CN104470198A - Laminar structure of flexible and rigid PCBs less than four in layer number - Google Patents
Laminar structure of flexible and rigid PCBs less than four in layer number Download PDFInfo
- Publication number
- CN104470198A CN104470198A CN201410687324.7A CN201410687324A CN104470198A CN 104470198 A CN104470198 A CN 104470198A CN 201410687324 A CN201410687324 A CN 201410687324A CN 104470198 A CN104470198 A CN 104470198A
- Authority
- CN
- China
- Prior art keywords
- laminar structure
- inner layer
- copper
- flexible
- flexible inner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000003071 polychlorinated biphenyls Chemical class 0.000 title abstract 4
- 239000003292 glue Substances 0.000 claims description 27
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052802 copper Inorganic materials 0.000 abstract description 11
- 239000010949 copper Substances 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000002994 raw material Substances 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 5
- 239000003814 drug Substances 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 238000003475 lamination Methods 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract description 2
- 238000005553 drilling Methods 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 7
- 238000002203 pretreatment Methods 0.000 description 5
- 241001074085 Scophthalmus aquosus Species 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000003325 tomography Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a laminar structure of flexible and rigid PCBs less than four in layer number. The laminar structure comprises flexible inner layer core boards, single-side FR4 copper-clad plates, pure gum and covering films. According to the laminar structure, the flexible inner layer core boards serve as centers, the upper side and the lower side of each flexible inner layer core board are each sequentially provided with the corresponding single-side FR4 copper-clad plate and the corresponding pure gum from outside to inside, and the covering films are only arranged on the upper side and the lower side of the outer edge part of each flexible inner layer core board and extend inwards by a certain distance. The laminar structure has the advantages that after the covering films, at flexible PCBs, of rigid PCBs are removed, the fretting rates of liquid medicine are basically identical during gum residue removal, and the problem of hole copper faultage is solved; in the lamination process, the pure gum is injected to the spaces between lines, the thicknesses of pure gum layers between inner layer copper sides and FR4 decrease, the drilling pollution probability is reduced during drilling, and the problem of plating nodules is solved. The defects are solved, so that the yield of products is greatly increased, raw materials are saved, production cost is lowered, and production efficacy is improved.
Description
Technical field
The present invention relates to wiring board production field, particularly a kind of laminar structure of less than four layers Rigid Flexs.
Background technology
Existing less than four layers (containing four layers) Rigid Flexs production in, gas producing formation laminated structure is concrete as shown in Figure 1, its flexible board all posts coverlay, and connects soft, hardboard with pure glue as bridging agent.In actual production, because pure glue thickness can not control, such structure also exists following defect: if 1 pure glue thickness is too thin, then product easily occurs cavity; If 2 pure glue thickness are too thick, more brill can be left in the cavity of so postorder boring dirty, copper knurl can be formed in cavity.In addition, in the de-smear operation of postorder, due to liquid medicine to coverlay and pure glue sting erosion speed differ to, easily make product not plan a successor, causing hole is non-conductive.
Above-mentioned problem happens occasionally aborning, causes product defective, affects the yields of product.Substandard product can only be discarded, and waste raw material, reduce production efficiency.Therefore be badly in need of a kind ofly will to solve the way connecting rigid-flex defect with pure glue.
Summary of the invention
Goal of the invention: for the problems referred to above, the object of this invention is to provide and a kind ofly effectively can solve the laminar structure easily producing boring copper knurl and boring copper face tomography defect by less than the four layers rigid-flex that pure glue does bridging agent.
Technical scheme: a kind of laminar structure of less than four layers soft hard board plywood, comprise flexible inner layer central layer, one side FR4 copper-clad plate, pure glue, coverlay, laminar structure is specifically centered by described flexible inner layer central layer, upper and lower faces is followed successively by described one side FR4 copper-clad plate, described pure glue from outside to inside, described coverlay is only arranged on the upper and lower faces of the peripheral rim portion of described flexible inner layer central layer, and the certain distance that extends internally.
Further, described pure glue can be epoxide-resin glue, is used for connecting soft board and hardboard.
Further, the distance that described coverlay extends internally is 0.5 millimeter, to guarantee that internal wiring does not expose.
Beneficial effect: compared with prior art, advantage of the present invention is: after being removed by the coverlay on hardboard place soft board, and during de-smear, to sting erosion speed basically identical for liquid medicine, solves hole copper tomography problem; In the process of lamination, pure glue is filled in the middle of circuit, makes the pure bondline thickness between internal layer copper face and FR4 thinning, and brill when decreasing boring is dirty, solves copper knurl problem in hole.The solution of these defects, substantially increases the yields of product, has saved raw material, has reduced production cost, improve production efficiency.
Accompanying drawing explanation
Fig. 1 is the laminar structure schematic diagram of existing Rigid Flex;
Fig. 2 is structural representation of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, illustrate the present invention further, these embodiments should be understood only be not used in for illustration of the present invention and limit the scope of the invention, after having read the present invention, the amendment of those skilled in the art to the various equivalent form of value of the present invention has all fallen within the application's claims limited range.
As shown in Figure 2, a kind of laminar structure of less than four layers Rigid Flexs, is made up of flexible inner layer central layer 1, one side FR4 copper-clad plate 2, pure glue 3, coverlay 4.During production, first according to following technological process, pre-treatment is carried out to raw material.Flexible inner layer central layer 1: sawing sheet, boring, internal layer pre-treatment, press dry film, exposure, DES, AOI, internal layer pre-treatment, paste CVL, pressing, baking, target punching, alligatoring, turn pressing; One side FR4 copper-clad plate 2: sawing sheet, deburring, processing (pasting pure glue), cold pressing, groove milling, turn pressing; Pure glue 3: sawing sheet, turn processing; Intermediate layer coverlay 4: sawing sheet, hole, window, turn pressing; Bottom coverlay 4: sawing sheet, hole, turn pressing.
Treat that raw material pre-treatment completes, raw material synthesize required flexible inner layer central layer 1, one side FR4 copper-clad plate 2, pure glue 3, coverlay 4, carry out lamination.In order to make pure glue 3 better and one side FR4 copper-clad plate 2 fit, epoxide-resin glue selected by pure glue 3.
During pressing, the raw material through pre-treatment is stacked according to following structure: laminar structure is specifically centered by described flexible inner layer central layer 1, and upper and lower faces is followed successively by one side FR4 copper-clad plate 2, pure glue 3 from outside to inside.Compared with existing structure, coverlay 4 is only arranged on the upper and lower faces of the peripheral rim portion of flexible inner layer central layer 1, and the distance of 0.5 millimeter of extending internally, make hardboard place soft board no longer to post coverlay 4, outside in turn ensure that internal layer circuit is not exposed to simultaneously.Such laminar structure, in bonding processes, pure glue is filled in the middle of circuit, makes pure glue 3 layer thickness between internal layer copper face 5 and one side FR4 copper-clad plate 2 thinning, and when decreasing follow-up boring, the brill produced in cavity is dirty, and then decreases the generation of copper knurl in boring; In addition, the region covered due to coverlay 4 is reduced, during follow-up de-smear, make liquid medicine liquid medicine to one side FR4 copper-clad plate 2 and pure glue 3 to sting erosion speed basically identical, the unlikely phenomenon that do not plan a successor, makes hole copper play the effect of conduction.
This kind of structure can improve product quality preferably, improves yields, yields thus before 30% be increased to 96%, effectively improve production efficiency, reduce production cost.
Claims (3)
1. the laminar structure of less than four layers Rigid Flexs, comprise flexible inner layer central layer (1), one side FR4 copper-clad plate (2), pure glue (3), coverlay (4), laminar structure is specifically centered by described flexible inner layer central layer (1), upper and lower faces is followed successively by described one side FR4 copper-clad plate (2), described pure glue (3) from outside to inside, it is characterized in that: described coverlay (4) is only arranged on the upper and lower faces of the peripheral rim portion of described flexible inner layer central layer (1), and the certain distance that extends internally.
2. the laminar structure of a kind of less than four layers Rigid Flexs according to claim 1, is characterized in that: described pure glue (3) can be epoxide-resin glue.
3. the laminar structure of a kind of less than four layers Rigid Flexs according to claim 1, is characterized in that: the distance that described coverlay (4) extends internally is 0.5 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410687324.7A CN104470198A (en) | 2014-11-25 | 2014-11-25 | Laminar structure of flexible and rigid PCBs less than four in layer number |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410687324.7A CN104470198A (en) | 2014-11-25 | 2014-11-25 | Laminar structure of flexible and rigid PCBs less than four in layer number |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104470198A true CN104470198A (en) | 2015-03-25 |
Family
ID=52915340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410687324.7A Pending CN104470198A (en) | 2014-11-25 | 2014-11-25 | Laminar structure of flexible and rigid PCBs less than four in layer number |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104470198A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219274A (en) * | 2018-09-13 | 2019-01-15 | 镇江华印电路板有限公司 | Four layers a kind of or less Rigid Flex and its production method |
| CN113905544A (en) * | 2021-10-25 | 2022-01-07 | 恒赫鼎富(苏州)电子有限公司 | A kind of process of semi-radium method for preparing flexible and rigid board |
| CN115243478A (en) * | 2022-08-02 | 2022-10-25 | 江西景旺精密电路有限公司 | A kind of manufacturing method of butterfly type flexible and rigid board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202425192U (en) * | 2012-01-12 | 2012-09-05 | 深圳市爱升精密电路科技有限公司 | Water-proof structure of rigid-flex circuit board |
| CN203057679U (en) * | 2012-12-28 | 2013-07-10 | 信利电子有限公司 | A circuit board combining a soft layer and hard layers |
| US20130213695A1 (en) * | 2012-02-21 | 2013-08-22 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing flying tail type rigid-flexible printed circuit board and flying tail type rigid-flexible printed circuit board manufactured by the same |
| CN204259273U (en) * | 2014-11-25 | 2015-04-08 | 镇江华印电路板有限公司 | A kind of laminar structure of less than four layers Rigid Flexs |
-
2014
- 2014-11-25 CN CN201410687324.7A patent/CN104470198A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202425192U (en) * | 2012-01-12 | 2012-09-05 | 深圳市爱升精密电路科技有限公司 | Water-proof structure of rigid-flex circuit board |
| US20130213695A1 (en) * | 2012-02-21 | 2013-08-22 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing flying tail type rigid-flexible printed circuit board and flying tail type rigid-flexible printed circuit board manufactured by the same |
| CN203057679U (en) * | 2012-12-28 | 2013-07-10 | 信利电子有限公司 | A circuit board combining a soft layer and hard layers |
| CN204259273U (en) * | 2014-11-25 | 2015-04-08 | 镇江华印电路板有限公司 | A kind of laminar structure of less than four layers Rigid Flexs |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219274A (en) * | 2018-09-13 | 2019-01-15 | 镇江华印电路板有限公司 | Four layers a kind of or less Rigid Flex and its production method |
| CN113905544A (en) * | 2021-10-25 | 2022-01-07 | 恒赫鼎富(苏州)电子有限公司 | A kind of process of semi-radium method for preparing flexible and rigid board |
| CN115243478A (en) * | 2022-08-02 | 2022-10-25 | 江西景旺精密电路有限公司 | A kind of manufacturing method of butterfly type flexible and rigid board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150325 |