. The sub-substrate area obtained by the manufacturing method, namely the liquid crystal panel in each product, has better quality.

Description

Method for manufacturing liquid crystal panel and substrate

technical field

The invention relates to a method for manufacturing a liquid crystal panel and a substrate.

Background technique

Generally, a liquid crystal panel includes a thin film transistor array substrate and a color filter substrate disposed opposite to each other, and a liquid crystal layer sandwiched between the two substrates. In order to increase the yield and reduce the production cost, in the manufacturing process, a plurality of thin film transistor array units are usually fabricated on one mother substrate, and a plurality of color filter units are fabricated on another mother substrate; The substrates are attached to each other, so that the plurality of thin film transistor array units are aligned with the color filter units, thereby forming a plurality of uncut liquid crystal panels.

However, during the slicing process of cutting the surface of the mother substrate with a diamond knife, debris from the mother substrate is splashed, which easily pollutes the liquid crystal panel. At the same time, the notch of the diamond knife is relatively shallow, and the fracture lines of the substrate will extend to the display area of the liquid crystal panel, thereby causing the liquid crystal panel to be scrapped.

Contents of the invention

In view of this, it is necessary to provide a method for manufacturing a liquid crystal panel with a better splitting effect of each liquid crystal panel on a mother substrate and a method for manufacturing a substrate with a better splitting effect.

A method for manufacturing a liquid crystal panel, which includes the following steps: providing a first mother substrate and a second mother substrate, each of the first mother substrate and the second mother substrate respectively defines a plurality of sub-substrate regions, and two adjacent sub-substrate regions are located on the same mother substrate. The area between the substrate areas is a cutting area, and there is a one-to-one correspondence between the sub-substrate areas of the first mother substrate and the second mother substrate, wherein the sub-substrate area of the second mother substrate is larger than the corresponding sub-substrate area of the first mother substrate, To set the peripheral circuit area on the large part; paste the first anti-corrosion glue on the peripheral circuit area; align and bond the two mother substrates so that the gap between the first mother substrate and the sub-substrate area of the second mother substrate is Lamination and alignment, and the first anti-corrosion glue is located between the first mother substrate and the second mother substrate; using cutting fluid to etch the cutting area from the side of the first mother substrate far away from the second mother substrate to complete the two mother substrates Separation of each sub-substrate area in.

A substrate manufacturing method, which includes the following steps: providing a first mother substrate and a second mother substrate, each of the first mother substrate and the second mother substrate defines a plurality of sub-substrate regions, and two adjacent sub-substrate regions are located on the same mother substrate. The area between the substrate areas is a cutting area, and the cutting areas of each first mother substrate and the second mother substrate correspond to each other; the first anti-corrosion adhesive is pasted on the sub-substrate area of the second mother substrate; Aligning the substrates so that the first mother substrate and the sub-substrate area of the second mother substrate are stacked and aligned, and the first anti-corrosion glue is located between the first mother substrate and the second mother substrate; The side of the first mother substrate away from the second mother substrate is etched and cut to complete the separation of the regions of the sub-substrates in the two mother substrates.

Compared with the prior art, the above-mentioned manufacturing method of the liquid crystal panel and the substrate uses the cutting fluid to corrode the cutting area, thereby completing the separation of each sub-substrate area in the mother substrate, that is, the separation of multiple liquid crystal panels, and there is no broken mother substrate in this process. Chip splashing is not affected by the depth of the notch, so the separation effect of each sub-substrate area in the middle is better.

Description of drawings

FIG. 1 is a flowchart of an embodiment of a method for manufacturing a liquid crystal panel of the present invention.

FIG. 2 is a three-dimensional schematic diagram of a first mother substrate and a second mother substrate of the liquid crystal panel in the first embodiment.

FIG. 3 is a schematic perspective view of setting sealant on the second mother substrate before laminating the second mother substrate and the first mother substrate in the first embodiment.

FIG. 4 is a three-dimensional schematic view of the first anti-corrosion adhesive provided on the second motherboard shown in FIG. 3 .

FIG. 5 is a three-dimensional schematic diagram of liquid crystal dripping on the second mother substrate shown in FIG. 4 .

FIG. 6 is a three-dimensional schematic view of the first mother substrate and the second mother substrate of the liquid crystal panel shown in FIG. 5 after bonding.

FIG. 7 is a sectional view of VII-VII in FIG. 6 .

FIG. 8 is a schematic diagram of disposing a second anti-corrosion glue on the sub-substrate region of the first mother substrate of the liquid crystal panel shown in FIG. 7 .

FIG. 9 is a schematic diagram of disposing cutting fluid in the cutting area of the first mother substrate of the liquid crystal panel shown in FIG. 8 .

FIG. 10 is a schematic diagram of the separation of sub-substrate regions in the cut regions of the first mother substrate and the second mother substrate of the liquid crystal panel shown in FIG. 9 under the action of cutting liquid.

FIG. 11 is a flowchart of another embodiment of the manufacturing method of the substrate of the present invention.

FIG. 12 is a schematic perspective view of a first mother substrate and a second mother substrate in a second embodiment of the substrate of the present invention.

FIG. 13 is a schematic perspective view of setting patterns on the second mother substrate before bonding the second mother substrate and the first mother substrate shown in FIG. 12 .

FIG. 14 is a three-dimensional schematic view of disposing the first anti-corrosion adhesive and the second anti-corrosion adhesive on the first motherboard and the second motherboard shown in FIG. 13 .

FIG. 15 is a schematic perspective view of the first mother substrate and the second mother substrate in FIG. 14 after lamination.

Fig. 16 is a sectional view of XVI-XVI in Fig. 15 .

FIG. 17 is a schematic diagram of the separation of the sub-substrate regions under the action of the cutting fluid in the cutting regions of the first mother substrate and the second mother substrate shown in FIG. 16 .

Description of main component symbols

first motherboard 310, 410 second motherboard 320, 420 Daughter substrate area of the first mother substrate 311, 411 Substrate area of the second mother substrate 321, 421 Cutting area of the first mother substrate 313, 413 Cutting area of the second motherboard 323, 423 Frame glue setting area of the second motherboard 322 peripheral circuit area 324 pattern 419, 429 The first anti-corrosion glue 325, 425 Plastic frame 326 display area 327 containment space 328 liquid crystal 329 The second anti-corrosion glue 319,415 nozzle 500 cutting fluid 501, 601

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Detailed ways

Please refer to Figure 1 and Figure 2. In the first embodiment of the present invention, the liquid crystal panel manufacturing method includes the following steps: step S21, providing a first mother substrate and a second mother substrate, each of the first mother substrate and the second mother substrate defines a plurality of sub-substrate regions, located on the same The area between two adjacent sub-substrate areas of the mother substrate is a cutting area; step S22, attaching the first anti-corrosion glue to the peripheral circuit area of the sub-substrate area of the second mother substrate; step S23, the first mother substrate and The second mother substrate is aligned and bonded, the first mother substrate and the sub-substrate area of the second mother substrate are laminated and aligned, and the first anti-corrosion glue is located between the first mother substrate and the second mother substrate; step S24 The cutting area is corroded by cutting fluid to complete the separation of the regions of the sub-substrates in the two mother substrates. Wherein, the detailed description of each step is as follows.

Please refer to Figure 2 and Figure 3. Step S21, providing a first mother substrate 310 and a second mother substrate 320, each of the first mother substrate 310 and the second mother substrate 320 respectively defines a plurality of sub-substrate regions 311, 321, which are located on two adjacent sides of the same mother substrate 310, 320 The area between the two sub-substrate areas 311 , 321 is the cutting area 313 , 323 . The step S21 is specifically as follows.

A first motherboard 310 is provided. The first mother substrate 310 is a color filter mother substrate, which includes a plurality of sub-substrate regions 311 distributed in a matrix, and a color filter unit is disposed in each sub-substrate region 321 . Every two adjacent sub-substrate regions 311 are defined as cutting regions 313 .

A second motherboard 320 is provided. The second mother substrate 320 is a thin film transistor array mother substrate, which includes a plurality of sub-substrate regions 321 distributed in a matrix. A thin film transistor array unit is disposed in each sub-substrate region 321 . Every two adjacent sub-substrate regions 321 are defined as cutting regions 323 . Each sub-substrate area 321 of the second motherboard 320 includes a sealant area 322 , a display area 327 surrounded by the frame area 322 , and a peripheral circuit area 324 adjacent to the frame area 322 . The area of the sealant setting area 322 and the display area 327 are the same as the size of the sub-substrate area 311 of the first motherboard 310 .

There is a one-to-one correspondence between the sub-substrate regions 311 of each first mother substrate 310 and the sub-substrate regions 321 of each second mother substrate 320, wherein the sub-substrate regions 321 of the second mother substrate 320 extend in a certain direction or in a certain direction. It is longer than the corresponding sub-substrate region 311 of the first mother substrate 310 in two directions.

In this embodiment, the first motherboard 310 and the second motherboard 320 have the same plane area. The sub-substrate region 311 and the sub-substrate region 321 have the same width in the horizontal X direction and different lengths in the horizontal Y direction. The distance from the sub-substrate region 311 closest to the edge of the first mother substrate 310 to two adjacent edges is the same as the distance from the sub-substrate region 321 closest to the edge of the second mother substrate 320 to two adjacent edges. It can be understood that the cutting area 313 of the first mother substrate 310 is larger than the cutting area 323 of the second mother substrate 320 by an area of the peripheral circuit area 324 .

Step S22 , pasting the first anti-corrosion adhesive 325 on the peripheral circuit area 324 of the sub-substrate area 320 of the second mother substrate 320 . The peripheral circuit area 324 may be an area where the driver chip will be bound in the future. The step S22 is specifically as follows.

First, referring to FIG. 3 and FIG. 4 together, a frame glue 326 is coated or printed on the frame glue setting area 322 of each sub-substrate area 321 on the surface of the second mother substrate 320 .

The sealant 326 can be a heat-curable material or a light-curable material, which can be cured under heat, pressure or light irradiation. A plurality of receiving spaces 328 enclosed by each of the plastic frames 326 and the second motherboard 320 are used for receiving liquid crystal molecules in subsequent manufacturing steps. In this embodiment, the sealant 326 is made of thermosetting material.

Secondly, a step of affixing the first anti-corrosion glue 325 on the peripheral circuit area 324 is also included while or after the sealant printing step on the second motherboard 320 , see FIG. 4 . The setting steps of the first anti-corrosion glue 325 are the same or similar to the setting steps of the sealant 326 , and can be manufactured by coating or printing. The material of the frame glue 326 and the first anticorrosion glue 325 can be selected from the same material, but a gap is reserved between them during installation to facilitate the removal of the first anticorrosion glue 325 in subsequent manufacturing steps. In addition, the first anti-corrosion glue 325 can also be peelable glue. For example, the models of Taiwan Lianzhi Technology Co., Ltd. are TPM-300HF, TPM-300HF XX800 peelable adhesives.

Finally, after the step of coating or printing a sealant 326 in each sub-substrate region 321 on the surface of the second mother substrate 320 or the step of attaching the first anti-corrosion glue 325 in the peripheral circuit region 324, it is included in the receiving space The step of instilling liquid crystal 329 in 328 is shown in FIG. 5 .

Step S23, the first mother substrate 310 and the second mother substrate 320 are aligned and bonded, the sub-substrate regions 311 and 321 of the first mother substrate 310 and the second mother substrate 320 are laminated and aligned, and the first The anticorrosion glue 325 is located between the first motherboard 310 and the second motherboard 320 . The step S23 is specifically as follows.

Please refer to Figure 6 and Figure 7. First, the surface of the first mother substrate 310 provided with the color filter and the surface of the second mother substrate 320 coated/printed with the sealant 326 face each other and align up and down, and make the first mother substrate The sub-substrate region 311 of the substrate 310 is opposite to the frame glue setting region 322 and the display region 327 of the sub-substrate region 321 of the second mother substrate 320 respectively.

Next, pressurize and heat the first mother substrate 310 or the first mother substrate 310 and the second mother substrate 320, so that the frame glue 326 and the first anticorrosion glue 325 are cured, so that the first mother substrate 310 and the second mother substrate 320 are cured. The second motherboard 320 is in close contact with each other.

Finally, see Figure 8. Attaching/coating/printing second anti-corrosion glue 319 on the side of the first mother substrate 310 away from the second mother substrate 320 to respectively cover the sub-substrate regions 311 of the first mother substrate 310, wherein the first mother substrate 310 The cutting area 313 is exposed. The materials of the second anticorrosion glue 319 and the first anticorrosion glue 325 can be selected from the same material, which are both peelable glues. And after the second anticorrosion glue 319 is pasted, the first substrate is heated and pressurized to cure the second anticorrosion glue 319 .

Alternatively, the curing processes of the frame glue 326 , the first anticorrosion glue 325 and the second anticorrosion glue 319 can be implemented simultaneously to reduce the influence on the liquid crystal molecules.

Step S24 , using the cutting fluid 501 to etch the cutting area 313 from the side of the first mother substrate 310 away from the second mother substrate 320 to separate the first mother substrate 310 and the sub-substrate regions of the second mother substrate 320 . The step S24 is specifically as follows.

First, please refer to FIG. 9 , along the cutting area 313 of the first mother substrate 310, a cutting fluid 501 is provided with a nozzle 500, and the cutting fluid 500 corrodes the cutting area 313 of the first mother substrate 310, and is formed in the holes formed after etching. Drops are poured onto the cutting area 323 of the second mother substrate 320 , as shown in FIG. 10 , until the two adjacent sub-substrate regions 311 , 321 in each of the first mother substrate 310 and the second mother substrate 320 are separated.

Then, edge grinding is performed on the edges of the sub-substrate regions 311 and 321 of the first mother substrate 310 and the second mother substrate 320 , specifically, the edges of the sub-substrate regions 311 and 321 can be ground using a numerically controlled processing machine.

Finally, the first anticorrosion glue 325 and the second anticorrosion glue 319 are removed.

The cutting fluid 500 in this embodiment is a high-strength acid, hydrofluoric acid (HF). Preferably, the frame glue 326 is also made of an anti-corrosion glue material to prevent the cutting fluid 500 from corroding the display area 327 .

Compared with the prior art, in the liquid crystal panel manufacturing method of the present invention, the cutting liquid 500 is used to corrode the cutting regions 313 and 323, thereby completing the separation of the sub-substrate regions in the first mother substrate 310 and the second mother substrate 320, then the In the process, there is no debris splashing on the first mother substrate 310 and the second mother substrate 320, and it is not affected by the depth of the cutter wheel scoring, so the area of each sub-substrate in the first mother substrate 310 and the second mother substrate 320 The separation effect is better. Further, under the protection of the first anticorrosion glue 325 and the second anticorrosion glue 319, the sub-substrate regions 311, 321, that is, the liquid crystal panel in each product will not be corroded by the cutting fluid 500, and the quality of the liquid crystal panel is better. . In addition, the step of attaching the second anticorrosion glue 315 on the first mother substrate 310 can be performed simultaneously with the step of attaching the first anticorrosion glue 325 on the second mother substrate 320 .

It can be understood that the above liquid crystal panel manufacturing method is also applicable to the manufacture of other substrates. For example, a touch substrate with a two-layer structure. Please refer to FIG. 15 , the specific manufacturing method of the substrate includes the following steps.

Step S31, providing a first mother substrate 410 and a second mother substrate 420, each of the first mother substrate 410 and the second mother substrate 420 respectively defines a plurality of sub-substrate regions 411 and 421, which are located on two adjacent sides of the same mother substrate 410 and 420 The regions between the sub-substrate regions 411 and 421 are cutting regions 413 and 423 , and the cutting regions 413 and 423 of each of the first mother substrate 410 and the second mother substrate 420 correspond to each other one-to-one. The steps are as follows.

First, referring to FIG. 12 , a first mother substrate 410 and a second mother substrate 420 are manufactured. Each of the first mother substrate 410 and the second mother substrate 420 defines a plurality of sub-substrate regions 411 and 421 respectively, which are located on the same mother substrate 410 and The area between two adjacent sub-substrate areas 411 and 421 of 420 is the cutting area 413 and 423 . In this embodiment, the length and width of the first motherboard 410 and the second motherboard 420 are the same. The two sub-substrate regions 411 and 421 have the same length and width. The cutting regions 413 and 423 located on the first mother substrate 410 and the second mother substrate 420 have the same length and width.

Then, referring to FIG. 13 , patterns 419 and 429 are disposed in the two sub-substrate regions 411 and 421 of the first mother substrate 410 and the second mother substrate 420 . When the sub-substrate regions 411 and 421 are used to manufacture a touch substrate, the patterns 419 and 429 may be metal traces.

Step S32 , pasting the first anti-corrosion adhesive 425 on the sub-substrate region 423 of the second mother substrate 420 . See Figure 14.

At the same time, after or before this step, attaching a second anti-corrosion adhesive 415 to the first mother substrate 410 to respectively cover the sub-substrate regions 413 of the first mother substrate 410 , wherein the cutting region 413 of the first mother substrate 410 is exposed.

Step S33, aligning the two mother substrates 410, 420 so that the sub-substrate regions 411, 421 of the first mother substrate 410 and the second mother substrate 420 are laminated and aligned, and the first anti-corrosion adhesive 425 is located on the Between the first motherboard 410 and the second motherboard 420 . Please refer to Figure 15 and Figure 16.

In this step, if the first anti-corrosion glue 425 and the second anti-corrosion glue 415 need to be cured, it is necessary to heat and pressurize the first mother substrate 410 and the second mother substrate 420 to make the first anti-corrosion glue 425 and the second anti-corrosion glue 415 curing steps.

Step S34 , using the cutting fluid 601 to etch the cutting regions 413 and 423 from the side of the first mother substrate 410 away from the second mother substrate 420 to complete the separation of the sub-substrate regions 411 , 421 in the two mother substrates 410 , 420 .

The cutting fluid 601 may be hydrofluoric acid. The first anti-corrosion glue 425 and the second anti-corrosion glue 415 can use peelable glue.

Claims (21)

1. A method for manufacturing a liquid crystal panel, comprising the following steps: providing a first mother substrate and a second mother substrate, each of the first mother substrate and the second mother substrate defines a plurality of sub-substrate regions respectively, and is located on the adjacent side of the same mother substrate The area between the two sub-substrate areas is a cutting area, and the sub-substrate areas of the first mother substrate and the second mother substrate correspond to each other one-to-one, wherein the sub-substrate area of the second mother substrate is larger than the corresponding sub-substrate of the first mother substrate Area, to set the peripheral circuit area in the large part; paste the first anti-corrosion glue on the peripheral circuit area; align and bond the two mother substrates, so that the first mother substrate and the sub-substrate area of the second mother substrate and the first anti-corrosion adhesive is located between the first mother substrate and the second mother substrate; use cutting fluid to etch the cutting area from the side of the first mother substrate far away from the second mother substrate to complete two Separation of each sub-substrate area in the mother substrate. 2. The liquid crystal panel manufacturing method according to claim 1, wherein the first mother substrate is a color filter mother substrate, the second mother substrate is a thin film transistor array mother substrate, and the sub-substrate of the second mother substrate The area includes a sealant setting area, a display area surrounded by the sealant setting area, and the peripheral circuit area adjacent to the sealant setting area. 3. The liquid crystal panel manufacturing method as claimed in claim 2, characterized in that: using cutting liquid to corrode the cutting area from the side away from the second mother substrate of the first mother substrate to complete the formation of each sub-substrate area in the two mother substrates The step of separating includes attaching a second anti-corrosion glue to the side of the first mother substrate away from the second mother substrate to respectively cover the sub-substrate regions of the first mother substrate, wherein the cutting region of the first mother substrate is exposed. 4. The liquid crystal panel manufacturing method according to claim 3, characterized in that: on the side away from the second mother substrate to the first mother substrate, a second anti-corrosion glue is pasted to cover the sub-substrates of the first mother substrate respectively After the step of the region, it includes the step of heating and pressurizing the first mother substrate and the second mother substrate to cure the first anticorrosion glue and the second anticorrosion glue. 5. The method for manufacturing a liquid crystal panel according to claim 1 or 4, wherein the cutting fluid is hydrofluoric acid. 6. The method for manufacturing a liquid crystal panel according to claim 1 or 4, wherein the first anti-corrosion adhesive or the first anti-corrosion adhesive and the second anti-corrosion adhesive are peelable adhesives. 7. The liquid crystal panel manufacturing method as claimed in claim 6, characterized in that: using cutting liquid to corrode the cutting area from the side away from the second mother substrate of the first mother substrate to complete the sub-substrate regions in the two mother substrates After the step of separating, the step of edging the edges of the sub-substrate regions of the first mother substrate and the second mother substrate and the step of removing the first anti-corrosion glue or removing the first anti-corrosion glue and the second anti-corrosion glue are also included. 8. The method for manufacturing a liquid crystal panel according to claim 1, characterized in that: prior to or simultaneously with the step of attaching the first anti-corrosion glue to the peripheral circuit area, the first mother substrate or the second mother substrate is attached to one of the mother substrates. The step of sealant printing in the area of the sub-substrate. 9. The liquid crystal panel manufacturing method according to claim 8, wherein the first mother substrate is a color filter mother substrate, the second mother substrate is a thin film transistor array mother substrate, and the sub-substrate of the second mother substrate The area has a frame glue setting area, a display area surrounded by the frame glue setting area, and the peripheral circuit area adjacent to the frame glue setting area; the frame glue is applied to one of the first mother substrate or the second mother substrate The step of printing is carried out in the frame glue setting area of the second mother substrate. 10. The liquid crystal panel manufacturing method as claimed in claim 9, characterized in that: after the step of attaching the first anti-corrosion glue to the peripheral circuit area of the second mother substrate, it also includes dripping liquid crystal in the frame glue area step. 11. The liquid crystal panel manufacturing method as claimed in claim 9, characterized in that: using cutting liquid to corrode the cutting area from the side away from the second mother substrate of the first mother substrate to complete the sub-substrate regions in the two mother substrates Before the step of separating, it includes attaching a second anti-corrosion adhesive to the side of the first mother substrate away from the second mother substrate to respectively cover the sub-substrate regions of the first mother substrate, wherein the cutting region of the first mother substrate is exposed. 12. The liquid crystal panel manufacturing method according to claim 11, characterized in that: a second anti-corrosion glue is pasted on the side of the first mother substrate away from the second mother substrate to cover the sub-substrates of the first mother substrate respectively After the step of exposing the cutting area, it also includes the steps of heating the two mother substrates, pressurizing the frame glue, the first anticorrosion glue and the second anticorrosion glue to cure. 13. A method for manufacturing a substrate, comprising the following steps: providing a first mother substrate and a second mother substrate, each of the first mother substrate and the second mother substrate respectively defines a plurality of sub-substrate regions, located adjacent to the same mother substrate The area between the two sub-substrate areas is a cutting area, and the cutting areas of each first mother substrate and the second mother substrate are in one-to-one correspondence; the first anti-corrosion glue is pasted on the sub-substrate area of the second mother substrate; the two Aligning the mother substrates so that the first mother substrate and the sub-substrate regions of the second mother substrate are stacked and aligned, and the first anti-corrosion glue is located between the first mother substrate and the second mother substrate; cutting fluid is used The cutting area is etched from the side of the first mother substrate away from the second mother substrate to complete the separation of the regions of the sub-substrates in the two mother substrates. 14. The substrate manufacturing method according to claim 13, characterized in that: before the step of attaching the first anti-corrosion adhesive to the sub-substrate area of the second mother substrate, the step of setting a pattern on the sub-substrate area of the second mother substrate is included . 15. The substrate manufacturing method according to claim 14, wherein the pattern is a metal trace. 16. The substrate manufacturing method according to claim 13, characterized in that: before the step of affixing the first anti-corrosion adhesive to the sub-substrate region of the second mother substrate, the step of setting a pattern on the sub-substrate region of the first mother substrate is included . 17. The substrate manufacturing method according to claim 16, wherein the pattern is a metal trace. 18. The substrate manufacturing method according to claim 16, characterized in that: using cutting fluid to etch the cutting area from the side of the first mother substrate away from the second mother substrate to complete the separation of the sub-substrate regions in the two mother substrates Before the step, it also includes attaching a second anti-corrosion glue to the side of the first mother substrate away from the second mother substrate to respectively cover the sub-substrate areas of the first mother substrate, wherein the cutting area of the first mother substrate is exposed. 19. The substrate manufacturing method according to claim 18, characterized in that: using cutting fluid to etch the cutting area from the side of the first mother substrate away from the second mother substrate to complete the separation of the sub-substrate regions in the two mother substrates Before the step, and attaching a second anti-corrosion adhesive to the side of the first mother substrate away from the second mother substrate to respectively cover the sub-substrate area of the first mother substrate, wherein the cutting area of the first mother substrate is exposed after the step It also includes the step of heating and pressurizing the first mother substrate and the second mother substrate to cure the first anticorrosion glue and the second anticorrosion glue. 20. The substrate manufacturing method as claimed in claim 13, wherein the cutting fluid is hydrofluoric acid. 21. The substrate manufacturing method according to claim 13 or 18, wherein the first anti-corrosion adhesive or the first anti-corrosion adhesive and the second anti-corrosion adhesive are peelable adhesives.