CN104459997A - MEMS tunable optical driver and manufacturing method - Google Patents
MEMS tunable optical driver and manufacturing method Download PDFInfo
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- CN104459997A CN104459997A CN201410715610.XA CN201410715610A CN104459997A CN 104459997 A CN104459997 A CN 104459997A CN 201410715610 A CN201410715610 A CN 201410715610A CN 104459997 A CN104459997 A CN 104459997A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title abstract description 3
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 230000005855 radiation Effects 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000001020 plasma etching Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 18
- 238000006073 displacement reaction Methods 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract 7
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 230000006835 compression Effects 0.000 description 11
- 238000007906 compression Methods 0.000 description 11
- 238000005538 encapsulation Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000013003 hot bending Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
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Abstract
The invention relates to an MEMS tunable optical driver and a manufacturing method of the MEMS tunable optical driver. The MEMS tunable optical driver comprises a substrate, a main deformation beam, a first deformation beam, a second deformation beam, drive electrodes, a micro-mirror, a heat dissipation frame structure, a heat dissipation folding beam and an external fixing point, and is characterized in that the first deformation beam and the second deformation beam provide bottom deformation supporting for the main deformation beam, the heat dissipation frame structure is isolated from the micro-mirror, and a folding beam heat dissipation structure is connected with a heat dissipation frame and the external fixing point. The design structure that the deformation beams are straightly pulled and pressed is adopted, the main deformation beam is supported, the instability of a traditional bent beam is avoided, and the larger thermal drive displacement is achieved. Meanwhile, the design of the heat dissipation frame and the heat dissipation folding beam is adopted, the micro-mirror does not make directly contact with the deformation beams, the influences of thermal changes on the temperature of the micro-mirror are reduced, and the reliability of devices is improved. Due to the adoption of the MEMS design, the compact optical attenuator packaging can be achieved.
Description
Technical field
The present invention relates to a kind of MEMS optical drive and method for making, particularly the MEMS tunable optical attenuation device of a kind of miniaturization, high reliability.
Background technology
Under the background that global high-speed wideband develops on a large scale, high-speed communication broadband plays a part more and more important in socio-economic development.Along with the swift and violent growth of large data and various communication service in recent years, novel intelligent high speed optical communication network enters the fast-developing stage.The light signal of intelligent high-speed optical communication network in order to realize that it is intelligent, in the net control of dynamic-tuning, have employed large quantities of photoelectron function element with module to improve its intellectuality and dynamic-tuning level.Simultaneously in order to realize the miniaturization of the network equipment and integrated, higher requirement be there has also been to the size of optoelectronic device, integrated and reliability.Therefore miniaturization, dynamically optical device that is adjustable and high reliability become Primary Component indispensable in Novel photo-communication network.
Optics adjustable attenuator (Variable Optical Attenuator, VOA) is a kind of optical path signal control device, and in optical communication network, major function is used for the decay of light signal strength, and the overload protection etc. of optical device.Simultaneously along with the optical-fiber network information requirements that data center is a large amount of, adjustable optical attenuator application is also more and more extensive.
Relative to traditional hand optical attenuator, the optical attenuator based on MEMS technology has fast response time, the advantage such as miniaturization and dynamic-tuning.Adjustable optical attenuator based on MEMS technology mainly contains two kinds of technical schemes: a kind of is the VOA device of the reflective encapsulation of light based on micromirror, and its couple variations utilizing the reflection angle reflected light signal of micromirror to form light signal realizes the decay of light signal.CN200410053563.3 discloses the quiet electrically driven (operated) reflective MEMS optical attenuator chip design of a kind of employing and method for making.The optical attenuator technical scheme of reflective encapsulation has low-power consumption, the advantages such as damping capacity is large, but its optical polarization is special and wavelength dependent characteristics is poor, and it needs to adopt reflective encapsulation, makes its optical path adjusting comparatively complicated.Another kind be based on micromirror move forward into traveling optical signal block type encapsulation VOA device, it utilizes the movement of micromirror to shelter from input and output light signal and realizes optical attenuation function.The index that its polarization of light-keeping-off type optical attenuator and wavelength are correlated with is better, and in encapsulation, optical path adjusting is also comparatively easy simultaneously.
In light-keeping-off type VOA device, utilize the thermal actuator of bent beam to move micromirror and carry out the mode that shading light signal is a kind of usual employing, its bent beam structure is delivered (Bent-beam electro-thermal actuators for high force application) by people such as L.que the earliest in MEMS ' 99 meeting of 1999, and its principle is that the thermal expansion caused after utilizing current flow heats girder construction produces displacement structure.Patent US6275320B1 proposes a kind of MEMS optical attenuator adopting simple thermal actuator to move minute surface, but this kind of thermal actuator volume is larger, the bent beam that wherein thermal actuator adopts directly is connected with micromirror, cause its minute surface to be easily influenced by heat and produce the loss of temperature correlation, reduce its device reliability; Simultaneously traditional bent beam thermal actuator in use easily exists toward the contrary non-steady state of direction of motion, thus causes the instability of thermal actuator, in use there is integrity problem.
In order to meet the miniaturization of present sun adjuster part and the more and more higher requirement of device reliability, present applicant has proposed a kind of VOA device package scheme of compact, application number is CN201310744255.4 and CN201320881770.2.In order to coordinate this encapsulation scheme, applicant also once proposed the MEMS VOA optical drive chip design scheme of a kind of thermal drivers closely and high reliability.
Summary of the invention
For the problems referred to above, the object of this invention is to provide a kind of MEMS tunable optical driver chip structure, it is characterized in that, it comprises substrate, main transformer ellbeam, the first variable shaped beam, the second variable shaped beam, drive electrode, micromirror, heat-dissipating frame structure, heat radiation folded beam and external stability point, it is characterized in that described first variable shaped beam and the second variable shaped beam are positioned at main transformer ellbeam two ends, be connected with drive electrode, for main transformer ellbeam provides the deformation of bottom of straight pull and vertical compression to support; Described heat-dissipating frame structure is connected with main transformer ellbeam but isolates with micromirror, and described folded beam radiator structure is connected with heat-dissipating frame and external stability point.
Such scheme, adopts the first and second variable shaped beams of novel straight pull and vertical compression as the bottom support of main transformer ellbeam and distressed structure, avoids traditional thermal drivers beam and in use produce rightabout non-steady state, add the reliability of optical device.Meanwhile, the first variable shaped beam and second variable shaped beam of straight pull and vertical compression also produce thermal expansion when thermal drivers, can increase the deflection of main transformer ellbeam simultaneously, when not increasing integral device size, can realize the object increasing displacement simultaneously.Heat-dissipating frame structure and variable shaped beam carry out being connected and isolating with micromirror, this greatly reduces the impact of variable shaped beam thermal distortion on micromirror, reduce the optical attenuator temperature correlation loss that micromirror causes, improve optical property and the reliability of overall optical attenuator.The folded beam simultaneously connecting heat-dissipating frame both can improve heat sinking function, also can improve the anti-vibration characteristic of micromirror simultaneously.
Based on the straight pull and vertical compression variable shaped beam thermal actuator that the present invention proposes, also increase by two straight pull and vertical compression variable shaped beams can be changed to, it has similar V-type drives structure, increases different drive electrodes simultaneously, and this kind of design proposal will produce larger displacement deformation structure.
Described a kind of MEMS tunable optical driver chip adopts MEMS technology to make, and its basic making step is as follows:
1) prepare soi wafer as substrate, first make thermal actuator and micro mirror structure at the device layer of SOI;
2) plasma etching industrial front on device layer is adopted to make thermal drivers and micro mirror structure;
3) at the making back side, the back side releasing structure figure of soi wafer, utilize silicon color sensor technology carry out deep etching silicon layer and remove silicon dioxide layer, complete structure release;
4) finally make metallic diaphragm in micromirror and electrode zone, form drive electrode and minute surface.
Compared with prior art, the thermal actuator of this chip of the present invention is novel in design, have employed the variable shaped beam project organization of straight pull and vertical compression, supports, avoid the instability of conventional bending beam simultaneously to main thermal change ellbeam, and realizes larger drive displacement.Meanwhile, adopt the design of heat-dissipating frame and heat radiation folded beam that micromirror can not directly be contacted with variable shaped beam, the thermal distortion reducing variable shaped beam place affects the temperature correlation of micromirror, adds the device reliability of chip and optical attenuator.Owing to have employed MEMS design and compact thermal drivers principle, the chip of design can realize optical attenuator encapsulation closely.
Accompanying drawing explanation
Fig. 1 is embodiment of the present invention structural representation.
Fig. 2 is variable shaped beam thermal actuator schematic diagram in another embodiment of the present invention.
Fig. 3 is the heat-dissipating frame structural representation increasing heat radiator in another embodiment of the present invention.
Fig. 4 is the embodiment of the present invention 1 manufacture craft procedure structure diagrammatic cross-section.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are elaborated: the present invention premised on the preferred embodiment provided under implement, give detailed embodiment and concrete operating process, but protection scope of the present invention is not limited to following embodiment.Accompanying drawing of the present invention is signal reference diagram, should not be considered to the proportionate relationship strictly reflecting physical dimension, also should not be considered to limit the scope of the invention.
Fig. 1 is embodiment of the present invention planar structure schematic diagram, and the MEMS optical drive chip of the present embodiment comprises substrate (not indicating in figure), variable shaped beam 1, variable shaped beam 2, variable shaped beam 3, drive electrode 4, micromirror 5, heat-dissipating frame 6, heat radiation folded beam 7 and external stability point 8.Described variable shaped beam 1 and variable shaped beam 3 are as the bottom support of variable shaped beam 2 and distressed structure, connect with drive electrode 4, when carrying out thermal drivers distortion, variable shaped beam 1 and variable shaped beam 3 pairs of variable shaped beams 2 provide the deformable supports of straight pull and vertical compression, increase the deformation quantity of whole variable shaped beam 2, such as when straight pull and vertical compression variable shaped beam 1 and variable shaped beam 3: long 500um, wide 5um, between bent beam 2 liang of stiff ends during spacing 1500um, the thermal drivers model of straight pull and vertical compression variable shaped beam can increase by the displacement of 20 ~ 30% than traditional hot bending curved beam.
Described micromirror 5 is fixed in heat-dissipating frame 6 and heat radiation folded beam 7, isolate with thermal drivers variable shaped beam 2, the thermal distortion avoided on variable shaped beam produces the temperature correlation loss of micromirror, framework overall long 350um, high 500um, framework deck-siding 10um is designed and sized to when heat-dissipating frame 6, thickness 22um, micromirror 5 size, when 380umx100um length and width, utilizes the area of dissipation that it increases, and can reduce temperature about 50 degree in micromirror; Described folded beam 7 is connected with heat-dissipating frame 6, and folded beam 7 is also connected with external stability point 8 simultaneously, can further improve micromirror radiating effect, such as, the long 300um of design folded beam 7, wide 5um, and there is repeatedly foldover design, temperature can be produced and reduce about 20 degree.Folded beam 7 also can improve the anti-vibration characteristic of micromirror 5 simultaneously.
Alternatively, in another embodiment, the variable shaped beam structure of described MEMS optical drive chip also can be changed to structure as shown in Figure 2, two straight pull and vertical compression variable shaped beams 9 and variable shaped beam 10 is increased again at main transformer ellbeam two ends, make it have similar V-type drives structure, increase different drive electrodes, its internal current structure is as shown in shown by arrow, and this kind of design proposal will produce larger displacement deformation structure simultaneously.
Alternatively, in another embodiment, the heat-dissipating frame structure of described MEMS optical drive chip also can be changed to structure as shown in Figure 3, and described heat-dissipating frame can also arrange many heat radiation silicon beam Y further to improve area of dissipation further at two ends.Such as, as the long 100um of heat radiation beam Y, wide 5um, thick 22um, quantity at about 10 ~ 40, can realize radiating effect more better than the frame that dispels the heat separately.
Be below the preparation method of MEMS optical drive chip of the present invention, as shown in Figure 4, it mainly comprises the following steps:
S1: prepare soi wafer as substrate, first at the device layer coating photoresist of SOI, exposure makes thermal actuator and micro mirror structure;
S2: adopt plasma etching industrial front on device layer to make thermal drivers and micro mirror structure, and remove photoresist layer;
S3: at the backside coating photoresist of soi wafer, exposure makes back side releasing structure figure; Utilize plasma etching technology deep etching silicon layer to the buried oxide layer of soi wafer, and remove silicon dioxide layer and photoresist, complete structure release;
S4: finally make metallic diaphragm in micromirror and electrode area surfaces, complete minute surface and electrode.
In sum, the present invention has the following advantages:
1. thermal actuator is novel in design.The thermal actuator of this chip is novel in design, have employed the variable shaped beam project organization of straight pull and vertical compression, supports, avoid the instability of conventional bending beam simultaneously to main thermal change ellbeam, and realizes larger drive displacement.
2. increase the chip reliability of thermal actuator.The design of heat-dissipating frame and heat radiation folded beam makes micromirror directly to contact with variable shaped beam, and the thermal distortion reducing variable shaped beam place affects the temperature correlation of micromirror, adds the device reliability of chip and optical attenuator.
3. volume is little.Owing to have employed MEMS design and compact thermal drivers principle, the VOA chip of design can realize optical attenuator encapsulation closely.
Although the present invention with preferred embodiment openly as above; but it is not for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; the Method and Technology content of above-mentioned announcement can be utilized to make possible variation and amendment to technical solution of the present invention; therefore; every content not departing from technical solution of the present invention; the any simple modification done above embodiment according to technical spirit of the present invention, equivalent variations and modification, all should not get rid of outside protection scope of the present invention.
Claims (5)
1. a MEMS can harmony optical drive chip and method for making, described chip comprises: substrate, drive electrode, variable shaped beam, micromirror and heat-dissipating frame, wherein, the two ends of variable shaped beam are connected with drive electrode, described micromirror is arranged in heat-dissipating frame, described heat-dissipating frame is connected with the center section stress point of main transformer ellbeam, characterized by further comprising quantity and be at least 2n(n>0) brace summer, described brace summer two two places are connected with drive electrode, thus form supporting construction between variable shaped beam and drive electrode.
2. MEMS according to claim 1 can harmony optical drive chip, it is characterized in that, also comprise heat radiation folded beam and external stability point, described heat radiation folded beam one end is connected with heat-dissipating frame, and the other end is connected on external stability point.
3. MEMS according to claim 1 and 2 can harmony optical drive chip, it is characterized in that, wherein heat-dissipating frame is also provided with many heat radiation silicon beams in outside.
4. MEMS according to claim 3 can harmony optical drive chip, it is characterized in that, the quantity of the silicon beam that wherein dispels the heat is 10 ~ 40.
5. preparing MEMS according to any one of claim 1-5 can the method for harmony optical drive chip, it is characterized in that comprising the following steps:
1) prepare soi wafer as substrate, first make thermal actuator and micro mirror structure at the device layer of SOI;
2) plasma etching industrial front on device layer is adopted to make thermal drivers and micro mirror structure;
3) at the making back side, the back side releasing structure figure of soi wafer, utilize silicon color sensor technology carry out deep etching silicon layer and remove silicon dioxide layer, complete structure release;
4) finally make metallic diaphragm in micromirror and electrode zone, form drive electrode and minute surface.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105353469A (en) * | 2015-09-10 | 2016-02-24 | 深圳市盛喜路科技有限公司 | Manufacture method of optical attenuator array and optical attenuator array |
| CN107607210A (en) * | 2017-09-28 | 2018-01-19 | 东南大学 | A kind of temperature sensor based on metamaterial structure |
| CN109635423A (en) * | 2018-12-10 | 2019-04-16 | 东南大学 | A kind of flexible MEMS device V-type girder construction mechanics Dynamic Model method |
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| CN109635423A (en) * | 2018-12-10 | 2019-04-16 | 东南大学 | A kind of flexible MEMS device V-type girder construction mechanics Dynamic Model method |
| CN109635423B (en) * | 2018-12-10 | 2023-02-21 | 东南大学 | A dynamic model analysis method for V-beam structure mechanics of flexible MEMS devices |
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Effective date of registration: 20180503 Address after: 215000 513, room 20, Nanbei Town, 99 Suzhou Jinji Road, Suzhou Industrial Park, Jiangsu. Applicant after: SUZHOU SHENGWEI XIN TECHNOLOGY CO.,LTD. Address before: 518000 A, 22A.B.Cb.Ca.D.E-E-8, office building of Silver Garden, West Red Li Road, Futian District, Shenzhen, Guangdong. Applicant before: Shenzhen Shengxi Road Technology Co.,Ltd. |
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